Stability of stacking fault tetrahedron in twin boundary bicrystal copper under shear

2017 ◽  
Vol 97 ◽  
pp. 246-258 ◽  
Author(s):  
Lianping Wu ◽  
Wenshan Yu ◽  
Shuling Hu ◽  
Shengping Shen
Keyword(s):  
Twin Boundary ◽  
Stacking Fault ◽  
Stacking Fault Tetrahedron

Shear response of grain boundary bicrystals with a stacking fault tetrahedron

2018 ◽  
Vol 147 ◽  
pp. 137-144 ◽  
Author(s):  
Lianping Wu ◽  
Wenshan Yu ◽  
Shuling Hu ◽  
Shengping Shen
Keyword(s):  
Grain Boundary ◽  
Stacking Fault ◽  
Shear Response ◽  
Stacking Fault Tetrahedron

Interaction of Edge Dislocation With Stacking Fault Tetrahedron in Cu

2011 ◽  
Vol 134 (1) ◽  
Author(s):  
Jianfeng Jin ◽  
Hanchen Huang
Keyword(s):  
Yield Strength ◽  
Cross Section ◽  
Edge Dislocation ◽  
Driving Force ◽  
Stacking Fault ◽  
Morphological Transformation ◽  
Atomic Mechanism ◽  
Stacking Fault Tetrahedra ◽  
Stacking Fault Tetrahedron ◽  
Thermodynamic Driving Force

This paper reports an anomaly in the yield strength of dislocation interacting with stacking fault tetrahedra (SFT) in Cu, reveals atomic mechanisms that are responsible for the anomaly, and further shows the thermodynamic driving force for the atomic mechanisms to prevail. Instead of monotonically increasing with the area of intersection cross-section, the yield strength first increases and then decreases with the area. The decrease, or the anomaly, is due to a change of atomic mechanism of the interactions—the SFT goes through a morphological transformation. The thermodynamic driving force for the transformation derives from the competition between the elastic energy of dislocations and the stacking fault energy.

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