scholarly journals Simultaneous improvement of plasticity and strength of metallic glasses by tailoring residual stress: Role of stress gradient on shear banding

2021 ◽  
Vol 197 ◽  
pp. 109246
Author(s):  
Lei Zhao ◽  
Dongxue Han ◽  
Shuai Guan ◽  
Xianzheng Lu ◽  
Kangcheung Chan ◽  
...  
2004 ◽  
Vol 19 (1) ◽  
pp. 46-57 ◽  
Author(s):  
C.A. Schuh ◽  
T.G. Nieh

The development of instrumented nanoindentation equipment has occurred concurrently with the discovery of many new families of bulk metallic glass during the past decade. While indentation testing has long been used to assess the mechanical properties of metallic glasses, depth-sensing capabilities offer a new approach to study the fundamental physics behind glass deformation. This article is a succinct review of the research to date on the indentation of metallic glasses. In addition to standard hardness measurements, the onset of plasticity in metallic glasses is reviewed as well as the role of shear banding in indentation, structural changes beneath the indenter, and rate-dependent effects measured by nanoindentation. The article concludes with perspectives about the future directions for nanocontact studies on metallic glasses.


2010 ◽  
Vol 25 (2) ◽  
pp. 283-291 ◽  
Author(s):  
Lincai Zhang ◽  
Feng Jiang ◽  
Yanglei Zhao ◽  
Shibin Pan ◽  
Lin He ◽  
...  

Zr52.5Cu17.9Ni14.6Al10Ti5 bulk metallic glass (BMG) alloy samples in both rod and plate geometry were prepared. Different free volume states were obtained through thermal treatment. The plastic deformation ability of the BMGs was investigated through both a three-point bending test and compression test. The three-point bending results reveal the important role of free volume content on the formation of multiple shear bands, as the shear band propagation can be efficiently stopped due to the existence of the stress gradient from the surface to the neutral plane. In compression, the sample size rather than free volume controls the shear banding behavior.


2019 ◽  
Vol 119 ◽  
pp. 156-170 ◽  
Author(s):  
K. Kosiba ◽  
D. Şopu ◽  
S. Scudino ◽  
L. Zhang ◽  
J. Bednarcik ◽  
...  

Metals ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 629
Author(s):  
Nana Kwabena Adomako ◽  
Sung Hoon Kim ◽  
Ji Hong Yoon ◽  
Se-Hwan Lee ◽  
Jeoung Han Kim

Residual stress is a crucial element in determining the integrity of parts and lifetime of additively manufactured structures. In stainless steel and Ti-6Al-4V fabricated joints, residual stress causes cracking and delamination of the brittle intermetallic joint interface. Knowledge of the degree of residual stress at the joint interface is, therefore, important; however, the available information is limited owing to the joint’s brittle nature and its high failure susceptibility. In this study, the residual stress distribution during the deposition of 17-4PH stainless steel on Ti-6Al-4V alloy was predicted using Simufact additive software based on the finite element modeling technique. A sharp stress gradient was revealed at the joint interface, with compressive stress on the Ti-6Al-4V side and tensile stress on the 17-4PH side. This distribution is attributed to the large difference in the coefficients of thermal expansion of the two metals. The 17-4PH side exhibited maximum equivalent stress of 500 MPa, which was twice that of the Ti-6Al-4V side (240 MPa). This showed good correlation with the thermal residual stress calculations of the alloys. The thermal history predicted via simulation at the joint interface was within the temperature range of 368–477 °C and was highly congruent with that obtained in the actual experiment, approximately 300–450 °C. In the actual experiment, joint delamination occurred, ascribable to the residual stress accumulation and multiple additive manufacturing (AM) thermal cycles on the brittle FeTi and Fe2Ti intermetallic joint interface. The build deflected to the side at an angle of 0.708° after the simulation. This study could serve as a valid reference for engineers to understand the residual stress development in 17-4PH and Ti-6Al-4V joints fabricated with AM.


Materials ◽  
2020 ◽  
Vol 14 (1) ◽  
pp. 39
Author(s):  
Qi Chen ◽  
Zhicheng Yan ◽  
Hao Zhang ◽  
KiBuem Kim ◽  
Weimin Wang

Al-based metallic glasses have a special atomic structure and should have a unique degradation ability in azo dye solutions. The Al88Ni9Y3 (Y3), Al85Ni9Y6 (Y6) and Al82Ni9Y9 (Y9) glassy ribbons are melt spun and used in degrading methyl orange (MO) azo dye solution with adding H2O2. With increasing cY, the as-spun ribbons have an increasing GFA (glass formability) and gradually decreased the degradation rate of MO solution. TEM (transmission electron microscopy) results show that the Y3 ribbon has nano-scale crystallites, which may form the channels to transport elements to the surface for degrading the MO solution. After adding H2O2, the degradation efficiency of Al-based glasses is improved and the Y6 ribbon has formed nano-scale crystallites embedded in the amorphous matrix and it has the largest improvement in MO solution degradation. These results indicate that forming nano-scale crystallites and adding H2O2 are effective methods to improve the degradation ability of Al-based glasses in azo dye solutions.


2003 ◽  
Vol 83 (13) ◽  
pp. 2581-2583 ◽  
Author(s):  
Z. P. Lu ◽  
C. T. Liu ◽  
W. D. Porter

2021 ◽  
Vol 426 ◽  
pp. 127747
Author(s):  
E.J. Herrera-Jimenez ◽  
N. Vanderesse ◽  
E. Bousser ◽  
T. Schmitt ◽  
P. Bocher ◽  
...  

1996 ◽  
Vol 462 ◽  
Author(s):  
B.E. McCarthy ◽  
P.B. Vandiver ◽  
J. Kruger

ABSTRACTCommon processes used in glazed ceramic production often result in a glaze with a heterogeneous microstructure. Heterogeneities may be due to residual batch materials, intentionally added colorants and opacifiers and/or the products of devitrification and phase separation. To study the effect of heterogeneities in the corrosion process, dynamic imaging microellipsometry was used in-situ in aqueous solutions to measure spatially and temporally resolved changes in the surface of glasses (model glazes). The measurements showed increased durability near inclusions. Residual stress fields surrounding the heterogeneities influenced the results. Decoupling of chemical and mechanical factors causing this increased durability was not possible.


1995 ◽  
Vol 391 ◽  
Author(s):  
L.M. Klinger ◽  
L. Levin ◽  
E.E. Glickman

AbstractWe report on the role of surface diffusion involved in relaxation of electromigration (EM) induced compressive stresses in relation to hillock growth and EM behavior of interconnects. Two competing mechanisms of EM stress relaxation by material transport onto the surface are considered. The first is hillocking by threshold diffusional creep (TCH), with rather large blocks of material (grains or group of grains) involved in plastic flow. The second mechanism, atomic diffusion hillocking (ADH), is presumed to be a nonthreshold one, and represents atomic grain boundary (GB) diffusion stimulated by the hydrostatic stress gradient in the direction normal to the film surface. The latter process involves surface diffusion because GB diffusional flux onto the surface must be coupled with the flux of redistribution of the atoms over the surface. If ADH acts rapidly, this should prevent the build-up of the matter at the down-wind (anode) end of the stripe, and thus, eliminate the Blech EM threshold resulting from the stress-gradient along the stripe. The question as to whether GB diffusion capable of transporting atoms pushed by electron wind along the stripe is also effective in relieving compressive stress by GB migration of the surplus atoms in the normal direction, has remained open up to now. The problem is especially acute for short or/and narrow lines separated into short polycrystalline segments, where the Blech threshold effects are critical to EM reliability.We derived the main features of the EM behavior in drift velocity test geometry assuming that both TCH and ADH are operative. The result can be compared with available and future experimental observations in order to reveal if and when the ADH mechanism with surface diffusion involved works.


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