Heat transport properties of alumina gate insulator films on Ge substrates fabricated by atomic layer deposition

2021 ◽  
Vol 121 ◽  
pp. 105396
Author(s):  
Noriyuki Uchida ◽  
Yuta Nakajima ◽  
Leonid Bolotov ◽  
Wen-Hsin Chang ◽  
Tatsuro Maeda ◽  
...  
2007 ◽  
Vol 515 (12) ◽  
pp. 5109-5112 ◽  
Author(s):  
S.-W. Jeong ◽  
H.J. Lee ◽  
K.S. Kim ◽  
M.T. You ◽  
Y. Roh ◽  
...  

2009 ◽  
Vol 94 (14) ◽  
pp. 142107 ◽  
Author(s):  
J. B. Kim ◽  
C. Fuentes-Hernandez ◽  
W. J. Potscavage ◽  
X.-H. Zhang ◽  
B. Kippelen

2016 ◽  
Vol 858 ◽  
pp. 685-688 ◽  
Author(s):  
Emanuela Schilirò ◽  
Salvatore di Franco ◽  
Patrick Fiorenza ◽  
Corrado Bongiorno ◽  
Hassan Gargouri ◽  
...  

This work reports on the growth and characterization of Al2O3 films on 4H-SiC, by Plasma Enhanced-Atomic Layer Deposition (PE-ALD). Different techniques were used to investigate the morphological, structural and electrical features of the Al2O3 films, both with and without the presence of a thin SiO2 layer, thermally grown on the 4H-SiC before ALD. Capacitance-voltage measurements on MOS structures resulted in a higher dielectric constant (ε~8.4) for the Al2O3/SiO2/SiC stack, with respect to that of the Al2O3/SiC sample (ε~ 6.7). Moreover, C<em>urrent density-Electric Field</em> measurements demonstrated a reduction of the leakage current and an improvement of the breakdown behaviour in the presence of the interfacial thermally grown SiO2. Basing on these preliminary results, possible applications of ALD-Al2O3 as gate insulator in 4H-SiC MOSFETs can be envisaged.


2020 ◽  
Vol 8 (38) ◽  
pp. 13342-13348
Author(s):  
Wan-Ho Choi ◽  
Woojin Jeon ◽  
Jin-Seong Park

Study of the correlation between mobility (μeff) and dielectric constant (k) in a PEALD high-k SiO2/ZrO2 gate insulator structure via nanoscale engineering.


2019 ◽  
Vol 30 (40) ◽  
pp. 405707 ◽  
Author(s):  
Namgue Lee ◽  
Gunwoo Lee ◽  
Hyeongsu Choi ◽  
Hyunwoo Park ◽  
Yeonsik Choi ◽  
...  

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