Adhesive transfer at copper/diamond interface and adhesion reduction mechanism with fluorine passivation: A first-principles study

Carbon ◽  
2018 ◽  
Vol 127 ◽  
pp. 548-556 ◽  
Author(s):  
Zengjia Liu ◽  
Shaoxian Zheng ◽  
Zhibin Lu ◽  
Jibin Pu ◽  
Guangan Zhang
2020 ◽  
Vol 22 (36) ◽  
pp. 20914-20921 ◽  
Author(s):  
Rajmohan Muthaiah ◽  
Jivtesh Garg

We report novel pathways to significantly enhance the thermal conductivity at nanometer length scales in boron phosphide through biaxial strain.


2019 ◽  
Vol 58 (SC) ◽  
pp. SCCB35 ◽  
Author(s):  
Tomoe Yayama ◽  
Anh Khoa Augustin Lu ◽  
Tetsuya Morishita ◽  
Takeshi Nakanishi

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