A novel Fe2O3@APFS/epoxy composite with enhanced mechanical and thermal properties

2020 ◽  
Vol 193 ◽  
pp. 108146 ◽  
Author(s):  
Tao Sun ◽  
Yong Wang ◽  
Yanzhi Yang ◽  
Hongyu Fan ◽  
Minjing Liu ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Epoxy Composite ◽  
Mechanical And Thermal Properties

scholarly journals The Effect of Interaction between Nanofillers and Epoxy on Mechanical and Thermal Properties of Nanocomposites: Theoretical Prediction and Experimental Analysis

2019 ◽  
Vol 2019 ◽  
pp. 1-10 ◽  
Author(s):  
S. Khostavan ◽  
M. Fazli ◽  
M. Ghorbanzadeh Ahangari ◽  
Y. Rostamiyan
Keyword(s):  
Thermal Properties ◽  
Density Functional ◽  
Theoretical Study ◽  
Epoxy Polymer ◽  
Epoxy Composite ◽  
Neat Epoxy ◽  
Mechanical And Thermal Properties ◽  
Host Matrix ◽  
Functional Theory ◽  
The Density Functional Theory

Interfacial interaction between host matrix and nanofillers is a determinative parameter on the mechanical and thermal properties of nanocomposites. In this paper, we first investigated interaction between carbon nanotube (CNT) and montmorillonite clay (MMT) absorbing on epoxy surface in a theoretical study based on the density functional theory (DFT) calculations. Results showed the interaction energy of -1.93 and -0.11 eV for MMT/epoxy and CNT/epoxy, respectively. Therefore, the interaction between epoxy polymer and MMT is of the chemisorptions type, while epoxy physically interacts with CNT. In addition, thermal and mechanical analyses were conducted on nanocomposites. In DSC analysis the glass transition temperature which was 70°C in neat epoxy composite showed an improvement to about 90°C in MMT nanocomposites while it was about 70°C for CNT nanocomposites. Finally, mechanical properties were investigated and MMT nanocomposite showed a change in compressive strength which increased from 52.60 Mpa to 72.07 and 92.98 Mpa in CNT and MMT nanocomposites, respectively. Also tensile strength improved to the value of 1250.69 Mpa MMT nanocomposites while it was about 890 Mpa in both CNT nanocomposite and neat epoxy composite which corresponds to the calculation result prediction.

scholarly journals Effects of EPON on Mechanical and Thermal Properties of Epoxy Resins

2008 ◽  
Vol 47-50 ◽  
pp. 536-539 ◽  
Author(s):  
H. Ku ◽  
F. Cardona ◽  
D. Rogers ◽  
A. Vandenbroucke
Keyword(s):  
Thermal Properties ◽  
Epoxy Resin ◽  
Structural Engineering ◽  
Epoxy Composite ◽  
Low Cost ◽  
Mechanical And Thermal Properties ◽  
Scanning Calorimetry ◽  
Bending Tests ◽  
Three Point Bending ◽  
The Cost

Low cost composite materials are widely used in civil and structural engineering applications. This project uses EPON to plasticize a commonly used resin, epoxy resin to lower the cost of the composite and to find out the mechanical and thermal properties of the plasticized epoxy resin to see if it is suitable for the said applications. Three point bending tests were carried out to evaluate the flexural properties of the plasticized resins. Differential scanning calorimetry and dynamic mechanical thermal analysis are used to evaluate the thermal properties of the plasticized epoxy resin. The study with epoxy and EPON showed that the mechanical properties of the epoxy composite were lowered but its ability to dissipate energy increased because of its improved thermal properties. As EPON is much cheaper that epoxy resin, the composite produced is therefore cheaper and provided the service requirements were not so demanding, it can be used in the said applications.

Effect of red mud waste filler on mechanical and thermal properties of amine functional aniline furfuraldehyde condensate (AFAFFC) modified epoxy composite

2016 ◽  
Vol 45 (3) ◽  
pp. 184-190
Author(s):  
B.C. Samanta ◽  
T. Maity
Keyword(s):  
Thermal Properties ◽  
Epoxy Resin ◽  
Red Mud ◽  
Network Formation ◽  
Epoxy Composite ◽  
Reaction Medium ◽  
Concentration Effect ◽  
Mechanical And Thermal Properties ◽  
Content Type ◽  
Modified Epoxy

Purpose This paper aims to evaluate the concentration effect of red mud waste filler on mechanical and thermal properties of amine functional aniline furfuraldehyde condensate (AFAFFC) modified epoxy composite along with the optimum result of modified epoxy. Design/methodology/approach For effective toughening, different compositions were made by adding various concentration of AFAFFC to epoxy. The concentration of 2, 5 and 10 parts per hundred parts of epoxy resin of aluminium silicate-based pristine red mud waste was incorporated into the each modified epoxy matrix. These filled modified matrixes were cured with ambient temperature curing agent triethylene tetramine and evaluated with respect to their impact, tensile and flexural strengths. The morphology was analyzed by scanning electron microscopy and dynamic mechanical analysis. The thermal stability by thermogravimetric analysis was also reported. Findings The modification of epoxy resin using AFAFFC and filler showed significant enhancement of mechanical strength over unmodified epoxy. The increase depends on the concentration of the modifier and filler. The reason behind this is that in the initial stage of curing, the AFAFFC are miscible with the epoxy and form a homogeneous solution. This good mixing promotes the chemical reaction and network formation. During the curing process, as the molecular weight increases, the component separates with in the reaction medium to form a second dispersed phase. Research Limitations/implications The present paper discussed the effect of only one type of modifier, i.e. AFAFFC, and one filler, i.e. red mud waste filler effect. Besides these by changing the amine and aldehyde, other modifiers could be synthesised and the efficiency of modification of epoxy resin using these modifiers and other filler besides red mud waste such as paddy husk, bamboo dust, etc., could also be studied. Originality/value The present study regarding the concentration effect of modifier and filler was novel, and AFAFFC modified filled epoxy could be used in the field of coating, casting, adhesives, potting and encapsulation of semiconductor devices.

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