Experimental and numerical study on Mode I and Mode II interfacial fracture toughness of co-cured steel-CFRP hybrid composites

Author(s):  
Youqiang Yao ◽  
Pengcheng Shi ◽  
Mingda Chen ◽  
Gang Chen ◽  
Cong Gao ◽  
...  
2019 ◽  
pp. 089270571987486 ◽  
Author(s):  
Abdul Samad Khan ◽  
Aaqib Ali ◽  
Ghulam Hussain ◽  
Muhammad Ilyas

Multimaterial structures made using fused deposition modeling (FDM) offer an attractive prospect for enhancing their mechanical properties and functionality. In this study, the interfacial fracture toughness of a unidirectional hybrid composite fabricated by FDM was studied through mechanical testing. The composite structure comprises acrylonitrile butadiene styrene and carbon fiber-reinforced polylactic acid. Since, de-adhesion or bond failure at the interface can occur under a combination of the different fracture modes, therefore, interfacial fracture toughness, in terms of the critical energy release rate, was characterized using double cantilever beam specimen test for mode I, end-notched flexural specimen test for mode II, and mixed-mode bending specimen test for mixed-mode I/II. Effects of varying process parameters, like printing speed and nozzle temperature, on the interfacial fracture toughness in mode I and II were also investigated. It was found that increasing the nozzle temperature and printing speed enhance the fracture toughness, both in mode I and II, but the effect of increasing nozzle temperature on mode II fracture toughness was quite significant.


Polymers ◽  
2021 ◽  
Vol 13 (16) ◽  
pp. 2823
Author(s):  
Shiuh-Chuan Her ◽  
Kai-Chun Zhang

Epoxy resin with excellent mechanical properties, chemical stability, and corrosion resistance has been widely used in automotive and aerospace industries. A thin film of epoxy deposited on a substrate has great application in adhesive bonding and protective coating. However, the intrinsic brittleness of epoxy with a relatively low fracture toughness limits its applications. In this work, graphene nanoplatelets (GNP) were added to the epoxy resin to enhance its toughness, hardness, and elastic modulus. A series of nanocomposites with different loadings of GNP were fabricated. Ultrasonic sonication in combination with surfactant Triton X-100 were employed to disperse GNP in the epoxy matrix. A nanocomposite film with a thickness of 0.3 mm was deposited on an Al substrate using a spinning coating technology. The hardness and elastic modulus of the nanocomposite film on the Al substrate were experimentally measured by a nanoindentation test. Analytical expression of the mode II interfacial fracture toughness for the nanocomposite film on an Al substrate with an interfacial edge crack was derived utilizing the linear elastic fracture mechanics and Euler’s beam theory. End-notched flexure (ENF) tests were conducted to evaluate the mode II fracture toughness. It was found that the hardness, elastic modulus, and mode II fracture toughness of the nanocomposite film reinforced with 1 wt % of GNP were improved by 71.8%, 63.2%, and 44.4%, respectively, compared with the pure epoxy. The presence of much stiff GNP in the soft epoxy matrix prompts toughening mechanisms such as crack deflection and crack pinning, resulting in the improvements of the fracture toughness, hardness, and elastic modulus. Microscopic observation for the nanocomposite was examined by scanning electron microscopy (SEM) to investigate the dispersion of GNPs in the epoxy matrix. The performance of a nanocomposite film deposited on a substrate was rarely studied, in particular, for the interfacial fracture toughness of the film/substrate composite structure. Utilizing the theoretical model in conjunction with the ENF experimental test presented in this study, an accurate determination of the mode II interfacial fracture toughness of film/substrate composite structure is made possible.


2019 ◽  
Author(s):  
Denizhan Yavas ◽  
Ashraf Bastawros ◽  
Bishoy Dawood ◽  
Christopher Giuffre

2003 ◽  
Vol 778 ◽  
Author(s):  
M.J. Cordill ◽  
T. Muppidi ◽  
D.F. Bahr

AbstractGrain size can be controlled by varying the process conditions used to deposit the film and post growth processing. This study examines how the grain size will impact the mechanical properties, hardness and adhesion, of thin ductile films on brittle substrates. The grain structures of copper and tin films were examined using OIM and AFM. The interfacial fracture toughness of each film was calculated using a tungsten overlayer and mechanics based models. The hardnesses of the films were correlated to the measured interfacial fracture toughness, and demonstrate that increased hardness correlates to an increased sensitivity to the Mode II component of loading.


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