An investigation of ultra low-k dielectrics with high thermal stability for integration in memory devices

2007 ◽  
Vol 84 (11) ◽  
pp. 2582-2586 ◽  
Author(s):  
E. Hong ◽  
S. Demuynck ◽  
Q.T. Le ◽  
M. Baklanov ◽  
L. Carbonell ◽  
...  
Author(s):  
H. Ohtake ◽  
S. Saito ◽  
M. Tagami ◽  
M. Tada ◽  
M. Abe ◽  
...  

2020 ◽  
Vol 278 ◽  
pp. 128402
Author(s):  
Ruobing Wang ◽  
Jiabin Shen ◽  
Xin Chen ◽  
Hao Wang ◽  
Sannian Song ◽  
...  

2000 ◽  
Vol 50 (1-4) ◽  
pp. 7-14 ◽  
Author(s):  
M Uhlig ◽  
A Bertz ◽  
M Rennau ◽  
S.E Schulz ◽  
T Werner ◽  
...  

2021 ◽  
Author(s):  
Yudi Feng ◽  
Ke Jin ◽  
Jia Guo ◽  
Changchun Wang

The development of modern microelectronic industry calls for low permittivity interlayer dielectric materials with excellent thermal stabilities, robust mechanical strength and matching processability. Traditionally, it is difficult to fabricate materials...


Author(s):  
Sheng-Chieh Lin ◽  
Yu-Chieh Cheng ◽  
Man-Kit Leung ◽  
Jiun-Haw Lee ◽  
Tien-Lung Chiu

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