Growth kinetics of Cu–Sn intermetallic compounds at the interface of a Cu substrate and 42Sn–58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints
2008 ◽
Vol 110
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pp. 95-99
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2004 ◽
Vol 10
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pp. 123-131
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2015 ◽
Vol 26
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2005 ◽
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2017 ◽
Vol 56
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2020 ◽
Vol 818
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pp. 152893
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2015 ◽
Vol 15
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pp. 8593-8600
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