scholarly journals Detectability evaluation of attributes anomaly for electronic components using pulsed thermography

2020 ◽  
Vol 111 ◽  
pp. 103513
Author(s):  
Haochen Liu ◽  
Lawrence Tinsley ◽  
Sri Addepalli ◽  
Xiaochen Liu ◽  
Andrew Starr ◽  
...  
Keyword(s):  
Electronic Components ◽  
Pulsed Thermography

scholarly journals A Novel Inspection Technique for Electronic Components Using Thermography (NITECT)

Sensors ◽  
2020 ◽  
Vol 20 (17) ◽  
pp. 5013
Author(s):  
Haochen Liu ◽  
Lawrence Tinsley ◽  
Wayne Lam ◽  
Sri Addepalli ◽  
Xiaochen Liu ◽  
...  
Keyword(s):  
Critical Systems ◽  
Electronic Components ◽  
Pulsed Thermography ◽  
Quantitative Classification ◽  
High Hazard ◽  
Classification Evaluation ◽  
Twin Methodology ◽  
Inspection Techniques ◽  
Simulation Unit ◽  
Different Sources

Unverified or counterfeited electronic components pose a big threat globally because they could lead to malfunction of safety-critical systems and reduced reliability of high-hazard assets. The current inspection techniques are either expensive or slow, which becomes the bottleneck of large volume inspection. As a complement of the existing inspection capabilities, a pulsed thermography-based screening technique is proposed in this paper using a digital twin methodology. A FEM-based simulation unit is initially developed to simulate the internal structure of electronic components with deviations of multiple physical properties, informed by X-ray data, along with its thermal behaviour under exposure to instantaneous heat. A dedicated physical inspection unit is then integrated to verify the simulation unit and further improve the simulation by taking account of various uncertainties caused by equipment and samples. Principle component analysis is used for feature extraction, and then a set of machine learning-based classifiers are employed for quantitative classification. Evaluation results of 17 chips from different sources successfully demonstrate the effectiveness of the proposed technique.

Finite Element Analysis applied on the Cooling of Electronic Components

2018 ◽  
Author(s):  
Luís Henrique Carnevale da Cunha ◽  
Gustavo Rabello dos Anjos ◽  
Norberto Mangiavacchi
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Electronic Components ◽  
Element Analysis

BERYLCO NICKEL ALLOY 440

Alloy Digest ◽  
1975 ◽  
Vol 24 (9) ◽  
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Nickel Alloy ◽  
High Strength ◽  
Heat Treating ◽  
Electronic Components ◽  
High Temperature Mechanical Properties ◽  
Temperature Performance ◽  
Solution Treated ◽  
Complex Shapes

Abstract BERYLCO NICKEL ALLOY 440 is an age-hardenable nickel-beryllium-titanium alloy that offers high strength, excellent spring properties outstanding formability, good high-temperature mechanical properties, and resistance to corrosion and fatigue. Complex shapes can be produced in the solution-treated (soft) condition and then aged to a minimum tensile strength of 215,500 psi. It is used for mechanical and electrical/electronic components in the temperature range -320 to 800 F. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as fracture toughness. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Ni-94. Producer or source: Kawecki Berylco Industries Inc.. Originally published September 1964, revised September 1975.

HPM 233

Alloy Digest ◽  
2006 ◽  
Vol 55 (4) ◽  
Keyword(s):  
Corrosion Resistance ◽  
Physical Properties ◽  
Tensile Properties ◽  
Heat Treating ◽  
Low Carbon ◽  
Electronic Components

Abstract HPM 233 is a wrought nickel with low carbon. The alloy is used in electrical and electronic components. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Ni-635. Producer or source: Hamilton Precision Metals.

PCB Related Field Failures with ImAg Surface Finishes

2007 ◽  
Author(s):  
Anil Kurella ◽  
Aravind Munukutla ◽  
J.S. Lewis
Keyword(s):  
Emerging Markets ◽  
Galvanic Corrosion ◽  
Electrochemical Migration ◽  
Copper Sulphide ◽  
Electronic Components ◽  
Related Field ◽  
Surface Finishes ◽  
Immersion Silver ◽  
Manufacturing Environments

Abstract PCB surface finishes like Immersion silver (ImAg) are commonly used in Pb-free manufacturing environments following RoHS legislation. With this transition, however the numbers of field failures associated with electrochemical migration, copper sulphide corrosion, via barrel galvanic corrosion are on a steady rise. More often than not ImAg surfaces seem to assist these failing signatures. As computers penetrate into emerging markets with humid and industrialized environments there is a greater concern on the reliability and functionality of these electronic components.

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