Manufacturing and testing of the double-layer wick structure in a loop heat pipe

2013 ◽  
Vol 56 (1-2) ◽  
pp. 709-714 ◽  
Author(s):  
Shen-Chun Wu ◽  
Chuo-Jeng Huang ◽  
Sheng-Hao Chen ◽  
Yau-Ming Chen
Keyword(s):  
Heat Pipe ◽  
Double Layer ◽  
Loop Heat Pipe ◽  
Wick Structure

Development and tests of loop heat pipe with multi-layer metal foams as wick structure

2016 ◽  
Vol 94 ◽  
pp. 324-330 ◽  
Author(s):  
Wei Zhou ◽  
Weisong Ling ◽  
Lian Duan ◽  
K.S. Hui ◽  
K.N. Hui
Keyword(s):  
Heat Pipe ◽  
Metal Foams ◽  
Loop Heat Pipe ◽  
Wick Structure

Experimental Investigation of the Miniature Loop Heat Pipe With Flat Evaporator

2005 ◽  
Author(s):  
Randeep Singh ◽  
Aliakbar Akbarzadeh ◽  
Masataka Mochizuki ◽  
Thang Nguyen ◽  
Vijit Wuttijumnong
Keyword(s):  
Thermal Resistance ◽  
Heat Pipe ◽  
Thermal Control ◽  
Capillary Forces ◽  
High Heat ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Wick Structure ◽  
Flat Evaporator ◽  
Heat Loads

Loop heat pipe (LHP) is a very versatile heat transfer device that uses capillary forces developed in the wick structure and latent heat of evaporation of the working fluid to carry high heat loads over considerable distances. Robust behaviour and temperature control capabilities of this device has enable it to score an edge over the traditional heat pipes. In the past, LHPs has been invariably assessed for electronic cooling at large scale. As the size of the thermal footprint and available space is going down drastically, miniature size of the LHP has to be developed. In this paper, results of the investigation on the miniature LHP (mLHP) for thermal control of electronic devices with heat dissipation capacity of up to 70 W have been discussed. Copper mLHP with disk-shaped flat evaporator 30 mm in diameter and 10 mm thickness was developed. Flat evaporators are easy to attach to the heat source without any need of cylinder-plane-reducer saddle that creates additional thermal resistance in the case of cylindrical evaporators. Wick structure made from sintered nickel powder with pore size of 3–5 μm was able to provide adequate capillary forces for the continuos circulation of the working fluid, and successfully transport heat load at the required distance of 60 mm. Heat was transferred using 3 mm ID copper tube with vapour and liquid lines of 60 mm and 200 mm length respectively. mLHP showed very reliable start up at different heat loads and was able to achieve steady state without any symptoms of wick dry-out. Tests were conducted on the mLHP with evaporator and condenser at the same level. Total thermal resistance, R total of the mLHP came out to be in the range of 1–4°C/W. It is concluded from the outcomes of the investigation that mLHP with flat evaporator can be effectively used for the thermal control of the electronic equipments with restricted space and high heat flux chipsets.

scholarly journals Heat Removal from Bipolar Transistor by Loop Heat Pipe with Nickel and Copper Porous Structures

2014 ◽  
Vol 2014 ◽  
pp. 1-9 ◽  
Author(s):  
Patrik Nemec ◽  
Martin Smitka ◽  
Milan Malcho
Keyword(s):  
Grain Size ◽  
Heat Pipe ◽  
Nickel Powder ◽  
Heat Removal ◽  
Bipolar Transistor ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Porous Structures ◽  
Porous Wick ◽  
Wick Structure

Loop heat pipes (LHPs) are used in many branches of industry, mainly for cooling of electrical elements and systems. The loop heat pipe is a vapour-liquid phase-change device that transfers heat from evaporator to condenser. One of the most important parts of the LHP is the porous wick structure. The wick structure provides capillary force to circulate the working fluid. To achieve good thermal performance of LHP, capillary wicks with high permeability and porosity and fine pore radius are expected. The aim of this work was to develop porous structures from copper and nickel powder with different grain sizes. For experiment copper powder with grain size of 50 and 100 μm and nickel powder with grain size of 10 and 25 μm were used. Analysis of these porous structures and LHP design are described in the paper. And the measurements’ influences of porous structures in LHP on heat removal from the insulated gate bipolar transistor (IGBT) have been made.

Study of PTFE wick structure applied to loop heat pipe

2015 ◽  
Vol 81 ◽  
pp. 51-57 ◽  
Author(s):  
Shen-Chun Wu ◽  
Tzu-Wei Gu ◽  
Dawn Wang ◽  
Yau-Ming Chen
Keyword(s):  
Heat Pipe ◽  
Loop Heat Pipe ◽  
Wick Structure

scholarly journals Performance Assessment of a Three-Dimensional Printed Porous Media Produced by Selective Laser Melting Technology for the Optimization of Loop Heat Pipe Wicks

2019 ◽  
Vol 9 (14) ◽  
pp. 2905 ◽  
Author(s):  
Jesús Esarte ◽  
Jesús M. Blanco ◽  
Angela Bernardini ◽  
Ramón Sancibrián
Keyword(s):  
Heat Pipe ◽  
Selective Laser Melting ◽  
Three Dimensional ◽  
Loop Heat Pipe ◽  
High Permeability ◽  
Laser Melting ◽  
Powder Sintering ◽  
Sintered Copper ◽  
Wick Structure ◽  
Better Than

The primary wick in a loop heat pipe device is a key component that is central to the operation of the device. Both high permeability and capillary pumping capacity, two properties highly dependent on wick structure, are strongly desirable for a satisfactory thermal performance. In this paper, selective laser melting (SLM), a three-dimensional (3D) printing technology, is used to create a primary wick for an 80 W heat transfer application. The permeability and capillarity values of this wick, experimentally measured, are compared with those built with the most widely used technologies nowadays, such as powder sintering and meshes. In this study, the SLM scaffold is shown to satisfy the minimum values required by the application in terms of capillarity and permeability: 0.031 mm/s and 4 × 10−12 m2, respectively. Our comparative study revealed that the wick produced with the SLM technology presented higher values of permeability, by two orders of magnitude, and slightly higher capillary figures than those corresponding to powder sintering for such application. However, it had capillary values well below those of a stainless-steel mesh. The hydraulic behavior of the SLM wick was better than that of the sintered copper powder, because it not only met the above-mentioned specifications, but it also improved its performance.

Sign in / Sign up

Export Citation Format

Share Document