Improvement of High Power Cycling Reliability having Sn-Cu Based Solder

2015 ◽  
Vol 2015 (1) ◽  
pp. 000443-000448 ◽  
Author(s):  
Miyazaki Takaaki ◽  
Ikeda Osamu
Keyword(s):  
High Temperature ◽  
High Power ◽  
Power Cycle ◽  
Cycling Test ◽  
Operation Temperature ◽  
Power Cycling ◽  
Power Modules ◽  
Temperature Environment ◽  
Bonding Technology ◽  
High Temperature Environment

Demands of the raising operation temperature of power modules have been increasing in recent years. However, the power cycle capability is insufficient when used in a high temperature environment to apply the conventional Sn-based solder. In this study, we have developed a highly reliable bonding technology that improves the characteristics of the Sn phase by adding additional elements Bi, In, Sb to the Sn-7Cu solder. Power cycling test(Tjmax175°C) was carried out to evaluate the reliability. Power cycling reliability of Sn7Cu3Bi, Sn7Cu10Sb is approximately 3 times, 6 times higher than Sn7Cu.

scholarly journals Investigation of the Influence of Bonding and Thermal Ageing Duration on the Peeling Strength of Knitted Materials’ Bonds

2019 ◽  
Vol 26 (2) ◽  
pp. 225-232 ◽  
Author(s):  
Gerda MIKALAUSKAITĖ ◽  
Virginija DAUKANTIENĖ
Keyword(s):  
High Temperature ◽  
Thermal Ageing ◽  
Woven Fabric ◽  
Bond Quality ◽  
Temperature Environment ◽  
Peeling Strength ◽  
Bonding Technology ◽  
Ageing Duration ◽  
High Temperature Environment ◽  
Main Factor

Bonding technology namely as “sew free” technology is usually applied for joining the pieces of sportswear and leisure clothing. Influence of the thermal ageing duration on the peeling strength of woven fabric and knitted materials bonded at 150°C temperature for 10 s, 20 s, 30 s, and 40 s durations with two polyurethane films of 0.175 mm and 0.127 mm thicknesses has been investigated in this research. Based on the research results it was shown that the peeling strength of the textile bonds is dependent on material type and bonding duration, but it is not highly affected by the ageing at 45°C temperature for 150 min, 300 min, and 450 min. During concluding it may be stated that ageing at 45°C temperatures is not main factor influencing the bond quality during its exploitation in high temperature environment.

High-Temperature Thick Al Wire Bonding Technology for High-Power Modules

2002 ◽  
Vol 41 (Part 1, No. 8) ◽  
pp. 5030-5033 ◽  
Author(s):  
Takao Komiyama ◽  
Yasunori Chonan ◽  
Jin Onuki ◽  
Masahiko Koizumi ◽  
Tatsuya Shigemura
Keyword(s):  
High Temperature ◽  
High Power ◽  
Wire Bonding ◽  
Power Modules ◽  
Bonding Technology

scholarly journals Degradation behavior of 600V–200A IGBT modules under power cycling and high temperature environment conditions

2007 ◽  
Vol 47 (9-11) ◽  
pp. 1719-1724 ◽  
Author(s):  
M. Bouarroudj ◽  
Z. Khatir ◽  
J.P. Ousten ◽  
F. Badel ◽  
L. Dupont ◽  
...  
Keyword(s):  
High Temperature ◽  
Degradation Behavior ◽  
Igbt Modules ◽  
Power Cycling ◽  
Temperature Environment ◽  
High Temperature Environment

Free-standing gallium nitride Schottky diode characteristics and stability in a high-temperature environment

2009 ◽  
Vol 24 (12) ◽  
pp. 125008 ◽  
Author(s):  
Donagh O'Mahony ◽  
Walter Zimmerman ◽  
Sinje Steffen ◽  
Just Hilgarth ◽  
Pleun Maaskant ◽  
...  
Keyword(s):  
Gallium Nitride ◽  
High Temperature ◽  
Schottky Diode ◽  
Free Standing ◽  
Temperature Environment ◽  
High Temperature Environment

The Degradation Behavior of SiCf/SiO2 Composites in High-Temperature Environment

2017 ◽  
Vol 25 (2) ◽  
pp. 353-364 ◽  
Author(s):  
Xiang Yang ◽  
Feng Cao ◽  
Wang Qing ◽  
Zhi-hang Peng ◽  
Yi Wang
Keyword(s):  
High Temperature ◽  
Degradation Behavior ◽  
Temperature Environment ◽  
High Temperature Environment
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