scholarly journals Development of a hierarchical microchannel heat sink with flow field reconstruction and low thermal resistance for high heat flux dissipation

2022 ◽  
Vol 182 ◽  
pp. 121925
Author(s):  
Rui Zheng ◽  
Yongjin Wu ◽  
Yahui Li ◽  
Guilian Wang ◽  
Guifu Ding ◽  
...  
Keyword(s):  
Heat Flux ◽  
Flow Field ◽  
Thermal Resistance ◽  
Heat Sink ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Field Reconstruction ◽  
Flow Field Reconstruction

Investigation of On-Chip Hot Spot Cooling Using Microchannel Heat Sink

2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Three Dimensional Model ◽  
Spot Cooling ◽  
On Chip

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.

Conjugated Numerical Study on the Performance of Microchannel Heat Sink Using Al2O3/H2O Nanofluid

2014 ◽  
Author(s):  
J. M. Wu ◽  
J. Y. Zhao
Keyword(s):  
Heat Flux ◽  
Integrated Circuit ◽  
Heat Sink ◽  
Nuclear Reactor ◽  
Numerical Study ◽  
Substrate Surface ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Size Dependent

High power electronics are widely used in many different areas such as integrated circuit (IC) boards in nuclear reactor control system. Thermal management of electronic devices has been a topic of great interest among many researchers over the last few decades. Microchannel is one of several high-heat-flux removal techniques. Nanofluids with enhanced thermal conductivity and strong temperature- and size-dependent thermal properties are expected to be utilized in microchannels as coolants, which leads to a promising future for such high-heat-flux systems as cooling systems. The performance of the microchannel heat sink (MCHS) using water and Al2O3/water nanofluids, with consideration of different substrate materials, is numerically investigated and compared in the present paper to identify the combined effects of working fluids and substrate materials on the thermal resistance, pumping power and temperature distribution on the substrate surface of a heat sink.

scholarly journals Optimization of stepwise varying width microchannel heat sink for high heat flux applications

2020 ◽  
Vol 18 ◽  
pp. 100587
Author(s):  
Essam M. Abo-Zahhad ◽  
Shinichi Ookawara ◽  
Ali Radwan ◽  
M.F. Elkady ◽  
A.H. El-Shazly
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink

Flow Boiling of Ammonia in a Diamond-Made Microchannel Heat Sink for High Heat Flux Hotspots

2019 ◽  
Vol 29 (5) ◽  
pp. 1333-1344 ◽  
Author(s):  
Qi Yang ◽  
Jianyin Miao ◽  
Jingquan Zhao ◽  
Yanpei Huang ◽  
Weichun Fu ◽  
...  
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Flow Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink

Mechanism of Critical Heat Flux for Convective Boiling of FC-72 in a Diverging Microchannel Heat Sink

2010 ◽  
Author(s):  
Chun Ting Lu ◽  
Chin Pan
Keyword(s):  
Heat Flux ◽  
Liquid Film ◽  
Critical Heat Flux ◽  
Heat Sink ◽  
Flow Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Convective Boiling

The present study explores experimentally the mechanism of critical heat flux (CHF) of FC-72 in a 10 parallel diverging microchannel heat sink with different distributions of artificial nucleation sites (ANS). The effects of mass flux and number of ANS with or without degassing on CHF of FC-72 are investigated. During CHF, flow visualization shows that the dryout of liquid film in annular flow appears near the outlet region with frequent rewetting of liquid film with slug bubble or rewetting of liquid column on the dryout surface. The results demonstrate that diverging microchannels with ANS distributed uniformly along the whole channel (Type-2 system) shows better flow boiling performance and higher CHF and can be recommended as a high-heat-flux microchannel heat sink. Moreover, five CHF correlations in the literature for flow boiling in microchannels are compared, which generally underpredict the CHF data of the present study. This suggests that the present diverging design with ANS enhances the CHF. The comparison also reveals that Bowers and Mudawar correlation predicts the present data best with MAE of 15.8% for the type-2 system.

High Heat Flux Liquid-Cooled Porous Metal Heat Sink

2003 ◽  
Author(s):  
Mark T. North ◽  
Wei-Lin Cho
Keyword(s):  
Heat Flux ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Laser Diode ◽  
High Power ◽  
Heat Sink ◽  
Porous Metal ◽  
High Heat ◽  
High Heat Flux ◽  
Laser Diode Arrays

An advanced heat sinking technology is described in which heat is dissipated by flowing the liquid coolant through a matrix of well-bonded metallic particles. This porous metal heat sink has the capability to dissipate heat flux of 500W/cm2 or more with a unit area thermal resistance of 0.1°C·cm2/W. The construction of one incarnation of this class of heat sink developed for cooling of a high-power stack of laser diode arrays is described. Tradeoffs between pressure drop and thermal resistance are identified with regard to particle size and other geometric parameters. The patented manifolding geometry allows the cooling area to be scaled up without significantly increasing the overall pressure drop. Experimental data showing thermal resistance and pressure drop at a variety of different water flow rates is also presented. Applications for this technology can include cooling of laser diode arrays and high power electronic components such as CPUs.

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