Uncertainty quantification of heat transfer in a microchannel heat sink with random surface roughness

Author(s):  
Benedikt Sterr ◽  
Ehsan Mahravan ◽  
Daegyoum Kim
Author(s):  
Zhiwei Chen ◽  
Peng Qian ◽  
Zizhen Huang ◽  
Chengyuan Luo ◽  
Minghou Liu

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Yousef Alihosseini ◽  
Mohammad Reza Azaddel ◽  
Sahel Moslemi ◽  
Mehdi Mohammadi ◽  
Ali Pormohammad ◽  
...  

AbstractIn recent years, PCR-based methods as a rapid and high accurate technique in the industry and medical fields have been expanded rapidly. Where we are faced with the COVID-19 pandemic, the necessity of a rapid diagnosis has felt more than ever. In the current interdisciplinary study, we have proposed, developed, and characterized a state-of-the-art liquid cooling design to accelerate the PCR procedure. A numerical simulation approach is utilized to evaluate 15 different cross-sections of the microchannel heat sink and select the best shape to achieve this goal. Also, crucial heat sink parameters are characterized, e.g., heat transfer coefficient, pressure drop, performance evaluation criteria, and fluid flow. The achieved result showed that the circular cross-section is the most efficient shape for the microchannel heat sink, which has a maximum heat transfer enhancement of 25% compared to the square shape at the Reynolds number of 1150. In the next phase of the study, the circular cross-section microchannel is located below the PCR device to evaluate the cooling rate of the PCR. Also, the results demonstrate that it takes 16.5 s to cool saliva samples in the PCR well, which saves up to 157.5 s for the whole amplification procedure compared to the conventional air fans. Another advantage of using the microchannel heat sink is that it takes up a little space compared to other common cooling methods.


2021 ◽  
Vol 1163 ◽  
pp. 73-88
Author(s):  
Md Tanbir Sarowar

Microchannel heat sink plays a vital role in removing a considerable amount of heat flux from a small surface area from different electronic devices. In recent times, the rapid development of electronic devices requires the improvement of these heat sinks to a greater extent. In this aspect, the selection of appropriate substrate materials of the heat sinks is of vital importance. In this paper, three boron-based ultra-high temperature ceramic materials (ZrB2, TiB2, and HfB2) are compared as a substrate material for the microchannel heat sink using a numerical approach. The fluid flow and heat transfer are analyzed using the finite volume method. The results showed that the maximum temperature of the heat source didn’t exceed 355K at 3.6MWm-2 for any material. The results also indicated HfB2 and TiB2 to be more useful as a substrate material than ZrB2. By applying 3.6 MWm-2 heat flux at the source, the maximum obtained surface heat transfer coefficient was 175.2 KWm-2K-1 in a heat sink having substrate material HfB2.


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