Ceria (Sm3+, Nd3+)/carbonates composite electrolytes with high electrical conductivity at low temperature

2010 ◽  
Vol 70 (1) ◽  
pp. 181-185 ◽  
Author(s):  
Wei Liu ◽  
Yanyi Liu ◽  
Bin Li ◽  
Taylor D. Sparks ◽  
Xi Wei ◽  
...  
2018 ◽  
Vol 934 ◽  
pp. 13-17
Author(s):  
N.A. Ngah ◽  
Amiza Rasmi ◽  
Azmi Ibrahim ◽  
Zulkifli Ambak ◽  
Mohd Zulfadli Mohamed Yusoff ◽  
...  

Multilayer low temperature co-fired ceramic (LTCC) is well known in usage as interconnect substrate, especially in high frequency application due to high electrical conductivity of the conductors and low loss of the LTCC dielectric. As substrate and packaging materials, there are many chips or devices placed on the multilayer LTCC board. In this paper, multilayer LTCC is implemented as the packaging at PIN photodiode (PD) module of the Radio over Fiber (RoF) system with the reason to increase thermal dissipation capacity of the PD module.


2015 ◽  
Vol 3 (36) ◽  
pp. 18557-18563 ◽  
Author(s):  
Chanderpratap Singh ◽  
Ashish Kumar Mishra ◽  
Amit Paul

An economical and simple low temperature chemically assisted reduced graphene synthesis has been reported and the obtained graphene exhibits very high electrical conductivity (1.6 × 103 S cm−1).


Alloy Digest ◽  
1968 ◽  
Vol 17 (7) ◽  

Abstract Hitenso-1622 is a copper-cadmium alloy characterized by high strength, abrasion resistance and relatively high electrical conductivity. (Formerly known as Hitenso BB-961). It is recommended for electrical equipment, trolley wire, low temperature transmission lines and relays. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Cu-189. Producer or source: Anaconda American Brass Company.


2021 ◽  
Author(s):  
Xiao Min Zhang ◽  
Xiao-Li Yang ◽  
Bin Wang

Abstract Printable electrically conductive adhesive with high electrical conductivity and good mechanical properties has wide application prospect in electronic device. In order to explore new conductive fillers of interconnecting materials in electronic circuit and electronic packaging industries, silver nanopowders were prepared by DC arc plasma method with high pure. The silver nanopowders present a spherical structure, the particle’s diameter range from 15 to 220 nm. In this paper, a high performance electrically conductive adhesive (ECA) was prepared. This ECA was fabricated by mixing silver nanopowders with epoxy resin and was screen-printed to a required shape. It was found that the ECA can be solidified through a low temperature sintering method in the air at 150 ℃ for 10 min. The electrical and mechanical of above ECA were investigated and characterized. The ECA filled with 75% silver nanopowders exhibits excellent performances, including high electrical conductivity (9.5×10-4 Ω·cm), high bonding strength ( 8.3 MPa). Based on the performance characteristics, the ECA applications in flexible printed electrodes and interconnecting materials are demonstrated.


Alloy Digest ◽  
1988 ◽  
Vol 37 (1) ◽  

Abstract CDA C18700 is a copper-base alloy containing lead (nominally 1.0%). The lead is added to impart free-cutting properties to the metal. Although the lead lowers the electrical conductivity of CDA C18700 slightly below that of tough-pitch copper, it still has high electrical conductivity well within the limits needed for most current-carrying requirements. Typical uses comprise electrical motor and switch parts, electrical connectors and screw-machine parts requiring high conductivity. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and shear strength. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Cu-533. Producer or source: Copper and copper alloy mills.


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