Microstructure-based modeling of the diffusivity of cement paste with micro-cracks

2013 ◽  
Vol 38 ◽  
pp. 1107-1116 ◽  
Author(s):  
Lin Liu ◽  
Huisu Chen ◽  
Wei Sun ◽  
Guang Ye
Keyword(s):  
2011 ◽  
Vol 374-377 ◽  
pp. 1930-1933
Author(s):  
Wu Man Zhang ◽  
Wei Sun ◽  
Jin Yang Jiang

The coupling effect of flexural loading and environmental factors has great influence on the pore structures in hardened cement paste. In this paper, Mercury intrusion porosimetry (MIP) and field emission scanning electron microscope (SEM) were used to analyze and observe the changes of pore structures in hardened cement paste subjected to flexural loading and wet-dry cycles in simulated seawater. The results show that the porosity greatly increases when the flexural loading level is raised from 0 f (the ultimate flexural loading capacity) to 0.8 f. Micro-cracks are observed and the connectivity, width and density of micro-cracks increase with the increment of flexural loading. The peaks position of pore size shifts toward greater micro-pores when the flexural loading was raised from 0 f to 0.8 f. The flexural loading and simulated seawater accelerate the degradation of pore structures.


2020 ◽  
Vol 322 ◽  
pp. 01037
Author(s):  
Alexandre Yammine ◽  
François Bignonnet ◽  
Nordine Leklou ◽  
Marta Choinska

A multi-scale poromechanical model of damage induced by Delayed Ettringite Formation (DEF) as a consequence of progression of micro-cracks at the fine aggregate scale is developed. The aim is to link the DEF-induced expansion at both the microscopic and macroscopic scales to the loss of stiffness of the mortar and the increase of its diffusion coefficient. At the microscopic scale, mortar is assumed to be constituted of three phases: cement paste, sand and micro-cracks. Damage is assumed to be driven by a free expansion of cement paste due to ettringite crystallization pressures in small capillary pores, at a lower scale. The corresponding homogenised poroelastic properties are estimated along with the diffusion coefficient by resorting either to a Mori-Tanaka scheme or to a self-consistent scheme, as a function of paste and aggregate properties as well as on the density of micro-cracks. The latter is assumed to be an evolving internal variable in order to model DEF-induced damage in the mortar. As the DEF-induced expansive free strain in the cement paste is restrained by the sand particles, internal stresses arise in the mortar. The corresponding free energy can be partially released by an increase in the micro-cracks density by analogy with the energy restitution rate of linear elastic fracture mechanics. The role of the damage criterion adopted on the thermodynamic force associated with micro-cracks density increase is investigated.


2020 ◽  
Vol 38 (6A) ◽  
pp. 879-886
Author(s):  
Ahmed S. Kadhim ◽  
Alaa A. Atiyah ◽  
Shakir A. Salih

This paper aims to investigate the influence of utilization micro cement kiln dust as a sustainable materials additive in order to reduce the voids and micro cracks in the cementitious mortar materials which cause a drastic reduction in the load carrying capacity of the element. Its therefore very important to decrease the pores and enhance the mechanical strength of the cementitious composite materials. In this article, the properties of self-compacting mortar containing micro cement dust additive was experimentally assessed. Micro cement dust powder was added to the self-compacting mortar in (1, 2, 3, 4 and 5 %) percentage by weight of cement to be used as cementitious sustainable materials. The experimental results indicated that the modification and enhancement of the workability of fresh mixture and the mechanical strengths of self-compacting mortar were increased as micro cement dust additives increases. Also; the water absorption and total porosity were decreased with increases of micro cement dust powder.


Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.


Sign in / Sign up

Export Citation Format

Share Document