Optical, morphological and mechanical properties of an Al–Al2O3 nanocomposite thin film grown by thermionic vacuum arc

Nanostructured C-Ag thin films of 200 nm thickness were successfully synthesized by the Thermionic Vacuum Arc (TVA) method. The influence of different substrates (glass, silicon wafers, and stainless steel) on the microstructure, morphology, and mechanical properties of nanostructured C-Ag thin films was characterized by High-Resolution Transmission Electron Microscopy (HRTEM), Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), and TI 950 (Hysitron) nanoindenter equipped with Berkovich indenter, respectively. The film’s hardness deposited on glass (HC-Ag/Gl = 1.8 GPa) was slightly lower than in the case of the C-Ag film deposited on a silicon substrate (HC-Ag/Si = 2.2 GPa). Also the apparent elastic modulus Eeff was lower for C-Ag/Gl sample (Eeff = 100 GPa) than for C-Ag/Si (Eeff = 170 GPa), while the values for average roughness are Ra=2.9 nm (C-Ag/Si) and Ra=10.6 (C-Ag/Gl). Using the modulus mapping mode, spontaneous and indentation-induced aggregation of the silver nanoparticles was observed for both C-Ag/Gl and C-Ag/Si samples. The nanocomposite C-Ag film exhibited not only higher hardness and effective elastic modulus, but also a higher fracture resistance toughness to the silicon substrate compared to the glass substrate.

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Al doped ZnO thin film deposition by thermionic vacuum arc

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-018-0329-x ◽

2018 ◽

Vol 30 (1) ◽

pp. 624-630 ◽

Cited By ~ 2

Author(s):

Mustafa Özgür ◽

Suat Pat ◽

Reza Mohammadigharehbagh ◽

Caner Musaoğlu ◽

Uğur Demirkol ◽

...

Keyword(s):

Thin Film ◽

Thin Film Deposition ◽

Film Deposition ◽

Vacuum Arc ◽

Zno Thin Film ◽

Doped Zno ◽

Thermionic Vacuum Arc

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Investigation of Al-doped CuO thin film deposition by the thermionic vacuum arc technique

Transactions of the IMF ◽

10.1080/00202967.2021.1974754 ◽

2021 ◽

pp. 1-6

Author(s):

Suat Pat ◽

Reza Mohammadigharehbagh ◽

Caner Musaoglu ◽

Soner Özen ◽

Şadan Korkmaz

Keyword(s):

Thin Film ◽

Thin Film Deposition ◽

Film Deposition ◽

Vacuum Arc ◽

Thermionic Vacuum Arc

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Thermionic Vacuum Arc—A Versatile Technology for Thin Film Deposition and Its Applications

Coatings ◽

10.3390/coatings10030211 ◽

2020 ◽

Vol 10 (3) ◽

pp. 211 ◽

Cited By ~ 1

Author(s):

Rodica Vladoiu ◽

Milan Tichý ◽

Aurelia Mandes ◽

Virginia Dinca ◽

Pavel Kudrna

Keyword(s):

Thin Film ◽

Arc Discharge ◽

Adhesive Layer ◽

Thin Film Deposition ◽

Film Deposition ◽

Hard Coatings ◽

Vacuum Arc ◽

Cathodic Arc Deposition ◽

Solid State Batteries ◽

Thermionic Vacuum Arc

This review summarizes the more-than-25-years of development of the so-called thermionic vacuum arc (TVA). TVA is an anodic arc discharge in vapors of the material to be deposited; the energy for its melting is delivered by means of a focused electron beam. The resulting material ions fall at the substrate where they form a well-adhesive layer; the ion energy is controllable. The deposited layers are, as a rule, free from droplets typical for cathodic arc deposition systems and the thermal stress of the substrates being coated is low. TVA is especially suitable for processing refractory metals, e.g., carbon or tungsten, however, in the course of time, various useful applications of this system originated. They include layers for fusion application, hard coatings, low-friction coatings, biomedical-applicable films, materials for optoelectronics, and for solid-state batteries. Apart from the diagnostic of the film properties, also the diagnostic of the TVA discharge itself as well as of the by TVA generated plasma was performed. The research and application of the TVA proceeds in broad international collaboration. At present, the TVA technology has found its firm place among the different procedures for thin film deposition.

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