A dense hybrid network of epoxide hyperbranched polyurethane and benzoxazine with improved thermomechanical properties via tuning its curing reaction and physical state

Polymer ◽  
2019 ◽  
Vol 179 ◽  
pp. 121659 ◽  
Author(s):  
Chi Zhang ◽  
Zixuan Lei ◽  
Junjie Zhang ◽  
Xinli Jing ◽  
Yichao Wang ◽  
...  
2008 ◽  
Vol 110 (6) ◽  
pp. 4022-4033 ◽  
Author(s):  
Kishore K. Jena ◽  
Aswini K. Mishra ◽  
K. V. S. N. Raju

Polymers ◽  
2021 ◽  
Vol 13 (17) ◽  
pp. 2891
Author(s):  
Zhenyu Wang ◽  
Pitchaimari Gnanasekar ◽  
Sandeep Sudhakaran Nair ◽  
Songlin Yi ◽  
Ning Yan

In order to reduce the dependency of resin synthesis on petroleum resources, vanillyl alcohol which is a renewable material that can be produced from lignin has been used to synthesize bioepoxy resin. Although it has been widely reported that the curing reaction and properties of the cured epoxies can be greatly affected by the molecular structure of the curing agents, the exact influence remains unknown for bioepoxies. In this study, four aliphatic amines with different molecular structures and amine functionalities, namely triethylenetetramine (TETA), Tris(2-aminoethyl)amine (TREN), diethylenetriamine (DETA), and ethylenediamine (EDA), were used to cure the synthesized vanillyl alcohol–based bioepoxy resin (VE). The curing reaction of VE and the physicochemical properties, especially the thermomechanical performance of the cured bioepoxies with different amine functionalities, were systematically investigated and compared using different characterization methods, such as DSC, ATR–FTIR, TGA, DMA, and tensile testing, etc. Despite a higher curing temperature needed in the VE–TETA resin system, the cured VE–TETA epoxy showed a better chemical resistance, particularly acidic resistance, as well as a lower swelling ratio than the others. The higher thermal decomposition temperature, storage modulus, and relaxation temperature of VE–TETA epoxy indicated its superior thermal stability and thermomechanical properties. Moreover, the tensile strength of VE cured by TETA was 1.4~2.6 times higher than those of other curing systems. In conclusion, TETA was shown to be the optimum epoxy curing agent for vanillyl alcohol–based bioepoxy resin.


RSC Advances ◽  
2017 ◽  
Vol 7 (12) ◽  
pp. 6981-6987 ◽  
Author(s):  
Jiheng Ding ◽  
Wanjun Peng ◽  
Ting Luo ◽  
Haibin Yu

A novel epoxy system was prepared and the curing reaction kinetics of the system were studied. The thermomechanical properties and mechanical properties in the system were studied and the system shows the best mechanical properties at 10 wt% of FGE.


MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 49-54 ◽  
Author(s):  
E. Todd Ryan ◽  
Andrew J. McKerrow ◽  
Jihperng Leu ◽  
Paul S. Ho

Continuing improvement in device density and performance has significantly affected the dimensions and complexity of the wiring structure for on-chip interconnects. These enhancements have led to a reduction in the wiring pitch and an increase in the number of wiring levels to fulfill demands for density and performance improvements. As device dimensions shrink to less than 0.25 μm, the propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance (RC) coupling become significant. Accordingly the interconnect delay now constitutes a major fraction of the total delay limiting the overall chip performance. Equally important is the processing complexity due to an increase in the number of wiring levels. This inevitably drives cost up by lowering the manufacturing yield due to an increase in defects and processing complexity.To address these problems, new materials for use as metal lines and interlayer dielectrics (ILDs) and alternative architectures have surfaced to replace the current Al(Cu)/SiO2 interconnect technology. These alternative architectures will require the introduction of low-dielectric-constant k materials as the interlayer dielectrics and/or low-resistivity conductors such as copper. The electrical and thermomechanical properties of SiO2 are ideal for ILD applications, and a change to material with different properties has important process-integration implications. To facilitate the choice of an alternative ILD, it is necessary to establish general criterion for evaluating thin-film properties of candidate low-k materials, which can be later correlated with process-integration problems.


2020 ◽  
pp. 58-66
Author(s):  
N. T. Kakhramanov ◽  
◽  
I. V. Bayramova ◽  
S. S. Pesetsky ◽  
◽  
...  

2010 ◽  
Vol 47 (9) ◽  
pp. 471-486 ◽  
Author(s):  
Z. Asghar ◽  
G. Requena ◽  
E. Boller
Keyword(s):  

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