scholarly journals Study on the curing reaction kinetics of a novel epoxy system

RSC Advances ◽  
2017 ◽  
Vol 7 (12) ◽  
pp. 6981-6987 ◽  
Author(s):  
Jiheng Ding ◽  
Wanjun Peng ◽  
Ting Luo ◽  
Haibin Yu
Keyword(s):  
Mechanical Properties ◽  
Reaction Kinetics ◽  
Thermomechanical Properties ◽  
Epoxy System ◽  
Curing Reaction ◽  
System P ◽  
Kinetics Of

A novel epoxy system was prepared and the curing reaction kinetics of the system were studied. The thermomechanical properties and mechanical properties in the system were studied and the system shows the best mechanical properties at 10 wt% of FGE.

scholarly journals Curing Reaction Kinetics of the EHTPB-Based PBX Binder System and Its Mechanical Properties

Coatings ◽  
2020 ◽  
Vol 10 (12) ◽  
pp. 1266
Author(s):  
Xing Zhang ◽  
Yucun Liu ◽  
Tao Chai ◽  
Zhongliang Ma ◽  
Kanghui Jia
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Reaction Kinetics ◽  
Testing Machine ◽  
Curing Process ◽  
Binder System ◽  
Isophorone Diisocyanate ◽  
Scanning Calorimetry ◽  
Curing Reaction ◽  
Kinetics Of

In this research, differential scanning calorimetry (DSC) was employed to compare the curing reaction kinetics of the epoxidized hydroxyl terminated polybutadiene-isophorone diisocyanate (EHTPB-IPDI) and hydroxyl terminated polybutadiene-isophorone diisocyanate (HTPB-IPDI) binder systems. Glass transition temperature (Tg) and mechanical properties of the EHTPB-IPDI and HTPB-IPDI binder systems were determined using the DSC method and a universal testing machine, respectively. For the EHTPB-IPDI binder system, the change of viscosity during the curing process in the presence of dibutyltin silicate (DBTDL) and tin 2-ethylhexanoate (TECH) catalysts was studied, and the activation energy was estimated. The results show that the activation energies (Ea) of the curing reaction of the EHTPB-IPDI and HTPB-IPDI binder systems are 53.8 and 59.1 kJ·mol−1, respectively. While their average initial curing temperatures of the two systems are 178.2 and 189.5 °C, respectively. The EHTPB-IPDI binder system exhibits a higher reactivity. Compared with the HTPB-IPDI binder system, the Tg of the EHTPB-IPDI binder system is increased by 5 °C. Its tensile strength and tear strength are increased by 12% and 17%, respectively, while its elongation at break is reduced by 10%. Epoxy groups and isocyanates react to form oxazolidinones, thereby improving the mechanical properties and thermal stability of polyurethane materials. These differences indicate that the EHTPB-IPDI binder system has better thermal stability and mechanical properties. During the EHTPB-IPDI binder system’s curing process, the DBTDL catalyst may ensure a higher viscosity growth rate, indicating a better catalytic effect, consistent with the prediction results obtained using the non-isothermal kinetic analysis method.

Effect of filler loading on polymer chain confinement and thermomechanical properties of epoxy/boron nitride (h-BN) nanocomposites

2020 ◽  
Vol 44 (11) ◽  
pp. 4494-4503 ◽  
Author(s):  
Jomon Joy ◽  
Elssa George ◽  
Sabu Thomas ◽  
Saithalavi Anas
Keyword(s):  
Mechanical Properties ◽  
Boron Nitride ◽  
Polymer Chain ◽  
Hexagonal Boron Nitride ◽  
Thermomechanical Properties ◽  
Filler Loading ◽  
Epoxy System ◽  
System P ◽  
Chain Confinement

This article examines the effect of the addition of hexagonal boron nitride (h-BN) nanopowder on the polymer chain confinement, thermal, morphological and mechanical properties of the epoxy system.

Dynamics and reaction kinetics of coarse-grained bulk vitrimers: a molecular dynamics study

2019 ◽  
Vol 21 (24) ◽  
pp. 13258-13267 ◽  
Author(s):  
Jian-Bo Wu ◽  
Shu-Jia Li ◽  
Hong Liu ◽  
Hu-Jun Qian ◽  
Zhong-Yuan Lu
Keyword(s):  
Molecular Dynamics ◽  
Monte Carlo ◽  
Reaction Kinetics ◽  
Dynamic Behavior ◽  
Coarse Grained ◽  
Exchange Reactions ◽  
Dynamics Model ◽  
System P ◽  
Intrinsic Mechanism ◽  
Kinetics Of

We used the hybrid molecular dynamics–Monte Carlo (MD–MC) algorithm to establish a molecular dynamics model that can accurately reflect bond exchange reactions, and reveal the intrinsic mechanism of the dynamic behavior of the vitrimer system.

scholarly journals Measurement of reaction kinetics of [177Lu]Lu-DOTA-TATE using a microfluidic system

2017 ◽  
Vol 46 (42) ◽  
pp. 14669-14676 ◽  
Author(s):  
Z. Liu ◽  
K. S. Schaap ◽  
L. Ballemans ◽  
R. de Zanger ◽  
E. de Blois ◽  
...  
Keyword(s):  
Reaction Kinetics ◽  
Microfluidic System ◽  
Arrhenius Parameters ◽  
System P ◽  
Kinetics Of

Design and evaluation of a microfluidic system that allowed the determination of Arrhenius parameters for the formation of [177Lu]Lu-DOTA-TATE using clinical radiolabeling conditions.

Effects of ionic liquids on the reaction kinetics of a laccase–mediator system

RSC Advances ◽  
2014 ◽  
Vol 4 (33) ◽  
pp. 17097-17104 ◽  
Author(s):  
Nora Harwardt ◽  
Natascha Stripling ◽  
Simon Roth ◽  
Haifeng Liu ◽  
Ulrich Schwaneberg ◽  
...  
Keyword(s):  
Ionic Liquids ◽  
Reaction Kinetics ◽  
System P ◽  
Mediator System ◽  
Laccase Mediator System ◽  
Kinetics Of

Conductivity and viscosity explain part of the effect of ionic liquids on the laccase–mediator system kinetics, but not all.

Curing Reaction Kinetics of Epoxy/Anhydride/Silica Systems

2008 ◽  
Vol 28 (3) ◽  
Author(s):  
Ε. Diaz ◽  
S. Anasagasti ◽  
J. González
Keyword(s):  
Reaction Kinetics ◽  
Curing Reaction ◽  
Kinetics Of

scholarly journals Experimental analysis and modelling of temperature- and humidity-controlled curing

2021 ◽  
Author(s):  
Rebecca Jennrich ◽  
Ahmet Burak Aydogdu ◽  
Alexander Lion ◽  
Michael Johlitz ◽  
Sarah Glaser ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Finite Element ◽  
Reaction Kinetics ◽  
Experimental Analysis ◽  
Hardening Process ◽  
Complex Hardening ◽  
Degree Of Curing ◽  
Kinetics Of ◽  
And Diffusion ◽  
Coupled Reaction

AbstractThere has been much discussion about modelling the reaction kinetics of a curing polymer. Typically, curing is described by the development of a variable called degree of curing as a function of temperature and time. The material considered in this paper exhibits two different curing mechanisms, namely temperature-activated and diffusion-based. To be able to describe the complex hardening process, the material is extensively analysed experimentally, and a thermodynamically consistent coupled reaction kinetics model is formulated based on experimental observations. This model enables the implementation of the thermal, caloric, and mechanical properties of the material into a finite element (FE) framework.

Sintering Behavior of Si3N4-TaC Based Composites

2005 ◽  
Vol 498-499 ◽  
pp. 357-362
Author(s):  
Ana Carolina S. Coutinho Rumbao ◽  
José Carlos Bressiani ◽  
Ana Helena A. Bressiani
Keyword(s):  
Mechanical Properties ◽  
Fracture Toughness ◽  
Silicon Nitride ◽  
Phase Distribution ◽  
Particulate Composite ◽  
High Energy ◽  
Thermomechanical Properties ◽  
Sintering Behavior ◽  
High Temperature Strength ◽  
Kinetics Of

Silicon nitride was the first nitride developed for engineering applications. The excellent combination of thermomechanical properties makes silicon nitride a good candidate for applications where high hardness and mechanical properties are fundamental. However, the low fracture toughness of this material limits its use as structural material. The improve of mechanical properties of silicon nitride comes from many factors, like refined microstructure by restraining grain growth, localized stress, crack tip bridging, etc. Within these factors, microstructure formation of the silicon nitride is critically important for the final properties. The design of silicon nitride based composite materials is of particular interest because of their improved high temperature strength and fracture toughness. In this work, Si3N4-TaC particulate composite was investigated. For this study was prepared a basis composition (CB) with 90%wt a-Si3N4, 6%wt and 4%wt Y2O3 and Al2O3, respectively. TaC (20%vol) was added into CB and after mixture, in high-energy milling, the powder was compacted into pellets. The kinetics of sintering was studied by means of dilatometry. The shrinkage rate versus time and temperature curves exhibit two well-defined peaks. The first peak refers to the particle rearrangement process and the second, more pronounced, to solutionreprecipitation process. It is quite clear that the presence of TaC particles has small influence on sintering kinetics of silicon nitride. It was observed the complete a®b-Si3N4 phase transformation. The microstructure shows good homogeneity both in regard of grain size and secondary phase distribution.

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