Impact reliability analysis of a rigid-flex PCB system under acceleration loads

Microelectronics Reliability ◽

10.1016/j.microrel.2021.114374 ◽

2021 ◽

Vol 127 ◽

pp. 114374

Author(s):

Bowen Zhang ◽

Guangbao Shan ◽

Fei Su

Keyword(s):

Reliability Analysis ◽

Impact Reliability

Download Full-text

Drop impact reliability analysis of CSP packages at board and product system levels through modeling approaches

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) ◽

10.1109/itherm.2004.1318296 ◽

2004 ◽

Author(s):

Liping Zhu ◽

W. Marcinkiewicz

Keyword(s):

Reliability Analysis ◽

Drop Impact ◽

Product System ◽

Modeling Approaches ◽

Impact Reliability

Download Full-text

Drop Impact Reliability Analysis of 3-D Chip-on-Chip Packaging: Numerical Modeling and Experimental Validation

IEEE Transactions on Device and Materials Reliability ◽

10.1109/tdmr.2013.2261735 ◽

2014 ◽

Vol 14 (1) ◽

pp. 499-511 ◽

Author(s):

Hsien-Chie Cheng ◽

Hsin-Kai Cheng ◽

Su-Tsai Lu ◽

Jing-Ye Juang ◽

Wen-Hwa Chen

Keyword(s):

Numerical Modeling ◽

Reliability Analysis ◽

Experimental Validation ◽

Drop Impact ◽

On Chip ◽

Impact Reliability

Download Full-text

2530 Impact reliability analysis of printed circuit board

The proceedings of the JSME annual meeting ◽

10.1299/jsmemecjo.2005.5.0_281 ◽

2005 ◽

Vol 2005.5 (0) ◽

pp. 281-282

Author(s):

Tadashi TATENO ◽

Nobutaka ITOH ◽

Mami NAGATAKE ◽

Fumihiko TANIGUCHI ◽

Yoshikazu KUMAGAYA

Keyword(s):

Reliability Analysis ◽

Printed Circuit Board ◽

Circuit Board ◽

Printed Circuit ◽

Impact Reliability

Download Full-text

Drop impact reliability analysis of CSP packages at board and product levels through modeling approaches

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2005.853591 ◽

2005 ◽

Vol 28 (3) ◽

pp. 449-456 ◽

Author(s):

Liping Zhu ◽

W. Marcinkiewicz

Keyword(s):

Reliability Analysis ◽

Drop Impact ◽

Modeling Approaches ◽

Impact Reliability

Download Full-text

Board level drop impact reliability analysis for compliant wafer level package through modeling approaches

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270723 ◽

2009 ◽

Author(s):

Chaoping Yuan ◽

K. L. Pan ◽

Weiyang Qiu ◽

Jing Liu

Keyword(s):

Reliability Analysis ◽

Drop Impact ◽

Wafer Level ◽

Modeling Approaches ◽

Impact Reliability ◽

Board Level ◽

Wafer Level Package

Download Full-text

An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2018.2853157 ◽

2018 ◽

Vol 8 (10) ◽

pp. 1788-1799

Author(s):

Hao Zhou ◽

Hengliang Zhu ◽

Tao Cui ◽

David Z. Pan ◽

Dian Zhou ◽

...

Keyword(s):

Domain Decomposition ◽

Reliability Analysis ◽

Decomposition Method ◽

Domain Decomposition Method ◽

Drop Impact ◽

Impact Reliability

Download Full-text

Human reliability analysis for control room upgrades

PsycEXTRA Dataset ◽

10.1037/e578542012-010 ◽

2009 ◽

Author(s):

Ronald Laurids Boring ◽

Johanna Oxstrand ◽

Michael Hildebrandt

Keyword(s):

Reliability Analysis ◽

Control Room ◽

Human Reliability ◽

Human Reliability Analysis

Download Full-text

The Exertion of GO Method in Reliability Analysis of Length Oil and Gas Pipeline under Third-Party Damage

10.1061/41073(361)191 ◽

2009 ◽

Author(s):

Zhen Zhang ◽

Zhuxin Li ◽

Jianke Guo ◽

Jun Chen

Keyword(s):

Reliability Analysis ◽

Oil And Gas ◽

Gas Pipeline ◽

Download Full-text

The Study of Reliability Analysis Method Considering The Fault Characteristics of Active Phased Array Antenna

Journal of Applied Reliability ◽

10.33162/jar.2018.12.18.4.291 ◽

2018 ◽

Vol 18 (4) ◽

pp. 291-300

Author(s):

Seungsang Lee ◽

Ilhoon Cho ◽

Junghoon Lee ◽

Yeonkyeong Park

Keyword(s):

Reliability Analysis ◽

Phased Array ◽

Array Antenna ◽

Analysis Method ◽

Phased Array Antenna

Download Full-text

A Study on Reliability Analysis Methods of the Active Electrically Scanned Array Antenna

Journal of Applied Reliability ◽

10.33162/jar.2019.12.19.4.343 ◽

2019 ◽

Vol 19 (4) ◽

pp. 343-352

Author(s):

Myeonjae Kwon

Keyword(s):

Reliability Analysis ◽

Array Antenna ◽

Analysis Methods

Download Full-text