Performance Comparison of Microchannel Heat Sink Using Boron-Based Ceramic Materials

2021 ◽  
Vol 1163 ◽  
pp. 73-88
Author(s):  
Md Tanbir Sarowar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Sink ◽  
Electronic Devices ◽  
Ceramic Materials ◽  
Substrate Material ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Microchannel Heat Sink ◽  
Small Surface

Microchannel heat sink plays a vital role in removing a considerable amount of heat flux from a small surface area from different electronic devices. In recent times, the rapid development of electronic devices requires the improvement of these heat sinks to a greater extent. In this aspect, the selection of appropriate substrate materials of the heat sinks is of vital importance. In this paper, three boron-based ultra-high temperature ceramic materials (ZrB2, TiB2, and HfB2) are compared as a substrate material for the microchannel heat sink using a numerical approach. The fluid flow and heat transfer are analyzed using the finite volume method. The results showed that the maximum temperature of the heat source didn’t exceed 355K at 3.6MWm-2 for any material. The results also indicated HfB2 and TiB2 to be more useful as a substrate material than ZrB2. By applying 3.6 MWm-2 heat flux at the source, the maximum obtained surface heat transfer coefficient was 175.2 KWm-2K-1 in a heat sink having substrate material HfB2.

Enhanced Thermal Transport in Microchannel Using Oblique Fins

2012 ◽  
Vol 134 (10) ◽  
Author(s):  
Y. J. Lee ◽  
P. S. Lee ◽  
S. K. Chou
Keyword(s):  
Heat Transfer ◽  
Boundary Layer ◽  
Heat Transfer Enhancement ◽  
Heat Sink ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Sectional oblique fins are employed, in contrast to continuous fins in order to modulate the flow in microchannel heat sinks. The breakage of a continuous fin into oblique sections leads to the reinitialization of the thermal boundary layer at the leading edge of each oblique fin, effectively reducing the boundary layer thickness. This regeneration of entrance effects causes the flow to always be in a developing state, thus resulting in better heat transfer. In addition, the presence of smaller oblique channels diverts a small fraction of the flow into adjacent main channels. The secondary flows created improve fluid mixing, which serves to further enhance heat transfer. Both numerical simulations and experimental investigations of copper-based oblique finned microchannel heat sinks demonstrated that a highly augmented and uniform heat transfer performance, relative to the conventional microchannel, is achievable with such a passive technique. The average Nusselt number, Nuave, for the copper microchannel heat sink which uses water as the working fluid can increase as much as 103%, from 11.3 to 22.9. Besides, the augmented convective heat transfer leads to a reduction in maximum temperature rise by 12.6 °C. The associated pressure drop penalty is much smaller than the achieved heat transfer enhancement, rendering it as an effective heat transfer enhancement scheme for a single-phase microchannel heat sink.

Optimization Under Uncertainty of Manifold Microchannel Heat Sinks

2012 ◽  
Author(s):  
Suchismita Sarangi ◽  
Karthik K. Bodla ◽  
Suresh V. Garimella ◽  
Jayathi Y. Murthy
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Heat Sinks ◽  
Optimization Under Uncertainty ◽  
Microchannel Heat Sink ◽  
Probabilistic Optimization ◽  
Manifold Microchannel

Conventional microchannel heat sinks provide good heat dissipation capability but are associated with high pressure drop and corresponding pumping power. The use of a manifold system that distributes the flow into the microchannels through multiple, alternating inlet and outlet pairs is investigated here. This manifold arrangement greatly reduces the pressure drop incurred due to the smaller flow paths, while simultaneously increasing the heat transfer coefficient by tripping the thermal boundary layers. A three-dimensional numerical model is developed and validated, to study the effect of various geometric parameters on the performance of the manifold microchannel heat sink. Apart from a deterministic analysis, a probabilistic optimization study is also performed. In the presence of uncertainties in the geometric and operating parameters of the system, this probabilistic optimization approach yields an optimal design that is also robust and reliable. Uncertainty-based optimization also yields auxiliary information regarding local and global sensitivities and helps identify the input parameters to which outputs are most sensitive. This information can be used to design improved experiments targeted at the most sensitive inputs. Optimization under uncertainty also provides a quantitative estimate of the allowable uncertainty in input parameters for an acceptable uncertainty in the relevant output parameters. The optimal geometric design parameters with uncertainties that maximize heat transfer coefficient while minimizing pressure drop for fixed input conditions are identified for a manifold microchannel heat sink. A comparison between the deterministic and probabilistic optimization results is also presented.

Numerical Study of Microchannel Heat Sinks With Non-Uniform Heat Flux Conditions

2011 ◽  
Author(s):  
Ling Ling ◽  
Yanfeng Fan ◽  
Ibrahim Hassan
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Numerical Study ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Bottom Surface ◽  
Nonuniform Heating ◽  
Uniform Heat Flux ◽  
Computational Domain ◽  
Uniform Heating

Higher heat flux is produced by Micro-Electro-Mechanical Systems (MEMS) because of their reduced size and increased clock speed. At the mean time, studies of non-uniform heating conditions which are more practical than uniform heating conditions are inadequate and needed urgently. Four nonuniform heating conditions are simulated in the paper. Three heat sinks with different widths of cross-linked channels locating above the center of hotspots are studied and compared to conventional straight microchannel heat sink. Half of the module geometry is chosen to be the computational domain. Two hotspots are placed at the bottom surface. The coolant is water, whose properties are dependent on temperature. Two inlet velocities, 0.5 m/s and 1 m/s, are tested for each heat sink. Temperature profile at the hotspots, pressure drop and total thermal resistance are selected as criteria of evaluating heat sink performance. All heat sinks have better performance when there is an upstream hotspot or the upstream hotspot is subjected to a higher heat flux. Cross-linked channel width of 0.5 mm has the best benefit to obtain better temperature uniformity without increasing the maximum temperature on the bottom surface.

Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins

2009 ◽  
Vol 131 (3) ◽  
Author(s):  
V. Egan ◽  
P. A. Walsh ◽  
E. Walsh ◽  
R. Grimes
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Volume Flow Rate ◽  
Electronic Devices ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Superior Performance ◽  
Low Profile ◽  
In Series ◽  
Heat Sink Design

Reliable and efficient cooling solutions for portable electronic devices are now at the forefront of research due to consumer demand for manufacturers to downscale existing technologies. To achieve this, the power consumed has to be dissipated over smaller areas resulting in elevated heat fluxes. With regard to cooling such devices, the most popular choice is to integrate a fan driven heat sink, which for portable electronic devices must have a low profile. This paper presents an experimental investigation into such low profile cooling solutions, which incorporate one of the smallest commercially available fans in series with two different heat sink designs. The first of these is the conventionally used finned heat sink design, which was specifically optimized and custom manufactured in the current study to complement the driving fan. While the second design proposed is a novel “finless” type heat sink suitable for use in low profile applications. Together the driving fan and heat sinks combined were constrained to have a total footprint area of 465 mm2 and a profile height of only 5 mm, making them ideal for use in portable electronics. The objective was to evaluate the performance of the proposed finless heat sink design against a conventional finned heat sink, and this was achieved by means of thermal resistance and overall heat transfer coefficient measurements. It was found that the proposed finless design proved to be the superior cooling solution when operating at low fan speeds, while at the maximum fan speed tested of 8000 rpm both provided similar performance. Particle image velocimetry measurements were used to detail the flow structures within each heat sink and highlighted methods, which could further optimize their performance. Also, these measurements along with corresponding global volume flow rate measurements were used to elucidate the enhanced heat transfer characteristics observed for the finless design. Overall, it is shown that the proposed finless type heat sink can provide superior performance compared with conventional finned designs when used in low profile applications. In addition a number of secondary benefits associated with such a design are highlighted including lower cost, lower mass, lower acoustics, and reduced fouling issues.

Numerical and Experimental Investigations on Heat Transfer Phenomena of an Aluminium Microchannel Heat Sink

2011 ◽  
Vol 145 ◽  
pp. 129-133 ◽  
Author(s):  
Thanhtrung Dang ◽  
Ngoctan Tran ◽  
Jyh Tong Teng
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Mass Flow Rate ◽  
Mass Flow ◽  
Flow Rate ◽  
Heat Sink ◽  
Inlet Temperature ◽  
Outlet Temperature ◽  
Microchannel Heat Sink ◽  
Maximum Heat

The study was done both numerically and experimentally on the heat transfer behaviors of a microchannel heat sink. The solver of numerical simulations (CFD - ACE+software package) was developed by using the finite volume method. This numerical method was performed to simulate for an overall microchannel heat sink, including the channels, substrate, manifolds of channels as well as the covered top wall. Numerical results associated with such kinds of overall microchannel heat sinks are rarely seen in the literatures. For cases done in this study, a heat flux of 9.6 W/cm2was achieved for the microchannel heat sink having the inlet temperature of 25 °C and mass flow rate of 0.4 g/s with the uniform surface temperature of bottom wall of the substrate of 50 °C; besides, the maximum heat transfer effectiveness of this device reached 94.4%. Moreover, in this study, when the mass flow rate increases, the outlet temperature decreases; however, as the mass flow rate increases, the heat flux of this heat sink increases also. In addition, the results obtained from the numerical analyses were in good agreement with those obtained from the experiments as well as those from the literatures, with the maximum discrepancies of the heat fluxes estimated to be less than 6 %.

Computational fluid dynamics for thermal performance of a water-cooled minichannel heat sink with different chip arrangements

2014 ◽  
Vol 24 (4) ◽  
pp. 797-810 ◽  
Author(s):  
Gongnan Xie ◽  
Shian Li ◽  
Bengt Sunden ◽  
Weihong Zhang
Keyword(s):  
Heat Transfer ◽  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Bottom Surface ◽  
Moderate Pressure ◽  
Content Type

Purpose – With the development of electronic devices, including the desires of integration, miniaturization, high performance and the output power, cooling requirement of chips have been increased gradually. Water-cooled minichannel is an effective cooling technology for cooling of heat sinks. The minichannel flow geometry offers large surface area for heat transfer and a high convective heat transfer coefficient with only a moderate pressure loss. The purpose of this paper is to analyze a minichannel heat sink having the bottom size of 35 mm×35 mm numerically. Two kinds of chip arrangement are investigated: diagonal arrangement and parallel arrangement. Design/methodology/approach – Computational fluid dynamics (CFD) technique is used to investigate the flow and thermal fields in forced convection in a three-dimensional minichannels heat sink with different chip arrangements. The standard k-e turbulence model is applied for the turbulence simulations on the minichannel heat sink. Findings – The results show that the bottom surface of the heat sink with various chip arrangements will have different temperature distribution and thermal resistance. A suitable chip arrangement will achieve a good cooling performance for electronic devices. Research limitations/implications – The fluid is incompressible and the thermophysical properties are constant. Practical implications – New and additional data will be helpful as guidelines in the design of heat sinks to achieve a good thermal performance and a long lifetime in operation. Originality/value – In real engineering situations, chips are always placed in various manners according to design conditions and constraints. In this case the assumption of uniform heat flux is acceptable for the surfaces of the chips rather than for the entire bottom surface of the heat sink.

Two-Phase Performance of a Hybrid Jet Plus Multipass Microchannel Heat Sink

2019 ◽  
Vol 12 (1) ◽  
Author(s):  
Shailesh N. Joshi ◽  
Danny J. Lohan ◽  
Ercan M. Dede
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Rate ◽  
Heat Sink ◽  
Maximum Pressure ◽  
Microchannel Heat Sink ◽  
Large Area ◽  
Two Phase ◽  
Maximum Heat ◽  
Flow Rates

Abstract The heat transfer and fluid flow performance of a hybrid jet plus multipass microchannel heat sink in two-phase operation is evaluated for the cooling of a single large area, 3.61 cm2, heat source. The two-layer branching microchannel heat sink is evaluated using HFE-7100 as the coolant at three inlet volumetric flow rates of 150, 300, and 450 ml/min. The boiling performance is highest for the flow rate of 450 ml/min with the maximum heat flux value of 174 W/cm2. Critical heat flux (CHF) was observed at two of the tested flow rates, 150 and 300 ml/min, before reaching the maximum operating temperature for the serpentine heater. At 450 ml/min, the heater reached the maximum allowable temperature prior to observing CHF. The maximum pressure drop for the heat sink is 34.1 kPa at a heat flux of 164 W/cm2. Further, the peak heat transfer coefficient value of the heat sink is 28,700 W/m2 K at a heat flux value of 174 W/cm2 and a flow rate of 450 ml/min. Finally, a validated correlation of the single device cooler is presented that predicts heat transfer performance and can be utilized in the design of multidevice coolers.

Improved Heat Dissipation Capability on Electronic Motor Control Devices

2005 ◽  
Author(s):  
Wei Tong
Keyword(s):  
Heat Transfer ◽  
Motor Control ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Vortex Generators ◽  
Maximum Temperature ◽  
Complex Heat Transfer ◽  
Pin Fins ◽  
Control Devices

Heat sinks have been widely used in electronic industry to maintain the operation temperatures of electronic devices lower than their allowable values and thus are often critical to the device performance and life. However, it is difficult to design heat sinks to satisfy all design specifications optimally under complex heat transfer phenomena. The present work discloses a new design of heat sinks to improve heat dissipation capability for electric motor control devices. The heat sink contains a plurality of raindrop-shaped pin fins, acting as vortex generators to increase the rate of heat transfer and in turn, to increase the cooling efficiency of the heat sinks. Numerical results have shown that with the new designed heat sinks, the maximum temperature can reduce about 30% over the conventional heat sinks.

Experimental Investigation of Silicon-Based Oblique Finned Microchannel Heat Sinks

2010 ◽  
Author(s):  
Yong-Jiun Lee ◽  
Poh-Seng Lee ◽  
Siaw-Kiang Chou
Keyword(s):  
Heat Transfer ◽  
Experimental Investigation ◽  
Heat Sink ◽  
Leading Edge ◽  
Secondary Flows ◽  
Heat Sinks ◽  
Fluid Mixing ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Silicon Based

Sectional oblique fins are employed in contrast to the continuous fins in order to modulate the flow in microchannel heat sink. Experimental investigation of silicon based oblique finned microchannel heat sink demonstrated a highly augmented and uniform heat transfer performance against the conventional microchannel. The breakage of continuous fin into oblique sections leads to the re-initialization of the thermal boundary layers at the leading edge of each oblique fin, effectively reducing the boundary-layer thickness. This regeneration of the entrance effect causes the flow to be always in a developing state thus resulting in better heat transfer. In addition, the presence of smaller oblique channels diverts a fraction of the flow into the adjacent main channels. The secondary flows thus created improve fluid mixing which serves to further enhance the heat transfer. The average Nusselt number, Nuave, for the silicon microchannel heat sink which uses water as the working fluid can increase as much as 55%, from 8.8 to 13.6. Besides, the augmented convective heat transfer leads to reduction in both maximum chip temperature and its temperature gradient, by 8.6°C and 47% respectively. Interestingly, there is only little or negligible pressure drop penalty associated with this novel heat transfer enhancement scheme in contrast to conventional enhancement techniques.

Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips

2010 ◽  
Vol 132 (8) ◽  
Author(s):  
W. Escher ◽  
T. Brunschwiler ◽  
B. Michel ◽  
D. Poulikakos
Keyword(s):  
Heat Transfer ◽  
Experimental Investigation ◽  
Flow Rate ◽  
Heat Sink ◽  
Volumetric Flow Rate ◽  
Maximum Temperature ◽  
Design Parameters ◽  
Cooling Power ◽  
Microchannel Heat Sink ◽  
Manifold Microchannel

We report an experimental investigation of a novel, high performance ultrathin manifold microchannel heat sink. The heat sink consists of impinging liquid slot-jets on a structured surface fed with liquid coolant by an overlying two-dimensional manifold. We developed a fabrication and packaging procedure to manufacture prototypes by means of standard microprocessing. A closed fluid loop for precise hydrodynamic and thermal characterization of six different test vehicles was built. We studied the influence of the number of manifold systems, the width of the heat transfer microchannels, the volumetric flow rate, and the pumping power on the hydrodynamic and thermal performance of the heat sink. A design with 12.5 manifold systems and 25 μm wide microchannels as the heat transfer structure provided the optimum choice of design parameters. For a volumetric flow rate of 1.3 l/min we demonstrated a total thermal resistance between the maximum heater temperature and fluid inlet temperature of 0.09 cm2 K/W with a pressure drop of 0.22 bar on a 2×2 cm2 chip. This allows for cooling power densities of more than 700 W/cm2 for a maximum temperature difference between the chip and the fluid inlet of 65 K. The total height of the heat sink did not exceed 2 mm, and includes a 500 μm thick thermal test chip structured by 300 μm deep microchannels for heat transfer. Furthermore, we discuss the influence of elevated fluid inlet temperatures, allowing possible reuse of the thermal energy, and demonstrate an enhancement of the heat sink cooling efficiency of more than 40% for a temperature rise of 50 K.

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