Purpose
The purpose of this paper is to investigate the effect of titanium nitride (TiN) on microstructure and composition of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under a large temperature gradient.
Design/methodology/approach
In this paper, SAC305 lead-free composite solder containing 0.05 Wt.% TiN was prepared by powder metallurgy method. A temperature gradient generator was designed and the corresponding samples were also prepared. The microstructural evolution, internal structure and elemental content of SAC305 and SAC305/TiN solder joints before and after thermal loading were comparatively studied.
Findings
The experimental results show that the addition of the TiN reinforcing phase can effectively inhibit the diffusion and migration of copper atoms and, therefore, affect the distribution of newly formed Cu-Sn IMC in solder joints under the condition of thermal migration (TM). Compared with the SAC305 solder joint, the interconnection interface and internal structure of the composite solder joint after 600 h of TM are also relatively complete.
Originality/value
The TiN reinforcing phase is proven effective to mitigate the TM behavior in solder joints under thermal stressing. Specifically, based on the observation and analysis results of microstructure and internal structure of composite solder joint, the TiN particle can change the temperature gradient distribution of the solder joint, so as to suppress the diffusion and migration of Sn and Cu atoms. In addition, the results of Micro-CT and compositional analysis also indicate that the addition of TiN reinforcement is very helpful to maintain the structural integrity and the compositional stability of the solder joint. Different from other ceramic reinforcements, TiN has good thermo- and electro-conductivity and the thermal-electrical performance of composite solder will not be significantly affected by this reinforcement, which is also the main advantage of selecting TiN as the reinforcing phase to prepare composite solder. This study can not only provide preliminary experimental support for the preparation of high reliability lead-free composite solder but also provide a theoretical basis for the subsequent study (such as electro-thermo distribution in solder joints), which has important application significance.
Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
