Phase Formation and Phase Stability in the Al-Ti Thin Film System

1990 ◽  
Vol 213 ◽  
Author(s):  
L.R. Parks ◽  
D.A. Lilienfeld ◽  
P. BØRgesen ◽  
R. Raj
Keyword(s):  
Thin Film ◽  
Phase Stability ◽  
Rutherford Backscattering Spectrometry ◽  
Intermetallic Phases ◽  
Film System ◽  
X Ray Diffraction ◽  
X Ray ◽  
Annealing Temperatures ◽  
Thin Film System ◽  
Sequential Formation

ABSTRACTThis study focuses on the sequential formation of aluminide phases during annealing of titanium and aluminum thin film bilayers. The formation of titanium-rich intermetallic phases at higher annealing temperatures is emphasized. Using Rutherford Backscattering Spectrometry (RBS) analysis, and x-ray diffraction, phases formed as a function of temperature have been identified. The phases Al3Ti through Ti3Al were observed over the temperature range 450–750°C, where reaction with the SiO2 substrate occurred. All phases were present as discreet layers within the samples with several layered phases coexisting at the higher temperatures.

Quantitative Study of Al/W Interaction In Si/SiO2/W-Ti/Al Thin Film System

1988 ◽  
Vol 119 ◽  
Author(s):  
Hung-Yu Liu ◽  
Peng-Heng Chang ◽  
Jim Bohlman ◽  
Hun-Lian Tsai
Keyword(s):  
Thin Film ◽  
Film System ◽  
X Ray Diffraction ◽  
Compound Formation ◽  
X Ray ◽  
Thin Film System ◽  
Glancing Angle ◽  
Integrated Intensity ◽  
Al Thin Film ◽  
Kinetics Of

AbstractThe interaction of Al and W in the Si/SiO2/W-Ti/Al thin film system is studied quantitatively by glancing angle x-ray diffraction. The formation of Al-W compounds due to annealing is monitored by the variation of the integrated intensity from a few x-ray diffraction peaks of the corresponding compounds. The annealing was conducted at 400°C, 450°C and 500°C from 1 hour to 300 hours. The kinetics of compound formation is determined using x-ray diffraction data and verified by TEM observations. We will also show the correlation of the compound formation to the change of the electrical properties of these films.

Silicidation in Ni/Si thin film system investigated by X-ray diffraction and Auger electron spectroscopy

2007 ◽  
Vol 253 (8) ◽  
pp. 3799-3802 ◽  
Author(s):  
S. Abhaya ◽  
G. Amarendra ◽  
S. Kalavathi ◽  
Padma Gopalan ◽  
M. Kamruddin ◽  
...  
Keyword(s):  
Thin Film ◽  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Film System ◽  
X Ray Diffraction ◽  
X Ray ◽  
Thin Film System ◽  
Si Thin Film

Structural and Concentration Heterogeneities during Formation of Silicide Phases in the Thin Film System Ti(5nm)/Ni(24nm)/Si(001)

2013 ◽  
Vol 344 ◽  
pp. 79-84
Author(s):  
S.I. Sidorenko ◽  
S.M. Voloshko ◽  
Yu.M. Мakogon ◽  
O.P. Pavlov ◽  
I.E. Kotenko ◽  
...  
Keyword(s):  
Thin Film ◽  
Mass Spectrometry ◽  
Solid State ◽  
Auger Spectroscopy ◽  
Solid State Reactions ◽  
Layer By Layer ◽  
Film System ◽  
X Ray ◽  
Thin Film System ◽  
Secondary Ions

By the methods of Auger-spectroscopy and mass-spectrometry of secondary ions, small-angle electron diffraction, X-ray and resistometry analyses the solid-state reactions in the Ti(5 nm)/ Ni(24 nm)/Si(001) thin film system at annealing in running nitrogen in the temperature interval of 723 – 1273 К are investigated. Regularities of phase transformations, consistency of solid-state reactions, layer-by-layer redistribution of components during annealing, features of surface morphology during formation of inclusions of silicide phases are established.

TiNi/GaAs Thin Film Structures for Gate Metallizations

2000 ◽  
Vol 648 ◽  
Author(s):  
Chichang Zhang ◽  
Aris Christou
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Electron Beam ◽  
Sheet Resistance ◽  
Intermetallic Phase ◽  
Intermetallic Phases ◽  
Schottky Barriers ◽  
X Ray Diffraction ◽  
X Ray ◽  
Alloy Tini

AbstractShape memory alloy TiNi thin films on GaAs have been investigated. A series of TiNi compositions were electron beam deposited on GaAs initially as thin multilayers of Ti and Ni. The intermetallic phase of TiNi was formed by annealing and complete intermixing of the multilayers at 370oC. The intermetallic phases were investigated with X-ray diffraction techniques. The annealing kinetics and resistivity investigations were carried out in order to minimize the sheet resistance of the intermetallic phase. TiNi Schottky barriers on GaAs have been fabricated and their performance will be reported. Additional investigations on surface morphology using the energy dispersive spectroscopy as well as TEM investigations show the correlation between microstructure, intermetallic phase formation and sheet resistance.

Effect of Annealing Temperatures on the Microstructure of CuInS2 Thin Film by One-Step Electrodeposition

2010 ◽  
Vol 150-151 ◽  
pp. 530-533 ◽  
Author(s):  
Lin Lu ◽  
Yan Jie Wang ◽  
Xiao Gang Li
Keyword(s):  
Thin Film ◽  
Nir Spectroscopy ◽  
Chalcopyrite Structure ◽  
X Ray Diffraction ◽  
X Ray ◽  
Annealing Temperatures ◽  
Photovoltaic Applications ◽  
Different Temperatures ◽  
One Step ◽  
Cuins2 Film

CuInS2 thin film used for photovoltaic applications was prepared by one-step electrodeposition. The films were annealed at different temperatures of 350, 400, 500 °C. Effects of annealing temperatures on the properties of the film were investigated by the way of X-ray diffraction (XRD), scanning electron microscopy (SEM) and UV-Vis-NIR Spectroscopy. The result shows that CuInS2 film with chalcopyrite structure can be successfully prepared by one-step electrodeposition. Annealing is effective in improving the crystallinity of the thin film. The temperature of 400°C is favorable to the grain growth of the film without the generation of impurity.

Phase stability tuning in the NbxZr1−xN thin-film system for large stacking fault density and enhanced mechanical strength

2005 ◽  
Vol 86 (13) ◽  
pp. 131922 ◽  
Author(s):  
T. Joelsson ◽  
L. Hultman ◽  
H. W. Hugosson ◽  
J. M. Molina-Aldareguia
Keyword(s):  
Thin Film ◽  
Mechanical Strength ◽  
Phase Stability ◽  
Stacking Fault ◽  
Film System ◽  
Thin Film System ◽  
Fault Density

Solid-State Reactions in Ni(10 nm)/C(2 nm)/Si(001) Thin Film System

2007 ◽  
Vol 264 ◽  
pp. 155-158
Author(s):  
Yu.N. Makogon ◽  
O.P. Pavlova ◽  
G. Beddies ◽  
A.V. Mogilatenko ◽  
O.V. Chukhrai
Keyword(s):  
Thin Film ◽  
Solid State ◽  
Solid State Reactions ◽  
Strong Impact ◽  
Film System ◽  
Nitrogen Flow ◽  
Environment Effect ◽  
X Ray ◽  
Resistivity Measurements ◽  
Thin Film System

Annealing environment effect on the phase formation in Ni(10 nm)/C(2 nm)/Si(001) thin film system produced by sequential sputtering of C and Ni targets without vacuum breaking was under investigation. The specimens were annealed 30 s in vacuum of 1.3·10-4 Pa and in nitrogen flow in the temperature range of 450 - 1000°C. The temperature stimulated solid-state reactions that occur as the result of interdiffusion processes between layers of the thin film system under investigations were examined by X-ray - and electron diffractions, resistivity measurements and Rutherford backscattering. It was established that an annealing environment has a strong impact on the development of the solid-state reactions in Ni(10 nm)/C(2 nm)/Si(001) thin film system.

Annealing of a-Si:H Thin Film by Rapid Thermal Process

2011 ◽  
Vol 181-182 ◽  
pp. 409-412 ◽  
Author(s):  
Yu Cang Wang ◽  
Rui Min Jin
Keyword(s):  
Thin Film ◽  
Thermal Process ◽  
Annealing Temperature ◽  
Silicon Film ◽  
X Ray Diffraction ◽  
Rapid Thermal Process ◽  
X Ray ◽  
Annealing Temperatures ◽  
Amorphous Silicon Film ◽  
Scanning Electron

Undoped amorphous silicon film deposited by PECVD,and annealed by rapid tharmal process,then have been studied by using micro-Raman scattering, X-ray diffraction and scanning electron microscope.It is found that crystallized silicon films is different at different annealing temperatures, there exists a better annealing temperature.

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