Role of Schottky barrier height at source/drain contact for electrical improvement in high carrier concentration amorphous InGaZnO thin film transistors

2015 ◽  
Vol 38 ◽  
pp. 50-56 ◽  
Author(s):  
Thanh Thuy Trinh ◽  
Kyungsoo Jang ◽  
S. Velumani ◽  
Vinh Ai Dao ◽  
Junsin Yi
Nanomaterials ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 1188
Author(s):  
Ivan Rodrigo Kaufmann ◽  
Onur Zerey ◽  
Thorsten Meyers ◽  
Julia Reker ◽  
Fábio Vidor ◽  
...  

Zinc oxide nanoparticles (ZnO NP) used for the channel region in inverted coplanar setup in Thin Film Transistors (TFT) were the focus of this study. The regions between the source electrode and the ZnO NP and the drain electrode were under investigation as they produce a Schottky barrier in metal-semiconductor interfaces. A more general Thermionic emission theory must be evaluated: one that considers both metal/semiconductor interfaces (MSM structures). Aluminum, gold, and nickel were used as metallization layers for source and drain electrodes. An organic-inorganic nanocomposite was used as a gate dielectric. The TFTs transfer and output characteristics curves were extracted, and a numerical computational program was used for fitting the data; hence information about Schottky Barrier Height (SBH) and ideality factors for each TFT could be estimated. The nickel metallization appears with the lowest SBH among the metals investigated. For this metal and for higher drain-to-source voltages, the SBH tended to converge to some value around 0.3 eV. The developed fitting method showed good fitting accuracy even when the metallization produced different SBH in each metal-semiconductor interface, as was the case for gold metallization. The Schottky effect is also present and was studied when the drain-to-source voltages and/or the gate voltage were increased.


2020 ◽  
Vol 127 (17) ◽  
pp. 175701 ◽  
Author(s):  
J. E. Medvedeva ◽  
I. A. Zhuravlev ◽  
C. Burris ◽  
D. B. Buchholz ◽  
M. Grayson ◽  
...  

1986 ◽  
Vol 77 ◽  
Author(s):  
J. Wong ◽  
S.-N. Mei ◽  
T.-M. Lu

ABSTRACTWe have employed a nozzle jet expansion technique to deposit Al thin film on chemically cleaned Si(n) surface. Pure Al is evaporated in a graphite crucible at a temperature of 15 50°C and is then ejected through a small nozzle into a vacuum region of 10-6 Torr. The Schottky barrier height of the as-deposited films is measured (using the J-V technique) to be 0.77eV, which is substantially higher than that obtained by conventional evaporation-deposition techniques(≤0.68eV). Our result suggests that an intimate Al/Si(n) contact has been formed during the jet expansion deposition of Al films.During the deposition, the Al jet beam can be partially ionized by electron bombardment. It is shown that the Schottky barrier height remain unchanged if a bias potential of V s0.5KeV is applied to the substrate during deposition. For Va >0.5 KeV, the diode became leaky and the barrier height was reduced. The energetic of the jet beam, with and without post ionization and acceleration, is discussed with respect to thin film and interface formation.


2009 ◽  
Vol 56 (11) ◽  
pp. 2770-2777 ◽  
Author(s):  
Rinus Tek Po Lee ◽  
Alvin Tian-Yi Koh ◽  
Kian-Ming Tan ◽  
Tsung-Yang Liow ◽  
Dong Zhi Chi ◽  
...  

1998 ◽  
Vol 512 ◽  
Author(s):  
W. Lu ◽  
D. T. Shi ◽  
W. E. Collins ◽  
H. Chen ◽  
A. Burger

ABSTRACTPd/SiC has been used as a high temperature hydrocarbon and hydrogen gas sensor in environmental and aeronautical applications. In this work, the relationships between diffusion, reaction, and interfacial chemical composition with electrical properties for Pd ultra-thin films on 6H-SiC (∼< 30Å) are studied at different annealing temperatures.Ultra-thin film Pd on 6H-SiC has been prepared by the RF sputtering method. The Schottky barrier heights are measured by XPS for an unannealed sample and samples annealed from 100°C to 400°C for 30 minutes, respectively. No significant change in the Schottky barrier height of the Pd/SiC contact was found in the temperature range. The morphology from UHV-STM and AFM show that the unannealed Pd thin film had good uniformity across the SiC substrate, and the Pd has dispersed, and then partially aggregated into rounded shaped precipitates with increasing annealing temperatures. At 400°C, all Pd metal has reacted and formed to silicides. From XPS, Pd2Si was found on the surface after annealing, and almost all Pd has reacted to become Pd2Si after annealing at 400°C. No other silicide was found. The intensity of Pd on XPS decreases enormously at 400°C. This is explained if Pd has diffused into SiC. The Pd diffusion and the formation of Pd silicides do not significantly affect the Schottky barrier height. The SiO2 was found at the top of surface after annealing, and increased in amount with increasing annealing temperature. The SiO2 formation was accelerated by the presence of Pd. Pd may play a role in absorbing oxygen, and activating Si from SiC to form SiO2.Key Words: Pd thin film, SiC, X-ray photoelectron spectroscopy, scanning tunneling microscopy, and atomic force microscopy.


1990 ◽  
Vol 216 ◽  
Author(s):  
Dali Mao ◽  
Weili Yu ◽  
Dongliang Lin ◽  
T.L. Lin

ABSTRACTIn this paper, the effect of sputtering parameters on the interfacial reaction and the electronic properties of the WNx system were reported.The report showed that W and W2 N phases were observed in WNx film on GaAs substrate annealed at 800–900°C, in which no UN phase was found and W2N was the stable phase. Throughout the WNx film, W,N distributed uniformly. There was no interdiffusion between WN, films and GaAs substrate annealed at 80°C. However, at 900°C, there was some N in-diffusion to substrate, but no Ga or As out-diffusion. The electrical resistivity p of WNx films increased with increasing nitrogen partial pressure r. All the samples with r<0.2 showed the p below 200 µΩcm. By the I/V measurement, the Schottky Barrier Height was obtained with the value: øB=0.93ev, n=1.30 for WNx/n-GaAs contact that annealed at 850°C, 15 minutes.


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