Maskless pattern fabrication on Pyrex 7740 glass surface by using nano-scratch with HF wet etching

2005 ◽  
Vol 52 (2) ◽  
pp. 117-122 ◽  
Author(s):  
S.W. Youn ◽  
C.G. Kang
Keyword(s):  
Glass Surface ◽  
Wet Etching ◽  
Pyrex 7740

Strategies for Defect-Free and Deep Wet Etching of Pyrex 7740

2015 ◽  
Vol 645-646 ◽  
pp. 21-25
Author(s):  
Zhan Zhan ◽  
Ling Ke Yu ◽  
Cheng Zheng ◽  
Jian Fa Cai ◽  
Dao Heng Sun ◽  
...  
Keyword(s):  
High Temperature ◽  
Wet Etching ◽  
Pyrex Glass ◽  
Solution Component ◽  
Etched Surface ◽  
20 Nm ◽  
Glass Etching ◽  
Pyrex 7740

In this paper, two aspects in the wet glass etching, the pre-annealing of the glass and the mask process, are taken into consideration to achieve the deep and defect-free wet etching of Pyrex glass. Compared with the conventional strategies, i.e.,HFsolution component and mask kinds, our experiment results prove the pre-annealing is another key role to obtain theoretical isotropy character in wet etching. Besides, the high temperature pre-annealing dramatically improves the structure profiles and reduces the notching defects. Additionally, a novel multilayer mask process is proposed. With 1.5μmPR/ 100nmAu/ 100 nmAu/ 20 nmCrmask and > 450 °C pre-annealing, > 150 μm deep and non-pin-holes Pyrex glass structures are achieved and the roughness of etched surface is lower than 1 nm.

scholarly journals Micro-fabrication on Glass Surface Using Micro-indentation and Wet Etching Process

2009 ◽  
Vol 45 (9) ◽  
pp. 352-356
Author(s):  
Yasuhiro SAITO ◽  
Takeshi HIDAKA
Keyword(s):  
Glass Surface ◽  
Wet Etching ◽  
Etching Process ◽  
Micro Fabrication ◽  
Micro Indentation

Fabrication of micro-structure on glass surface using micro-indentation and wet etching process

2008 ◽  
Vol 254 (22) ◽  
pp. 7243-7249 ◽  
Author(s):  
Yasuhiro Saito ◽  
Shinya Okamoto ◽  
Atsushi Miki ◽  
Hiroyuki Inomata ◽  
Takeshi Hidaka ◽  
...  
Keyword(s):  
Glass Surface ◽  
Wet Etching ◽  
Etching Process ◽  
Micro Structure ◽  
Micro Indentation

Nanotexturing of Glass Surface by Ultrafast Laser Assisted Wet Etching

CLEO: 2014 ◽  
2014 ◽  
Author(s):  
Rokas Drevinskas ◽  
Mindaugas Gecevičius ◽  
Martynas Beresna ◽  
Yves Bellouard ◽  
Peter G. Kazansky
Keyword(s):  
Glass Surface ◽  
Ultrafast Laser ◽  
Wet Etching

Enhancing the Optical Behavior of Glass Surface by Creation of Microstructures in Single-Step Hydrothermal Wet Etching

2018 ◽  
Vol 3 (41) ◽  
pp. 11494-11504 ◽  
Author(s):  
Sivagami Duraisamy ◽  
B. Geetha Priyadarshini
Keyword(s):  
Glass Surface ◽  
Single Step ◽  
Wet Etching ◽  
Optical Behavior

Progress in laser-induced backside wet etching

2010 ◽  
Author(s):  
Hiroyuki Niino ◽  
Tadatake Sato ◽  
Yoshizo Kawaguchi ◽  
Aiko Narazaki ◽  
Ryozo Kurosaki
Keyword(s):  
Wet Etching

Generation of nano-bumps on transparent quartz glass surface under femtosecond laser irradiation

2008 ◽  
Author(s):  
Wei Guo ◽  
Zeng Bo Wang ◽  
Lin Li ◽  
Zhu Liu ◽  
Boris Luk’yanchuk ◽  
...  
Keyword(s):  
Femtosecond Laser ◽  
Laser Irradiation ◽  
Quartz Glass ◽  
Glass Surface ◽  
Femtosecond Laser Irradiation

A Review of Wet Etch Formulas for Silicon Semiconductor Failure Analysis

1996 ◽  
Author(s):  
T.W. Lee
Keyword(s):  
Failure Analysis ◽  
Literature Search ◽  
Wet Etching ◽  
Second Step ◽  
Environmental Concerns ◽  
Acid System ◽  
Graphical Data ◽  
Selective Etch ◽  
Chromium Compounds ◽  
Wet Etch

Abstract WET ETCHING is an important part of the failure analysis of semiconductor devices. Analysis requires etches for the removal, delineation by decoration or differential etching, and study of defects in layers of various materials. Each lab usually has a collection of favored etch recipes. Some of these etches are available premixed from the fab chemical supply. Some of these etches may be unique, or even proprietary, to your company. Additionally, the lab etch recipe list will usually contain a variety of classical "named etches". These recipes, such as Dash Etch, have persisted over time. Although well-reported in the literature, lab lists may not accurately represent these recipes, or contain complete and accurate instructions for their use. Time seems to have erased the understanding of the purpose of additives such as iodine, in some of these formulas. To identify the best etches and techniques for a failure analysis operations, a targeted literature review of articles and patents was undertaken. It was a surprise to find that much of the work was quite old, and originally done with germanium. Later some of these etches were modified for silicon. Much of this work is still applicable today. Two main etch types were found. One is concerned with the thinning and chemical polishing of silicon. The other type is concerned with identifying defects in silicon. Many of the named etches were found to consist of variations in a specific acid system. The acid system has been well characterized with ternary diagrams and 3-D surfaces. The named etches were plotted on this diagram. The original formulas and applications of the named etches were traced to assure accuracy, so that the results claimed by the original authors, may be reproduced in today's lab. The purpose of this paper is to share the condensed information obtained during this literature search. Graphical data has been corrected for modem dimensions. Selectivities have been located and discussed. The contents of more than 25 named etches were spreadsheeted. It was concluded that the best approach to delineation is a two-step etch, using uncomplicated and well-characterized standard formulas. The first step uses a decoration or differential etch technique to define the junctions. Formulations for effective decoration etches were found to be surprisingly simple. The second step uses a selective etch to define the various interconnections and dielectric layers. Chromium compounds can be completely eliminated from these formulas, to meet environmental concerns. This work, originally consisting of 30 pages with 106 references, has been condensed to conform with the formatting requirements of this publication.

A Novel Junction Profiling Methodology

2010 ◽  
Author(s):  
Tomokazu Nakai
Keyword(s):  
Failure Analysis ◽  
Profile Analysis ◽  
Semiconductor Devices ◽  
Wet Etching ◽  
Two Dimensional ◽  
Electrical Characteristics ◽  
Conventional Methods

Abstract Currently many methods are available to obtain a junction profile of semiconductor devices, but the conventional methods have drawbacks, and they could be obstacles for junction profile analysis. This paper introduces an anodic wet etching-based two-dimensional junction profiling method, which is practical, efficient, and reliable for failure analysis and electrical characteristics evaluation.

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