Employment of roll-offset printing for fabrication of solder bump arrays: Harnessing the rheological properties of lead-free solder pastes using particle size distribution

2016 ◽  
Vol 164 ◽  
pp. 128-134 ◽  
Author(s):  
Min-Jung Son ◽  
Inyoung Kim ◽  
Sangsun Yang ◽  
Taik-Min Lee ◽  
Hoo-Jeong Lee
Keyword(s):  
Particle Size ◽  
Particle Size Distribution ◽  
Rheological Properties ◽  
Size Distribution ◽  
Solder Bump ◽  
Lead Free ◽  
Lead Free Solder ◽  
Offset Printing ◽  
Solder Pastes ◽  
Free Solder

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers

2013 ◽  
Vol 2013 (1) ◽  
pp. 000420-000423
Author(s):  
Kwang-Seong Choi ◽  
Ho-Eun Bae ◽  
Haksun Lee ◽  
Hyun-Cheol Bae ◽  
Yong-Sung Eom
Keyword(s):  
Screen Printing ◽  
Flip Chip ◽  
Solder Bump ◽  
Low Cost ◽  
Organic Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermally Activated ◽  
Fine Pitch ◽  
Free Solder

A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process with the result that a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology can be easily implemented. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 μm is, successfully, formed.

scholarly journals Effect of particle size distribution on rheological properties of chocolate

2020 ◽  
Vol 11 (11) ◽  
pp. 9547-9559
Author(s):  
Annika Feichtinger ◽  
Elke Scholten ◽  
Guido Sala
Keyword(s):  
Surface Roughness ◽  
Particle Size ◽  
Particle Size Distribution ◽  
Rheological Properties ◽  
Size Distribution ◽  
Particle Shape ◽  
Size Ratio ◽  
Particle Size Ratio ◽  
Effect Of Particle Size

Particle size distribution and particle size ratio have an important effect on rheological properties of model chocolate samples, but also other factors like particle shape, surface roughness and hydrophilicity should be taken into account.

Sign in / Sign up

Export Citation Format

Share Document