Parametric study using a curved shell finite element to dynamic analysis of footbridge under rhythmic loading

Structures ◽  
2021 ◽  
Vol 34 ◽  
pp. 135-148
Author(s):  
Humberto C. Becerra ◽  
Amilton R. Silva
2014 ◽  
Vol 4 (4) ◽  
pp. 26-33
Author(s):  
P.Deepak Kumar ◽  
◽  
Ishan Sharma ◽  
P.R. Maiti ◽  
◽  
...  

2019 ◽  
Author(s):  
Miguel Abambres ◽  
Dinar Camotim ◽  
Miguel Abambres

A 2nd order inelastic Generalised Beam Theory (GBT) formulation based on the J2 flow theory is proposed, being a promising alternative to the shell finite element method. Its application is illustrated for an I-section beam and a lipped-C column. GBT results were validated against ABAQUS, namely concerning equilibrium paths, deformed configurations, and displacement profiles. It was concluded that the GBT modal nature allows (i) precise results with only 22% of the number of dof required in ABAQUS, as well as (ii) the understanding (by means of modal participation diagrams) of the behavioral mechanics in any elastoplastic stage of member deformation .


2018 ◽  
Author(s):  
Miguel Abambres

Original Generalized Beam Theory (GBT) formulations for elastoplastic first and second order (postbuckling) analyses of thin-walled members are proposed, based on the J2 theory with associated flow rule, and valid for (i) arbitrary residual stress and geometric imperfection distributions, (ii) non-linear isotropic materials (e.g., carbon/stainless steel), and (iii) arbitrary deformation patterns (e.g., global, local, distortional, shear). The cross-section analysis is based on the formulation by Silva (2013), but adopts five types of nodal degrees of freedom (d.o.f.) – one of them (warping rotation) is an innovation of present work and allows the use of cubic polynomials (instead of linear functions) to approximate the warping profiles in each sub-plate. The formulations are validated by presenting various illustrative examples involving beams and columns characterized by several cross-section types (open, closed, (un) branched), materials (bi-linear or non-linear – e.g., stainless steel) and boundary conditions. The GBT results (equilibrium paths, stress/displacement distributions and collapse mechanisms) are validated by comparison with those obtained from shell finite element analyses. It is observed that the results are globally very similar with only 9% and 21% (1st and 2nd order) of the d.o.f. numbers required by the shell finite element models. Moreover, the GBT unique modal nature is highlighted by means of modal participation diagrams and amplitude functions, as well as analyses based on different deformation mode sets, providing an in-depth insight on the member behavioural mechanics in both elastic and inelastic regimes.


Author(s):  
Ah-Young Park ◽  
Satish Chaparala ◽  
Seungbae Park

Through-silicon via (TSV) technology is expected to overcome the limitations of I/O density and helps in enhancing system performance of conventional flip chip packages. One of the challenges for producing reliable TSV packages is the stacking and joining of thin wafers or dies. In the case of the conventional solder interconnections, many reliability issues arise at the interface between solder and copper bump. As an alternative solution, Cu-Cu direct thermo-compression bonding (CuDB) is a possible option to enable three-dimension (3D) package integration. CuDB has several advantages over the solder based micro bump joining, such as reduction in soldering process steps, enabling higher interconnect density, enhanced thermal conductivity and decreased concerns about intermetallic compounds (IMC) formation. Critical issue of CuDB is bonding interface condition. After the bonding process, Cu-Cu direct bonding interface is obtained. However, several researchers have reported small voids at the bonded interface. These defects can act as an initial crack which may lead to eventual fracture of the interface. The fracture could happen due to the thermal expansion coefficient (CTE) mismatch between the substrate and the chip during the postbonding process, board level reflow or thermal cycling with large temperature changes. In this study, a quantitative assessment of the energy release rate has been made at the CuDB interface during temperature change finite element method (FEM). A parametric study is conducted to analyze the impact of the initial crack location and the material properties of surrounding materials. Finally, design recommendations are provided to minimize the probability of interfacial delamination in CuDB.


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