Micromechanical method for determining the effective surface elastic modulus of solids with surface microstructures

2021 ◽  
pp. 104201
Author(s):  
Wei-Zhi Huang ◽  
Bo Li ◽  
Xi-Qiao Feng
1991 ◽  
Vol 1 (10) ◽  
pp. 1167-1177 ◽  
Author(s):  
E. V. Gurovich ◽  
S. V. Maruk
Keyword(s):  

The analysis of the previous results of the study on concrete stress-strain behavior at elevated temperatures has been carried out. Based on the analysis, the main reasons for strength retrogression and elastic modulus reduction of concrete have been identified. Despite a significant amount of research in this area, there is a large spread in experimental data received, both as a result of compression and tension. In addition, the deformation characteristics of concrete are insufficiently studied: the coefficient of transverse deformation, the limiting relative compression deformation corresponding to the peak load and the almost complete absence of studies of complete deformation diagrams at elevated temperatures. The two testing chambers provided creating the necessary temperature conditions for conducting studies under bending compression and tension have been developed. On the basis of the obtained experimental data of physical and mechanical characteristics of concrete at different temperatures under conditions of axial compression and tensile bending, conclusions about the nature of changes in strength and deformation characteristics have been drawn. Compression tests conducted following the method of concrete deformation complete curves provided obtaining diagrams not only at normal temperature, but also at elevated temperature. Based on the experimental results, dependences of changes in prism strength and elastic modulus as well as an equation for determining the relative deformation and stresses at elevated temperatures at all stages of concrete deterioration have been suggested.


2015 ◽  
Vol 57 (7-8) ◽  
pp. 690-696 ◽  
Author(s):  
Hassan S. Hedia ◽  
Saad M. Aldousari ◽  
Ahmed K. Abdellatif ◽  
Gamal S. Abdelhafeez

Author(s):  
Wentao Qin ◽  
Dorai Iyer ◽  
Jim Morgan ◽  
Carroll Casteel ◽  
Robert Watkins ◽  
...  

Abstract Ni(5 at.%Pt ) films were silicided at a temperature below 400 °C and at 550 °C. The two silicidation temperatures had produced different responses to the subsequent metal etch. Catastrophic removal of the silicide was seen with the low silicidation temperature, while the desired etch selectivity was achieved with the high silicidation temperature. The surface microstructures developed were characterized with TEM and Auger depth profiling. The data correlate with both silicidation temperatures and ultimately the difference in the response to the metal etch. With the high silicidation temperature, there existed a thin Si-oxide film that was close to the surface and embedded with particles which contain metals. This thin film is expected to contribute significantly to the desired etch selectivity. The formation of this layer is interpreted thermodynamically.


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