Influence of surface topography evolution of grinding wheel on the optimal material removal rate in grinding process of cemented carbide

2019 ◽  
Vol 80 ◽  
pp. 130-143 ◽  
Author(s):  
Yuzhou Zhang ◽  
Xipeng Xu
Keyword(s):  
Surface Topography ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Cemented Carbide ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Optimal Material

Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer

2004 ◽  
Vol 471-472 ◽  
pp. 362-368 ◽  
Author(s):  
Y.B. Tian ◽  
Ren Ke Kang ◽  
Dong Ming Guo ◽  
Zhu Ji Jin ◽  
Jian Xiu Su
Keyword(s):  
Material Removal Rate ◽  
Feed Rate ◽  
Rotational Speed ◽  
Material Removal ◽  
Removal Rate ◽  
Geometric Dimension ◽  
Grit Size ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Cup Wheel

In this paper, the formula of material removal rate (MRR) in wafer rotation grinding process is deduced based on kinematics. The main effect on MRR of the grit size and the process parameters, including the rotational speed of the cup grinding wheel, the down feed rate of the grinding wheel spindle and the rotational speed of the chuck table, is both theoretically and experimentally investigated. The influence on MRR of the cup wheel grinding status, the geometric dimension of the cup-grinding wheel, the rigidity of the grinding machine and the coolant is also analyzed. The investigating results show that, the increase of the grit size and the down feed rate of the cup grinding wheel results in great increase of the MRR; the MRR increases as the rotational speed of the cup wheel increases whereas the MRR reduces and the ground surface becomes bad due to size effect if the rotational speed of the cup wheel is overlarge; in normal grinding, the MRR decreases as the rotational speed of the chuck table increases. The results provide a theoretical basis to improve grinding efficiency, reduce grinding cost and select the proper parameters of grinding process.

Influence of Dielectric Jet Flushing during Electro Discharge Diamond Surface Grinding Process

2013 ◽  
Vol 652-654 ◽  
pp. 2187-2190
Author(s):  
Gopal Agarwal ◽  
Manoj Modi
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Electrical Discharge Machine ◽  
Surface Grinding ◽  
Machining Process ◽  
Diamond Surface ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Hybrid Machining Process

The influence of dielectric jet flushing during Electro Discharge Diamond Surface Grinding (EDDSG) on Ti-6A-4V has been reported in this paper. The metal bonded diamond grinding wheel is used as electrode in Electro Discharge Diamond Surface Grinding process. In this process mechanical grinding is coupled with electrical spark of electrical discharge machine to take up the advantages associated with hybrid machining process. The important input parameters in this investigation were “duty factor”, “wheel speed (rpm)”, “magnitude of current (ampere)” and its “duration (Ton, micro-second)”. The effects of these parameters on outcomes i.e. material removal rate (MRR) and surface roughness (Ra) are measured. The noticeable enhancements in material removal rate and surface finish have been seen during EDDSG of Ti-6Al-4V with effective jet flushing. The performance of EDDSG with jet flushing and without jet flushing has been compared.

scholarly journals Study on the Effect of Grinding Pressure on Material Removal Behavior Performed on a Self-Designed Passive Grinding Simulator

2021 ◽  
Vol 11 (9) ◽  
pp. 4128
Author(s):  
Peng-Zhan Liu ◽  
Wen-Jun Zou ◽  
Jin Peng ◽  
Xu-Dong Song ◽  
Fu-Ren Xiao
Keyword(s):  
Residual Stress ◽  
Surface Roughness ◽  
Service Life ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Grinding Temperature ◽  
Grinding Efficiency

Passive grinding is a new rail grinding strategy. In this work, the influence of grinding pressure on the removal behaviors of rail material in passive grinding was investigated by using a self-designed passive grinding simulator. Meanwhile, the surface morphology of the rail and grinding wheel were observed, and the grinding force and temperature were measured during the experiment. Results show that the increase of grinding pressure leads to the rise of rail removal rate, i.e., grinding efficiency, surface roughness, residual stress, grinding force and grinding temperature. Inversely, the enhancement of grinding pressure and grinding force will reduce the grinding ratio, which indicates that service life of grinding wheel decreases. The debris presents dissimilar morphology under different grinding pressure, which reflects the distinction in grinding process. Therefore, for rail passive grinding, the appropriate grinding pressure should be selected to balance the grinding quality and the use of grinding wheel.

Development of a New Plate Polishing Technique with an Instantaneous Tiny-Grinding Wheel Cluster Based on Magnetorheological Effect

2008 ◽  
Vol 53-54 ◽  
pp. 155-160 ◽  
Author(s):  
Qiu Sheng Yan ◽  
Ai Jun Tang ◽  
Jia Bin Lu ◽  
Wei Qiang Gao
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Wheel ◽  
Abrasive Particles ◽  
Magnetorheological Effect ◽  
Material Removal Model ◽  
Mr Effect ◽  
Removal Model

A new plate polishing technique with an instantaneous tiny-grinding wheel cluster based on the magnetorheological (MR) effect is presented in this paper, and some experiments were conducted to prove its effectiveness and applicability. Under certain experimental condition, the material removal rate was improved by a factor of 20.84% as compared with the conventional polishing methods with dissociative abrasive particles, while the surface roughness of the workpiece was not obviously increased. Furthermore, the composite of the MR fluid was optimized to obtain the best polishing performance. On the basis of the experimental results, the material removal model of the new plate polishing technique was presented.

Parametric Study of Micro Machining Three Dimensional Microstructure with the Tiny-Grinding Wheel Based on the EMR Effect

2010 ◽  
Vol 447-448 ◽  
pp. 193-197
Author(s):  
Wei Qiang Gao ◽  
Qiu Sheng Yan ◽  
Yi Liu ◽  
Jia Bin Lu ◽  
Ling Ye Kong
Keyword(s):  
Magnetic Field ◽  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Rotation Speed ◽  
Optical Glass ◽  
Removal Rate ◽  
Grinding Wheel ◽  
Machining Time ◽  
Fluctuation Phenomenon

Electro-magneto-rheological (EMR) fluids, which exhibit Newtonian behavior in the absence of a magnetic field, are abruptly transformed within milliseconds into a Bingham plastic under an applied magnetic field, called the EMR effect. Based on this effect, the particle-dispersed EMR fluid is used as a special instantaneous bond to cohere abrasive particles and magnetic particles together so as to form a dynamical, flexible tiny-grinding wheel to machine micro-groove on the surface of optical glass. Experiments were conducted to reveal the effects of process parameters, such as the feed rate of the horizontal worktable, feeding of the Z axis, machining time and machining gap, on material removal rate of glass. The results indicate that the feed rate of the worktable at horizontal direction has less effect on material removal rate, which shows a fluctuation phenomenon within a certain range. The feed rate of the Z axis directly influences the machining gap and leads to a remarkable change on material removal rate. Larger material removal rate can be obtained when the feeding frequency of Z direction is one time per processing. With the increase of rotation speed of the tool, material removal rate increases firstly and decreases afterwards, and it gets the maximum value with the rotation speed of 4800 rev/min. The machining time is directly proportional to material removal amount, but inversely proportional to material removal rate. Furthermore, material removal rate decreases with the increase of the machining gap between the tool and the workpiece. On the basis of above, the machining mode with the tiny-grinding wheel based on the EMR effect is presented.

Material Removal Model and Experimental Verification for Abrasive Jet Precision Finishing with Wheel as Restraint

2006 ◽  
Vol 304-305 ◽  
pp. 555-559 ◽  
Author(s):  
Chang He Li ◽  
Guang Qi Cai ◽  
Shi Chao Xiu ◽  
Q. Li
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Experimental Results ◽  
Grinding Wheel ◽  
Rate Model ◽  
Material Removal Model ◽  
Material Removal Rate Model ◽  
Three Body ◽  
Precision Finishing

The material removal rate (MRR) model was investigated in abrasive jet precision finishing (AJPF) with wheel as restraint. When abrasive wore and workpiece surface micro-protrusion removed, the size ratio for characteristic particle size to minimum film thickness gradually diminishing, the abrasive machining from two-body lapping to three-body polishing transition in AJPF with grinding wheel as restraint. In the study, the material removal rate model was established according to machining mechanisms and machining modes from two-body to three-body process transition condition, and active number of particles in grinding zone were calculated and simulated. Experiments were performed in the plane grinder for material removal mechanism and academic models verification. It can be observed from experimental results that the surface morphology change dramatically to a grooved or micro-machined surface with all the grooves aligned in the sliding direction in two-body lapping mode. On the other hand, the surface is very different, consists of a random machining pits with very little sign of any directionality to the deformation in the three-body machining mode. Furthermore, the material removal rate model was found to give a good description of the experimental results.

scholarly journals Model Based on an Effective Material-Removal Rate to Evaluate Specific Energy Consumption in Grinding

Materials ◽  
2019 ◽  
Vol 12 (6) ◽  
pp. 939 ◽  
Author(s):  
Amelia Nápoles Alberro ◽  
Hernán González Rojas ◽  
Antonio Sánchez Egea ◽  
Saqib Hameed ◽  
Reyna Peña Aguilar
Keyword(s):  
Energy Consumption ◽  
Material Removal Rate ◽  
Specific Energy ◽  
Chip Formation ◽  
Material Removal ◽  
Removal Rate ◽  
Specific Energy Consumption ◽  
Industrial Scale ◽  
Depth Of Cut ◽  
Grinding Process

Grinding energy efficiency depends on the appropriate selection of cutting conditions, grinding wheel, and workpiece material. Additionally, the estimation of specific energy consumption is a good indicator to control the consumed energy during the grinding process. Consequently, this study develops a model of material-removal rate to estimate specific energy consumption based on the measurement of active power consumed in a plane surface grinding of C45K with different thermal treatments and AISI 304. This model identifies and evaluates the dissipated power by sliding, ploughing, and chip formation in an industrial-scale grinding process. Furthermore, the instantaneous positions of abrasive grains during cutting are described to study the material-removal rate. The estimation of specific chip-formation energy is similar to that described by other authors on a laboratory scale, which allows to validate the model and experiments. Finally, the results show that the energy consumed by sliding is the main mechanism of energy dissipation in an industrial-scale grinding process, where it is denoted that sliding energy by volume unity decreases as the depth of cut and the speed of the workpiece increase.

Modeling of Material Removal Rate in Micro-ECG Process

2008 ◽  
Vol 130 (3) ◽  
Author(s):  
Kishore S. Gaikwad ◽  
Suhas S. Joshi
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Analytical Modeling ◽  
Cfd Simulation ◽  
Removal Rate ◽  
Streaming Potential ◽  
Grinding Wheel ◽  
Abrasive Action ◽  
Interelectrode Gap ◽  
Electrochemical Grinding

Microelectrochemical grinding (micro-ECG) is a variant of electrochemical grinding (ECG) process, in which material is removed by a combination of electrolytic dissolution and abrasive action that take place in a small interelectrode gap. This paper discusses analytical modeling of the material removal phenomenon in micro-ECG process to predict material removal rate. In the model, the phenomena, which contribute to the material removal in the process by electrolytic and abrasive actions, have been considered; these include streaming potential in the electrochemical action and shearing forces due to the flow of electrolyte through interelectrode gap and the abrasive action of grinding wheel. Two configurations of the process, viz., surface and cylindrical micro-ECG, have been modeled. The results have been validated by CFD simulation in the case of surface micro-ECG process, and specific experimentation in the case of cylindrical micro-ECG process.

High Efficient Mechanism of Material Removal in Two-Dimensional Ultrasonic Grinding from the Locus Perspective

2009 ◽  
Vol 416 ◽  
pp. 609-613
Author(s):  
Ming Li Zhao ◽  
Bo Zhao ◽  
Yu Qing Wang ◽  
Guo Fu Gao
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Material Surface ◽  
Grinding Wheel ◽  
Two Dimensional ◽  
Abrasive Grains ◽  
Ultrasonic Grinding ◽  
High Efficient

Relative motion of single abrasive is analyzed for the different applied directions of longitudinal ultrasonic vibration, and its locus is simulated in the present paper. The research results show that the locus in two-dimensional ultrasonic vibration is only similar to that in y-direction, and both are close to sinusoid curves. The width of grooves scratched by abrasive grains y-direction (axial direction of grinding wheel) is two times of the vibration amplitude, and the material removal rate increases remarkably. In case of x-direction (tangential direction of grinding wheel) ultrasonic vibration, abrasive grains with periodic force impact material surface with high frequency vibration, which make material fracture removal easy. Therefore, the high efficiency essence of material removal in two-dimensional ultrasonic grinding is revealed in view of locus. In addition, according to the results of grinding experiments, under same conditions good surface quality can be obtained in two-dimensional ultrasonic grinding and material removal rate in common grinding is the lowest. Consequently it is further proved that the method of two-dimensional ultrasonic vibration grinding is an effective one for ceramic materials.

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