scholarly journals Thermal design optimization of electronic circuit board layout with transient heating chips by using Bayesian optimization and thermal network model

2021 ◽  
pp. 122263
Author(s):  
Daiki Otaki ◽  
Hirofumi Nonaka ◽  
Noboru Yamada
Keyword(s):  
Design Optimization ◽  
Network Model ◽  
Electronic Circuit ◽  
Thermal Design ◽  
Circuit Board ◽  
Bayesian Optimization ◽  
Transient Heating ◽  
Thermal Network

Practical Study of Application of Thermal Network Method to Thermal Design of Electronic Equipment: An Example for the Thermal Design of a Compact Self-Ballasted Fluorescent Lamp

2006 ◽  
Author(s):  
Masaru Ishizuka ◽  
Shinji Nakagawa ◽  
Katsuhiro Koizumi
Keyword(s):  
Network Model ◽  
Simulation Method ◽  
Thermal Design ◽  
Fluorescent Lamp ◽  
Simulated Model ◽  
Thermal Network ◽  
Fluorescent Lamps ◽  
Network Method ◽  
Thermal Network Method ◽  
Good Agreement

Thermal design is one of the most important issues in the development of compact self—ballasted fluorescent lamps as the demand for small yet powerful lamps is mounting. This paper proposes a simulation method that is based on a thermal network model for which a set of equations are developed. Some of the coefficients of the thermal network equations were determined experimentally using a simulated model lamp. The calculated temperatures are in good agreement with the measured temperatures. The work illustrates the usefulness of the proposed methodology in the design of compact self—ballasted fluorescent lamps.

Synthesis of CFD Analyses and Experiments in Developing a Thermal Network Model of a Simulated Heat Spreader Panel

2008 ◽  
Author(s):  
Masaru Ishizuka ◽  
Shinji Nakagawa ◽  
Tatsuro Yoshida ◽  
Wataru Nakayama
Keyword(s):  
Network Model ◽  
Thermal Environment ◽  
Thermal Characteristics ◽  
Thermal Design ◽  
Heat Sources ◽  
Heat Spreader ◽  
Thermal Network ◽  
Wide Range ◽  
Cfd Analyses ◽  
Panel Thickness

The object of the present study is a simulated heat spreader panel (80 × 100 × 0.8 mm3) which carries five distributed heat sources and a finned heat sink near one of its corners. The panel thickness is designed to minimize temperature variation over the heat sources. The panel and the wrapping insulation possess geometric and thermal characteristics commonly found in thin electronic products. Thin configuration increases the sensitivity of internal temperature to the variation of external thermal environment; that is, a significant level of uncertainties should be expected in the thermal design of such systems. The present study aims at the development of a methodology for thermal analysis of such thin systems. Uncertainties in the thermal environment demand the coverage of a wide range of relevant parameters by the analysis, and computations can be performed most efficiently with a thermal network model. To achieve the stated goal we performed CFD simulations and the experiments, and reduced the results into a thermal network model.

Control Method for Cooling Fans inside Traction Battery Boxes Installed in Battery Powered EMU Based on Thermal Network Model

2020 ◽  
Vol 140 (9) ◽  
pp. 625-632
Author(s):  
Yoshiaki Taguchi ◽  
Satoshi Kadowaki ◽  
Gaku Yoshikawa ◽  
Kenji Hatakeda ◽  
Takashi Kaneko
Keyword(s):  
Network Model ◽  
Control Method ◽  
Thermal Network ◽  
Cooling Fans

Self-Heating and Thermal Network Model for Complementary FET

2021 ◽  
pp. 1-6
Author(s):  
Songhan Zhao ◽  
Linlin Cai ◽  
Wangyong Chen ◽  
Yandong He ◽  
Gang Du
Keyword(s):  
Network Model ◽  
Self Heating ◽  
Thermal Network

Electrochemical Investigation Cu Corrosion Behaviour of Electronic Circuit Board in Base Electrolyte

2014 ◽  
Vol 556-562 ◽  
pp. 141-144
Author(s):  
Zhi Hua Tao ◽  
Bin Leng ◽  
Chong Wang ◽  
Ding Jun Xiao ◽  
Ze Tan ◽  
...  
Keyword(s):  
Potentiodynamic Polarization ◽  
Electronic Circuit ◽  
Corrosion Behaviour ◽  
Chloride Ions ◽  
Circuit Board ◽  
Corrosion Mechanism ◽  
Base Electrolyte ◽  
Eis Measurements ◽  
Inhibition Performance ◽  
Cu Corrosion

The eleetronic material, or even the whole equipments may be destroyed by very slight corrosion, so it is important to study the corrosion mechanism and corrosion protections. The Cyproconazole as a Cu corrosion inhibitor for Electronic Circuit Board in the base electrolyte (containing 70 ppm chloride ions, 0.54 mol/L H2SO4and 0.8 mol/L CuSO4) was investigated using polarization curves and AC impedance. The results showed that the inhibition performance of the Cyproconazole depended on the concentration of the inhibitor and the highest inhibition efficiency of the Cyproconazole reached 99.9% at 1×10-3mol/L in the base electrolyte. The results obtained from EIS measurements are in good agreement with that obtained from potentiodynamic polarization. Potentiodynamic polarization studies clearly revealed that Cyproconazole adsorption acted essentially as the mixed-type inhibitor.

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