Towards the thermal management of electronic devices: A parametric investigation of finned heat sink filled with PCM

2021 ◽  
Vol 129 ◽  
pp. 105643
Author(s):  
Adeel Arshad ◽  
Mohammed Ibrahim Alabdullatif ◽  
Mark Jabbal ◽  
Yuying Yan
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
Electronic Devices ◽  
Parametric Investigation

scholarly journals THE ADVANTAGES OF EVAPORATION IN MICRO-SCALE CHANNELS TO COOL MICROELETRONIC DEVICES

2007 ◽  
Vol 6 (2) ◽  
pp. 34 ◽  
Author(s):  
G. Ribatski ◽  
L. Cabezas-Gómez ◽  
H. A. Navarro ◽  
J. M. Saíz-Jabardo
Keyword(s):  
Specific Heat ◽  
Thermal Management ◽  
Power Density ◽  
High Power ◽  
Heat Sink ◽  
Flow Boiling ◽  
Electronic Devices ◽  
Management Systems ◽  
High Power Density ◽  
Micro Scale

In this paper, the importance of the development of new high power density thermal management systems for electronic devices is assessed. It is described the new heat sink technologies under development to be used in the cooling of microprocessors. The main difficulties to be overcome before the spreading of one specific heat sink configuration are identified. At the end, it is concluded that a heat sink based on flow boiling in micro-scale channels is the most promising approach.

Multiobjective Optimization of a Heat-Sink Design Using the Sandwiching Algorithm and an Immersed Boundary Conjugate Heat Transfer Solver

2018 ◽  
Vol 140 (10) ◽  
Author(s):  
Tommy Andersson ◽  
Dimitri Nowak ◽  
Tomas Johnson ◽  
Andreas Mark ◽  
Fredrik Edelvik ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Heat Sink ◽  
Conjugate Heat Transfer ◽  
Parametric Design ◽  
Electronic Devices ◽  
Immersed Boundary ◽  
Operational Cost ◽  
Simulation Based ◽  
Heat Sink Design

The thermal management is an ever increasing challenge in advanced electronic devices. In this paper, simulation-based optimization is applied to improve the design of a plate-fin heat-sink in terms of operational cost and thermal performance. The proposed framework combines a conjugate heat transfer solver, a CAD engine and an adapted Sandwiching algorithm. A key feature is the use of novel immersed boundary (IB) techniques that allows for automated meshing which is perfectly suited for parametric design optimization.

Thermal management of power electronics with liquid cooled metal foam heat sink

2021 ◽  
Vol 163 ◽  
pp. 106796
Author(s):  
Yongtong Li ◽  
Liang Gong ◽  
Bin Ding ◽  
Minghai Xu ◽  
Yogendra Joshi
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
Heat Sink ◽  
Metal Foam

scholarly journals Cooling Performance of Heat Sinks Used in Electronic Devices

2018 ◽  
Vol 171 ◽  
pp. 02003
Author(s):  
Ibrahim Mjallal ◽  
Hussein Farhat ◽  
Mohammad Hammoud ◽  
Samer Ali ◽  
Ali AL Shaer ◽  
...  
Keyword(s):  
Heat Sink ◽  
Electronic Devices ◽  
Heat Fluxes ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Passive Cooling ◽  
Short Term ◽  
Cooling Systems ◽  
Thermal Output ◽  
Electrical Devices

Existing passive cooling solutions limit the short-term thermal output of systems, thereby either limiting instantaneous performance or requiring active cooling solutions. As the temperature of the electronic devices increases, their failure rate increases. That’s why electrical devices should be cooled. Conventional electronic cooling systems usually consist of a metal heat sink coupled to a fan. This paper compares the heat distribution on a heat sink relative to different heat fluxes produced by electronic chips. The benefit of adding a fan is also investigated when high levels of heat generation are expected.

Boiling/Evaporation Heat Transfer Augmentation Using Subchannels-Inserted Metal Porous Media

2013 ◽  
Author(s):  
Kazuhisa Yuki ◽  
Masahiro Uemura ◽  
Koichi Suzuki ◽  
Ken-ichi Sunamoto
Keyword(s):  
Heat Transfer ◽  
Porous Medium ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronic Devices ◽  
High Heat Flux ◽  
Transfer Performance ◽  
Power Electronic ◽  
Copper Particles ◽  
Evaporation Heat

Two-phase flow loop system using a metal porous heat sink is proposed as a cooling system of the future power electronic devices with a heat load exceeding 300W/cm2. In this paper, as the first step, the heat transfer performance of the porous heat sink is evaluated under high heat flux conditions and the applicability and some engineering issues are discussed. The porous medium, which is fabricated by sintering copper particles, has a functional structure with several sub-channels inside it to enhance phase-change as well as discharge of generated vapor outside the porous medium. This porous heat sink is attached onto a heating chip and removes the heat by evaporating cooling liquid passing through the porous medium against the heat flow. Experiments using 30 kW of heating system show that the heat transfer performance of a copper-particles-sintered porous medium with the sub-channels exceeds 800W/cm2 in both high and low subcooling cases and achieves 300W/cm2 at a wall temperature of 150 °C (Tin = 70 °C) and 130 °C (Tin = 70 °C). These results prove that this porous heat sink is applicable enough for cooling 300 W/cm2 class of power electronic devices.

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