Effect of particle size distributions on the rheology of Sn/Ag/Cu lead-free solder pastes

Materials & Design (1980-2015) ◽

10.1016/j.matdes.2009.07.001 ◽

2010 ◽

Vol 31 (1) ◽

pp. 594-598 ◽

Author(s):

S.S. Zhang ◽

Y.J. Zhang ◽

H.W. Wang

Keyword(s):

Particle Size ◽

Lead Free ◽

Lead Free Solder ◽

Size Distributions ◽

Particle Size Distributions ◽

Effect Of Particle Size ◽

Solder Pastes ◽

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Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead‐free solder pastes

Soldering & Surface Mount Technology ◽

10.1108/09540911111120140 ◽

2011 ◽

Vol 23 (2) ◽

pp. 75-84 ◽

Author(s):

A.E. Marks ◽

N.N. Ekere ◽

S. Mallik ◽

R. Bhatti

Keyword(s):

Particle Size ◽

Particle Size Distribution ◽

Size Distribution ◽

Lead Free ◽

Creep Recovery ◽

Lead Free Solder ◽

Effect Of Particle Size ◽

Recovery Performance ◽

Solder Pastes ◽

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Employment of roll-offset printing for fabrication of solder bump arrays: Harnessing the rheological properties of lead-free solder pastes using particle size distribution

Microelectronic Engineering ◽

10.1016/j.mee.2016.07.012 ◽

2016 ◽

Vol 164 ◽

pp. 128-134 ◽

Author(s):

Min-Jung Son ◽

Inyoung Kim ◽

Sangsun Yang ◽

Taik-Min Lee ◽

Hoo-Jeong Lee

Keyword(s):

Particle Size ◽

Particle Size Distribution ◽

Rheological Properties ◽

Size Distribution ◽

Solder Bump ◽

Lead Free ◽

Lead Free Solder ◽

Offset Printing ◽

Solder Pastes ◽

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Rheological Characterisation and Empirical Modelling of Lead-Free Solder Pastes and Isotropic Conductive Adhesive Pastes

Lead-free Solders ◽

10.1520/stp49329s ◽

2011 ◽

pp. 186-186-18

Author(s):

R. Durairaj ◽

Lam Wai Man ◽

S. Ramesh

Keyword(s):

Conductive Adhesive ◽

Lead Free ◽

Lead Free Solder ◽

Empirical Modelling ◽

Isotropic Conductive Adhesive ◽

Solder Pastes ◽

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The effect of particle size distributions on the dynamics of falling precipitation zones

10.1080/00046973.1973.9648360 ◽

1973 ◽

Vol 11 (4) ◽

pp. 179-188 ◽

Author(s):

Roland List ◽

Terry L. Clark

Keyword(s):

Particle Size ◽

Size Distributions ◽

Particle Size Distributions ◽

Effect Of Particle Size

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In-situ Non-destructive Ultrasonic Rheology Technique for Monitoring Different Lead-free Solder Pastes for Surface Mount Applications

2008 10th Electronics Packaging Technology Conference ◽

10.1109/eptc.2008.4763635 ◽

2008 ◽

Author(s):

A. Seman ◽

N.N. Ekere ◽

S.J. Ashenden ◽

S. Mallik ◽

A.E. Marks ◽

...

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Surface Mount ◽

Solder Pastes ◽

Free Solder ◽

Non Destructive

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Micro-Scale Solder Joints between Cu-Cu Wires Formed by Nanoparticle Enabled Lead-Free Solder Pastes

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.106 ◽

2016 ◽

Author(s):

Evan Wernicki ◽

Edward Fratto ◽

Yang Shu ◽

Fan Gao ◽

Zhiyong Gu

Keyword(s):

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Micro Scale ◽

Solder Pastes ◽

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Understanding the process window for printing lead-free solder pastes

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853398 ◽

2002 ◽

Author(s):

T.A. Nguty ◽

S. Budiman ◽

D. Rajkumar ◽

R. Solomon ◽

N.N. Ekere ◽

...

Keyword(s):

Lead Free ◽

Process Window ◽

Lead Free Solder ◽

Solder Pastes ◽

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Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics

Microelectronics Reliability ◽

10.1016/j.microrel.2017.09.022 ◽

2017 ◽

Vol 78 ◽

pp. 311-318 ◽

Author(s):

Muhammad Aamir ◽

Riaz Muhammad ◽

Naseer Ahmed ◽

Muhammad Waqas

Keyword(s):

Mechanical Properties ◽

Particle Size ◽

Intermetallic Compound ◽

Thermal Aging ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder ◽

Compound Particle ◽

Green Electronics

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Effect of particle size distributions of activated sludges on cross-flow microfiltration flux for submerged membranes

Journal of Fermentation and Bioengineering ◽

10.1016/s0922-338x(97)81141-5 ◽

1997 ◽

Vol 83 (6) ◽

pp. 583-589 ◽

Author(s):

Yasutoshi Shimizu ◽

Katsushi Uryu ◽

Yu-Ichi Okuno ◽

Sadami Ohtubo ◽

Atsuo Watanabe

Keyword(s):

Particle Size ◽

Size Distributions ◽

Particle Size Distributions ◽

Effect Of Particle Size

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Effect of particle size distributions on absorbance spectra of gold nanoparticles

Physica E Low-dimensional Systems and Nanostructures ◽

10.1016/j.physe.2010.01.004 ◽

2010 ◽

Vol 42 (5) ◽

pp. 1605-1609 ◽

Author(s):

J. Doak ◽

R.K. Gupta ◽

K. Manivannan ◽

K. Ghosh ◽

P.K. Kahol

Keyword(s):

Particle Size ◽

Gold Nanoparticles ◽

Size Distributions ◽

Particle Size Distributions ◽

Effect Of Particle Size ◽

Absorbance Spectra

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