Study on the relationship between crystal plane orientation and strength of electrolytic copper foil

2021 ◽  
pp. 161044
Author(s):  
Jianli Zhang ◽  
Haibo Chen ◽  
Binfeng Fan ◽  
Haipeng Shan ◽  
Qiang Chen ◽  
...  
Keyword(s):  
Copper Foil ◽  
Crystal Plane ◽  
Plane Orientation ◽  
Electrolytic Copper ◽  
The Relationship

Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil

2013 ◽  
Author(s):  
Takuya Nagayama ◽  
Hiroaki Yoshida ◽  
Ikuo Shohji
Keyword(s):  
Mechanical Properties ◽  
Grain Size ◽  
Copper Foil ◽  
Disodium Salt ◽  
The Other ◽  
Hydroxyethyl Cellulose ◽  
Fatigue Properties ◽  
Electrolytic Copper ◽  
Effect Of Additives ◽  
Sulfopropyl Disulfide

The effect of additives in electrolyte on mechanical properties of electrolytic copper foil was investigated. Bis-(3-sulfopropyl)-disulfide disodium salt (SPS), animal protein of low molecular (PBF) and hydroxyethyl cellulose (HEC) were added in electrolyte as additives. The additive amount of SPS was changed in this study. The addition of SPS is effective to improve tensile strength and hardness of electrolytic copper foil. With increasing the additive amount of SPS, the grain of electrolytic copper became finer and thus its hardness and elastic modulus increased. On the other hand, fatigue properties improved when the additive amount of SPS decreased and the grain size of electrolytic copper became relative large.

Influence of P+-Implantation and Post-Annealing on Warpage Structure of 4H-SiC Wafers

2014 ◽  
Vol 778-780 ◽  
pp. 449-452 ◽  
Author(s):  
Kotaro Ishiji ◽  
Seiji Kawado ◽  
Yasuharu Hirai ◽  
Shinji Nagamachi
Keyword(s):  
Raman Spectroscopy ◽  
Crystal Plane ◽  
X Ray ◽  
Lattice Disorder ◽  
Annealing Temperatures ◽  
Post Annealing ◽  
The Relationship ◽  
Monochromatic Synchrotron

We examined the warpage structure in epitaxial 4H-SiC wafers subjected to phosphorus-ion (P+) implantation and post-annealing with varying implantation and annealing temperatures, using glazing-incidence monochromatic synchrotron X-ray topography. Using Raman spectroscopy, we then studied the relationship between the warpage of the crystal plane in the underlying epilayer and the recovery of lattice disorder in the implanted layer. We determined that the warpage structure of the underlying SiC epilayer was closely correlated with the recovery of lattice disorder in the implanted layer.

The effect of (00l) crystal plane orientation on the thermoelectric properties of Bi2Te3 thin film

2011 ◽  
Vol 151 (21) ◽  
pp. 1520-1523 ◽  
Author(s):  
Zhiwei Zhang ◽  
Yao Wang ◽  
Yuan Deng ◽  
Yibin Xu
Keyword(s):  
Thin Film ◽  
Thermoelectric Properties ◽  
Crystal Plane ◽  
Plane Orientation

Characteristics of surface microprofile of electrolytic copper foil with high adherence to insulator

2004 ◽  
Vol 77 (10) ◽  
pp. 1653-1661
Author(s):  
L. A. Kuznetsova ◽  
I. V. Semiletova ◽  
E. I. Makogina
Keyword(s):  
Copper Foil ◽  
Electrolytic Copper ◽  
High Adherence

scholarly journals The Development of High-Current Power Supply System for Electrolytic Copper Foil

2015 ◽  
Vol 15 (2) ◽  
pp. 399-410 ◽  
Author(s):  
An Luo ◽  
Fujun Ma ◽  
Qiaopo Xiong ◽  
Zhixing He
Keyword(s):  
Power Supply ◽  
Copper Foil ◽  
Power Supply System ◽  
Supply System ◽  
High Current ◽  
Electrolytic Copper

scholarly journals Discoloration Resistance of Electrolytic Copper Foil Following 1,2,3-Benzotriazole Surface Treatment with Sodium Molybdate

Coatings ◽  
2018 ◽  
Vol 8 (12) ◽  
pp. 427 ◽  
Author(s):  
Dong-Jun Shin ◽  
Yu-Kyoung Kim ◽  
Jeong-Mo Yoon ◽  
Il-Song Park
Keyword(s):  
Surface Treatment ◽  
Photoelectron Spectroscopy ◽  
Copper Foil ◽  
Deposition Time ◽  
Film Formation ◽  
Electrochemical Corrosion ◽  
Sodium Molybdate ◽  
Surface Characteristics ◽  
Protective Film ◽  
Electrolytic Copper

The copper which an important component in the electronics industry, can suffer from discoloration and corrosion. The electrolytic copper foil was treated by 1,2,3-benzo-triazole (BTA) for an environmentally friendly non-chromate surface treatment. It was designed to prevent discoloration and improve corrosion resistance, consisted of BTA and inorganic sodium molybdate (Na2MoO4). Also the ratio of the constituent compounds and the deposition time were varied. Electrochemical corrosion of the Cu-BTA was evaluated using potentiodynamic polarization. Discoloration was analyzed after humidity and heat resistance conditioning. Surface characteristics were evaluated using scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). Increasing corrosion potential and decreasing current density were observed with increasing Na2MoO4 content. A denser protective coating formed as the deposition time increased. Although chromate treatment under severe humidity (80% humidity, 80 °C, 100 h) provided the highest humidity resistance, surface treatment with Na2MoO4 had better heat discoloration inhibition under severe heat-resistant conditions (180 °C, 10 min). When BTA reacts with Cu to form the Cu-BTA-type insoluble protective film, Na2MoO4 accelerates the film formation without being itself adsorbed onto the film. Therefore, the addition of Na2MoO4 increased anticorrosive efficiency through direct/indirect action.

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