scholarly journals Degradation behavior of 600V–200A IGBT modules under power cycling and high temperature environment conditions

2007 ◽  
Vol 47 (9-11) ◽  
pp. 1719-1724 ◽  
Author(s):  
M. Bouarroudj ◽  
Z. Khatir ◽  
J.P. Ousten ◽  
F. Badel ◽  
L. Dupont ◽  
...  
Keyword(s):  
High Temperature ◽  
Degradation Behavior ◽  
Igbt Modules ◽  
Power Cycling ◽  
Temperature Environment ◽  
High Temperature Environment

The Degradation Behavior of SiCf/SiO2 Composites in High-Temperature Environment

2017 ◽  
Vol 25 (2) ◽  
pp. 353-364 ◽  
Author(s):  
Xiang Yang ◽  
Feng Cao ◽  
Wang Qing ◽  
Zhi-hang Peng ◽  
Yi Wang
Keyword(s):  
High Temperature ◽  
Degradation Behavior ◽  
Temperature Environment ◽  
High Temperature Environment

Improvement of High Power Cycling Reliability having Sn-Cu Based Solder

2015 ◽  
Vol 2015 (1) ◽  
pp. 000443-000448 ◽  
Author(s):  
Miyazaki Takaaki ◽  
Ikeda Osamu
Keyword(s):  
High Temperature ◽  
High Power ◽  
Power Cycle ◽  
Cycling Test ◽  
Operation Temperature ◽  
Power Cycling ◽  
Power Modules ◽  
Temperature Environment ◽  
Bonding Technology ◽  
High Temperature Environment

Demands of the raising operation temperature of power modules have been increasing in recent years. However, the power cycle capability is insufficient when used in a high temperature environment to apply the conventional Sn-based solder. In this study, we have developed a highly reliable bonding technology that improves the characteristics of the Sn phase by adding additional elements Bi, In, Sb to the Sn-7Cu solder. Power cycling test(Tjmax175°C) was carried out to evaluate the reliability. Power cycling reliability of Sn7Cu3Bi, Sn7Cu10Sb is approximately 3 times, 6 times higher than Sn7Cu.

Free-standing gallium nitride Schottky diode characteristics and stability in a high-temperature environment

2009 ◽  
Vol 24 (12) ◽  
pp. 125008 ◽  
Author(s):  
Donagh O'Mahony ◽  
Walter Zimmerman ◽  
Sinje Steffen ◽  
Just Hilgarth ◽  
Pleun Maaskant ◽  
...  
Keyword(s):  
Gallium Nitride ◽  
High Temperature ◽  
Schottky Diode ◽  
Free Standing ◽  
Temperature Environment ◽  
High Temperature Environment

Strength of copper alloys in high temperature environment

2002 ◽  
Vol 307-311 ◽  
pp. 681-685 ◽  
Author(s):  
Y. Nomura ◽  
R. Suzuki ◽  
M. Saito
Keyword(s):  
High Temperature ◽  
Copper Alloys ◽  
Temperature Environment ◽  
High Temperature Environment
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