The effectiveness of the bonding layer to attain reliable thermoelectric structures

Herein, we synthesized a new polyethylene glycol (PEG)-based solid polymer electrolyte containing a rare earth oxide, CeO2, using mechanical metallurgy to prepare an encapsulation bonding material for MEMS. The effects of CeO2 content (0–15 wt.%) on the anodic bonding properties of the composites were investigated. Samples were analyzed and characterized by alternating current impedance spectroscopy, X-ray diffraction, scanning electron microscopy, differential scanning calorimetry, tensile strength tests, and anodic bonding experiments. CeO2 reduced the crystallinity of the material, promoted ion migration, increased the conductivity, increased the peak current of the bonding process, and increased the tensile strength. The maximum bonding efficiency and optimal bonding layer were obtained at 8 wt% CeO2. This study expands the applications of solid polymer electrolytes as encapsulation bonding materials.

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Material and process engineering aspects to improve the quality of the bonding layer in a laser-assisted fused filament fabrication process

Additive Manufacturing ◽

10.1016/j.addma.2021.102105 ◽

2021 ◽

pp. 102105

Author(s):

Gerhard Bräuer ◽

Klaus Sachsenhofer ◽

Reinhold W. Lang

Keyword(s):

Process Engineering ◽

Fabrication Process ◽

Bonding Layer ◽

Fused Filament Fabrication

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Microstructure Analysis of the Bonding Layer at a Steel – Silicate-Enamel Coating Boundary

Glass and Ceramics ◽

10.1007/s10717-016-9810-2 ◽

2016 ◽

Vol 72 (11-12) ◽

pp. 454-457

Author(s):

O. R. Lazutkina ◽

E. P. Farafontova ◽

I. G. Voroshilova

Keyword(s):

Enamel Coating ◽

Microstructure Analysis ◽

Bonding Layer

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A method for improving loadability of aluminum bearing ? alloy deformation and bonding layer thickness Kazuo Mastuo, Koue Ookawa (NDC Co., Ltd)

JSAE Review ◽

10.1016/s0389-4304(96)80557-1 ◽

1996 ◽

Vol 17 (4) ◽

pp. 442

Keyword(s):

Layer Thickness ◽

Bonding Layer ◽

Bearing Alloy

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Hydrogen-Bonding Layer Protecting Polyelectrolyte Capsules and Its Mechanical Property Study with Atomic Force Microscope

Journal of Nanoscience and Nanotechnology ◽

10.1166/jnn.2008.156 ◽

2008 ◽

Vol 8 (6) ◽

pp. 2996-3002 ◽

Cited By ~ 4

Author(s):

Liqin Ge ◽

Xing Wang ◽

Long Ba ◽

Zhongze Gu

Keyword(s):

Hydrogen Bonding ◽

Atomic Force Microscope ◽

Elastic Deformation ◽

Self Assembly ◽

Laser Scanning ◽

Confocal Laser ◽

Bonding Layer ◽

Layer By Layer ◽

Assembly Method ◽

Atomic Force

The hydrogen-bonding multilayered polyelectrolyte capsules with sizes around 6 μm were fabricated by layer-by-layer self-assembly method. The morphology of the obtained capsules was observed with Scanning Electron Microscope (SEM), Confocal Laser Scanning Microscope (CLSM) and Atomic Force Microscope (AFM), respectively. The elastic properties of the capsules were studied with AFM. The capsule was pressed by cantilever with different lengths, a glass bead glued at the end of the cantilever. The force curves were measured on the capsule in air. The Young's modulus of the capsule was obtained (E = 170 MPa for the loading). Results show that this model can predict the elastic deformation of the microcapsule. The accuracy of the elastic deformation of polymer capsule can be ensured using a cantilever of mediate stiffness. Our results show that the existence of the hydrogen-bonding layer makes the multilayered polyelectrolyte harder in comparison with the pure multilayered polyelectrolyte capsules.

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