Mechanically-compensated bending-strain measurement of multilayered paper-like electronics via surface-mounted sensor
2018 ◽
Vol 10
(12)
◽
pp. 168781401881675
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1996 ◽
Vol 191
(5)
◽
pp. 847-858
◽
1989 ◽
Vol 47
◽
pp. 210-211
Keyword(s):