Intraatrial reentrant tachycardia originating from the prior suture line of the baffle in a patient who underwent the Mustard operation: Ultra-high-density 3-dimensional mapping

Introduction Multiple contact-based ablation technologies have been developed to allow real-time judgement of lesion effectiveness; local impedance (LI) guided ablation and the role of ultra-high density (UHD) mapping have not yet been evaluated for cavotricuspid isthmus dependent atrial flutter (CTI-AFL). Methods This non-randomised observational study evaluated patients undergoing CTI-AFL ablation using conventional, contact force (CF) and LI guided strategies. Ablation metrics were collected, and in the LI cohort, the use of UHD mapping for breakthrough was evaluated. Results 30 patients were included, 10 in each group. Mean total ablation time was significantly shorter with LI (3.2±1.3min) vs conventional (5.6±2.7min) and CF (5.7±2.0min, p=0.0042). Time from start of ablation to CTI block was numerically shorter with LI (14.2±8.0min) vs conventional and CF (19.7±14.1 and 22.5±19.1min, p=0.4408). There were no differences in the number of lesions required to achieve block, procedural success, complication rates or recurrence. 15/30 patients did not achieve block following first-pass ablation. UHD mapping rapidly identified breakthrough in the 5 LI patients, including epicardial-endocardial breakthrough (EEB) away from the line. Conclusion The use of LI for real-time assessment of lesion formation resulted in significantly less ablation requirement. UHD mapping rapidly identified breakthrough, including EEB, which would likely have been difficult to identify otherwise and possibly require extensive ablation, contributing towards shortening of time to CTI block with LI.

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Predictors of Success in Ablation of Scar-Related Ventricular Tachycardia

Clinical Medicine Insights Cardiology ◽

10.4137/cmc.s11501 ◽

2013 ◽

Vol 7 ◽

pp. CMC.S11501 ◽

Cited By ~ 1

Author(s):

Mazen T. Ghanem ◽

Rania S. Ahmed ◽

Ayman M. Abd El Moteleb ◽

John K. Zarif

Keyword(s):

Ventricular Tachycardia ◽

Univariate Analysis ◽

Scar Tissue ◽

Focal Lesions ◽

3 Dimensional ◽

Linear Lesions ◽

Linear Ablation ◽

Dimensional Mapping ◽

Mapping Systems

During ablation of re-entrant ventricular tachycardia (VT) 3-dimensional mapping systems are now used to properly delineate the scar tissue and aid ablation of scar-related VT. The aim of our study was to outline how the mode of ablation predicts success and recurrence in large scar-related VT. When comparing patients with recurrence and patients with no recurrence, univariate analysis showed that number of ablation lesions (28 ± 8 vs. 12 ± 8, P = 0.01) and more linear ablation lesions rather than focal lesions ( P = 0.03) were associated with long-term success. We demonstrated that more extensive ablation lesions and creation of linear lesions is associated with better success rate and lower recurrence rate during ablation of large scar-related ventricular tachycardia.

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Three-Dimensional Magneto-Optical Recording

MRS Proceedings ◽

10.1557/proc-834-j3.1 ◽

2004 ◽

Vol 834 ◽

Author(s):

Akiyoshi Itoh

Keyword(s):

Storage System ◽

Three Dimensional ◽

Optical Recording ◽

High Density ◽

The Novel ◽

National Project ◽

3 Dimensional ◽

Disk Storage ◽

High Density Recording ◽

New Type

ABSTRACTIn this report, the newly developed three-dimensional magneto-optical (MO) recording scheme and the experimental results are reported. A part of this work has been done as the national project of 3D-MO (3-dimensional MO) project. It started at September 1998 and ended March 2002 as a part of the national project “Nanometer-Scale Optical High Density Disk Storage System” and aimed at achieving 100 Gb/in2 in storage density. Three-dimensional MO recording is one of the prosperous candidates of next generation ultra high density recording. Magnetic amplifying MO system (MAMMOS) is employed for achieving the novel three-dimensional MO recording. Double-MAMMOS scheme consists of 2-recording layers of differing compensation temperature (Tcomp ) and one readout layer was proposed and discussed.With write/read test it is succeeded to show the results corresponding to a 100 Gb/in2 (50 Gb/in2 × 2) recording density. We also proposed and showed results of simulations of a new type of Double-MAMMOS in which the recording layers can hold quadri-valued information by single writing process.

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3D-IC Integration Using D2C or D2W Alignment Schemes Together with Local Oxide Reduction

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2011dpc-wa13 ◽

2011 ◽

Vol 2011 (DPC) ◽

pp. 001291-001315

Author(s):

Gilbert Lecarpentier ◽

Jean-Stephane Mottet ◽

Keith Cooper ◽

Michael Stead

Keyword(s):

Integrated Circuits ◽

High Density ◽

Oxide Reduction ◽

3D Ic ◽

3 Dimensional ◽

Temperature Requirements

3-Dimensional interconnection of high density integrated circuits enables building devices with greater functionality with higher performances in a smaller space. This paper explores the chip-to-chip and chip-to-wafer alignment and the associated bonding techniques such as in-situ reflow or thermocompression with a local oxide reduction which contributes to higher yield together with reduction of the force or temperature requirements.

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Die to Die and Die To Wafer Bonding Solution for High Density, Fine Pitch Micro-Bumped Die

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2012dpc-tha15 ◽

2012 ◽

Vol 2012 (DPC) ◽

pp. 002251-002284 ◽

Cited By ~ 1

Author(s):

Gilbert Lecarpentier ◽

Joeri De Vos

Keyword(s):

Wafer Bonding ◽

Flip Chip ◽

High Accuracy ◽

High Density ◽

Size Reduction ◽

Direct Impact ◽

3 Dimensional ◽

Fine Pitch ◽

Placement Accuracy ◽

Die Bonding

Higher density interconnection using 3-Dimensional technology implies a pitch reduction and the use of micro-bumps. The micro-bump size reduction has a direct impact on the placement accuracy needed on the die placement and flip chip bonding equipment. The paper presents a Die-to-Die and Die-to-Wafer, high accuracy, die bonding solution illustrated by the flip chip assembly of a large 2x2cm die consisting of 1 million 10 μm micro-bumps at 20 μm pitch

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