Fabrication of fixed polishing tool by knitting diamond/CNT fiber threads on cloth

2018 ◽  
Vol 90 ◽  
pp. 229-243
Author(s):  
Jing Zhou ◽  
Jing Lu ◽  
Zhiping Xue ◽  
Xipeng Xu
Keyword(s):  
2021 ◽  
pp. 2000265
Author(s):  
Neeta Karjule ◽  
Moumita Rana ◽  
Menny Shalom ◽  
Jesús Barrio ◽  
Juan José Vilatela

2014 ◽  
Vol 800-801 ◽  
pp. 858-863
Author(s):  
Li Min Shi

In the paper, a new polishing head is researched and developed. How to set a magnetic feild is a key factor in magnetic-electrochemical compound polishing. To add a magnetic field that is parallel to electrical field, the electrochemical reaction can be changed greatly. Additionally, to add a magnetic field whose direction is changed to and fro, the efficiency of the polishing can be improved especially. In order to adapt to this theory, a new polishing head in magnec-electrochemical compound polishing is required resarch and development. Furthermore,the tool can be fixed on spindle of CNC easily and the tool is flexible so it can make the polishing head and workpiece touch evenly each other. Especially being noticed, the head of magnetic-electrochemical compound polishing tool is a series in order that the head can be replaced conveniently according to different surface. At last, the tool is tested and its function is perfect.


2004 ◽  
Author(s):  
Manuel Nunez ◽  
Javier Salinas ◽  
Esteban Luna ◽  
Luis Salas ◽  
Elfego Ruiz ◽  
...  

Author(s):  
S Rambabu ◽  
N Ramesh Babu

This article covers the efforts on characterising ice-bonded abrasive polishing tool in terms of the mechanical and tribological properties such as hardness, coefficient of friction, and wear rate. These studies were attempted on the tools prepared at different temperatures ranging from −10 °C to 0 °C with a view to identify the condition suitable to prepare ice-bonded abrasive polishing tool for effective polishing of Ti–6Al–4V alloy specimen. It also presents the methods adopted to determine various properties of ice-bonded abrasive polishing tool. Hardness was estimated from the measured penetration depth of cone shape indenter into the tool, coefficient of friction was determined from the change in power drawn by the motor rotating the tool mould, and wear behaviour of tool was assessed from the melting rate of the tool determined from the change in height of ice-bonded abrasive polishing tool at different stages of polishing. From the results of this study, it is clear that ice-bonded abrasive polishing tool prepared at −4 °C has possessed sufficient hardness, coefficient of friction, and reasonable wear rate suitable for polishing of Ti–6Al–4V specimens. This article also covers the details of low-temperature coolant supply unit developed to prepare the ice-bonded abrasive polishing tool at any desired temperature between 0 °C and −40 °C and thus to maintain it for a long time. Polishing studies with such ice-bonded abrasive polishing tool showed 72% improvement in finish after 90 min of polishing of Ti–6Al–4V specimen with tool, prepared at −4 °C.


2018 ◽  
Vol 20 (4) ◽  
pp. 1542-1559 ◽  
Author(s):  
Damla Senol Cali ◽  
Jeremie S Kim ◽  
Saugata Ghose ◽  
Can Alkan ◽  
Onur Mutlu

Abstract Nanopore sequencing technology has the potential to render other sequencing technologies obsolete with its ability to generate long reads and provide portability. However, high error rates of the technology pose a challenge while generating accurate genome assemblies. The tools used for nanopore sequence analysis are of critical importance, as they should overcome the high error rates of the technology. Our goal in this work is to comprehensively analyze current publicly available tools for nanopore sequence analysis to understand their advantages, disadvantages and performance bottlenecks. It is important to understand where the current tools do not perform well to develop better tools. To this end, we (1) analyze the multiple steps and the associated tools in the genome assembly pipeline using nanopore sequence data, and (2) provide guidelines for determining the appropriate tools for each step. Based on our analyses, we make four key observations: (1) the choice of the tool for basecalling plays a critical role in overcoming the high error rates of nanopore sequencing technology. (2) Read-to-read overlap finding tools, GraphMap and Minimap, perform similarly in terms of accuracy. However, Minimap has a lower memory usage, and it is faster than GraphMap. (3) There is a trade-off between accuracy and performance when deciding on the appropriate tool for the assembly step. The fast but less accurate assembler Miniasm can be used for quick initial assembly, and further polishing can be applied on top of it to increase the accuracy, which leads to faster overall assembly. (4) The state-of-the-art polishing tool, Racon, generates high-quality consensus sequences while providing a significant speedup over another polishing tool, Nanopolish. We analyze various combinations of different tools and expose the trade-offs between accuracy, performance, memory usage and scalability. We conclude that our observations can guide researchers and practitioners in making conscious and effective choices for each step of the genome assembly pipeline using nanopore sequence data. Also, with the help of bottlenecks we have found, developers can improve the current tools or build new ones that are both accurate and fast, to overcome the high error rates of the nanopore sequencing technology.


1987 ◽  
Vol 115 ◽  
Author(s):  
S. J. Klepeis ◽  
J. P. Benedict ◽  
R. M. Anderson

ABSTRACTA grinding/polishing tool has been developed for preparing TEM samples. The hand-held tool is 2.50″ in diameter and 3.0″ high. Rough-cut samples, 300 to 600 microns thick, are routinely polished to 5 microns thick in four to six hours using this tool. As these 5 micron samples are so thin and uniform, a separate dimpling operation can be eliminated. Likewise, the time required to ion-mill the sample can be reduced to 0.5 to 2.0 hours – greatly reducing ion-milling artifacts and significantly increasing the area viewable by TEM. The process is equally effective for all classes of samples: Silicon devices, ceramics or metals – in either cross-section or planar views.


2021 ◽  
Author(s):  
Qiang (John) Sun

This thesis presents a newly developed system for simulation and control of reconfigurable machines and applications in the polishing process. A software package is developed that consists of the Varying Topology Simulation and Control System (VT-Sim) as well as the Polishing CAM (P-CAM) software system. VT-Sim can simulate and control reconfigurable machines of serial or tree structures. It is developed based on mechatronic modules, each of which has a graphic user interface that can be connected to a physical module. The selected modules are linked through a graph-based topology design platform to generate an assembled system together with the equations for simulation and control. P-CAM can simulate and generate CNC codes for the polishing process. The roughness of the polished parts is simulated for selected polishing parameters. Once satisfied, polishing tool paths can be generated and visualized.


2018 ◽  
Vol 30 (6) ◽  
pp. 1856-1864 ◽  
Author(s):  
Anastasiia Mikhalchan ◽  
Agnieszka M. Banas ◽  
Krzysztof Banas ◽  
Anna M. Borkowska ◽  
Michal Nowakowski ◽  
...  

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