Characterization of high glass transition temperature sugar-based epoxy resin composites with jute and carbon fibre reinforcement

TriA-PI is a newly developed phenylethnyl terminated polyimide. It exhibits excellent mechanical properties and processability with high glass transition temperature (Tg>300°C). Nano-size particles of fullerene were dispersed throughout a thermosetting polyimide Triple API (TriA-PI) to elevate the glass transition temperature. The increase of the glass transition temperature of the composites with the fullerene was confirmed by dynamic mechanical analysis (DMA).

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High-temperature carbon plastics based on thermoreactive polyimide binder

Voprosy Materialovedeniya ◽

10.22349/1994-6716-2020-103-3-89-102 ◽

2020 ◽

pp. 89-102

Author(s):

M. I. Valueva ◽

I. V. Zelenina ◽

M. A. Zharinov ◽

M. A. Khaskov

Keyword(s):

Glass Transition ◽

High Temperature ◽

Transition Temperature ◽

Glass Transition Temperature ◽

Strength Properties ◽

High Glass Transition Temperature ◽

Reinforced Plastics ◽

Carbon Plastics ◽

Fundamental Possibility ◽

Fiber Reinforced Plastics

The article presents results of studies of experimental carbon plastics based on thermosetting PMRpolyimide binder. Сarbon fiber reinforced plastics (CFRPs) are made from prepregs prepared by melt and mortar technologies, so the rheological properties of the polyimide binder were investigated. The heat resistance of carbon plastics was researched and its elastic-strength characteristics were determined at temperatures up to 320°С. The fundamental possibility of manufacturing carbon fiber from prepregs based on polyimide binder, obtained both by melt and mortar technologies, is shown. CFRPs made from two types of prepregs have a high glass transition temperature: 364°C (melt) and 367°C (solution), with this temperature remaining at the 97% level after boiling, and also at approximately the same (86–97%) level of conservation of elastic strength properties at temperature 300°С.

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Studies on the Modification of Commercial Bisphenol-A-Based Epoxy Resin Using Different Multifunctional Epoxy Systems

Applied Mechanics ◽

10.3390/applmech2020023 ◽

2021 ◽

Vol 2 (2) ◽

pp. 419-430

Author(s):

Ankur Bajpai ◽

James R. Davidson ◽

Colin Robert

Keyword(s):

Mechanical Properties ◽

Glass Transition ◽

Transition Temperature ◽

Glass Transition Temperature ◽

Bisphenol A ◽

Epoxy Resin ◽

Tensile Fracture ◽

Chemical Structures ◽

Amino Phenol ◽

Epoxy Systems

The tensile fracture mechanics and thermo-mechanical properties of mixtures composed of two kinds of epoxy resins of different chemical structures and functional groups were studied. The base resin was a bi-functional epoxy resin based on diglycidyl ether of bisphenol-A (DGEBA) and the other resins were (a) distilled triglycidylether of meta-amino phenol (b) 1, 6–naphthalene di epoxy and (c) fluorene di epoxy. This research shows that a small number of multifunctional epoxy systems, both di- and tri-functional, can significantly increase tensile strength (14%) over neat DGEBA while having no negative impact on other mechanical properties including glass transition temperature and elastic modulus. In fact, when compared to unmodified DGEBA, the tri-functional epoxy shows a slight increase (5%) in glass transition temperature at 10 wt.% concentration. The enhanced crosslinking of DGEBA (90 wt.%)/distilled triglycidylether of meta-amino phenol (10 wt.%) blends may be the possible reason for the improved glass transition. Finally, the influence of strain rate, temperature and moisture were investigated for both the neat DGEBA and the best performing modified system. The neat DGEBA was steadily outperformed by its modified counterpart in every condition.

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Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis

Polymers ◽

10.3390/polym13111734 ◽

2021 ◽

Vol 13 (11) ◽

pp. 1734

Author(s):

Erick Franieck ◽

Martin Fleischmann ◽

Ole Hölck ◽

Larysa Kutuzova ◽

Andreas Kandelbauer

Keyword(s):

Glass Transition ◽

Transition Temperature ◽

Glass Transition Temperature ◽

Kinetic Parameters ◽

Measurement Techniques ◽

Process Conditions ◽

Dielectric Analysis ◽

High Glass Transition Temperature ◽

General Process ◽

Molding Compound

We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding compound with a high glass transition temperature (>195 °C), which is suitable for the direct packaging of electronic components. The resin was cured under isothermal temperatures close to general process conditions (165–185 °C). The material conversion was determined by measuring the ion viscosity. The change of the ion viscosity as a function of time and temperature was used to characterize the cross-linking behavior, following two separate approaches (model based and isoconversional). The determined kinetic parameters are in good agreement with those reported in the literature for EMCs and lead to accurate cure predictions under process-near conditions. Furthermore, the kinetic models based on dielectric analysis (DEA) were compared with standard offline differential scanning calorimetry (DSC) models, which were based on dynamic measurements. Many of the determined kinetic parameters had similar values for the different approaches. Major deviations were found for the parameters linked to the end of the reaction where vitrification phenomena occur under process-related conditions. The glass transition temperature of the inline molded parts was determined via thermomechanical analysis (TMA) to confirm the vitrification effect. The similarities and differences between the resulting kinetics models of the two different measurement techniques are presented and it is shown how dielectric analysis can be of high relevance for the characterization of the curing reaction under conditions close to series production.

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