Open-cell aluminum foams filled with phase change materials as compact heat sinks

2006 ◽  
Vol 55 (10) ◽  
pp. 887-890 ◽  
Author(s):  
Sung-Tae Hong ◽  
Darrell R. Herling
2001 ◽  
Vol 124 (1) ◽  
pp. 263-272 ◽  
Author(s):  
K. Boomsma ◽  
D. Poulikakos

Open-cell aluminum foams were investigated using water to determine their hydraulic characteristics. Maximum fluid flow velocities achieved were 1.042 m/s. The permeability and form coefficient varied from 2.46×10−10 m2 and 8701 m−1 to 3529×10−10 m2 and 120 m−1, respectively. It was determined that the flowrate range influenced these calculated parameters, especially in the transitional regime where the permeability based Reynolds number varied between unity and 26.5. Beyond the transition regime where ReK≳30, the permeability and form coefficient monotonically approached values which were reported as being calculated at the maximum flow velocities attained. The results obtained in this study are relevant to engineering applications employing metal foams ranging from convection heat sinks to filters and flow straightening devices.


Nanomaterials ◽  
2020 ◽  
Vol 10 (2) ◽  
pp. 284 ◽  
Author(s):  
Nadezhda S. Bondareva ◽  
Nikita S. Gibanov ◽  
Mikhail A. Sheremet

The cooling of electronic elements is one of the most important problems in the development of architecture in electronic technology. One promising developing cooling method is heat sinks based on the phase change materials (PCMs) enhanced by nano-sized solid particles. In this paper, the influence of the PCM’s physical properties and the concentration of nanoparticles on heat and mass transfer inside a closed radiator with fins, in the presence of a source of constant volumetric heat generation, is analyzed. The conjugate problem of nano-enhanced phase change materials (NePCMs) melting is considered, taking into account natural convection in the melt under the impact of the external convective cooling. A two-dimensional problem is formulated in the non-primitive variables, such as stream function and vorticity. A single-phase nano-liquid model is employed to describe the transport within NePCMs.


2015 ◽  
Vol 88 ◽  
pp. 315-321 ◽  
Author(s):  
Shangsheng Feng ◽  
Ye Zhang ◽  
Meng Shi ◽  
Ting Wen ◽  
Tian Jian Lu

2008 ◽  
Vol 130 (3) ◽  
Author(s):  
S. K. Saha ◽  
K. Srinivasan ◽  
P. Dutta

This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enhancer (TCE), as a means of thermal management of electronic systems. Eicosane is used as PCM, while aluminium pin or plate fins are used as TCE. The test section considered in all cases is a 42×42mm2 base with a TCE height of 25mm. An electrical heater at the heat sink base is used to simulate the heat generation in electronic chips. Various volumetric fractions of TCE in the conglomerate of PCM and TCE are considered. The case with 8% TCE volume fraction was found to have the best thermal performance. With this volume fraction of TCE, the effects of fin dimension and fin shape are also investigated. It is found that a large number of small cross-sectional area fins is preferable. A numerical model is also developed to enable an interpretation of experimental results.


Author(s):  
Shankar Krishnan ◽  
Suresh V. Garimella

A transient thermal analysis is performed to investigate thermal control of power semiconductors using phase change materials, and to compare the performance of this approach to that of copper heat sinks. Both the melting of the phase change material under a transient power spike input, as well as the resolidification process, are considered. Phase change materials of different kinds (paraffin waxes and metallic alloys) are considered, with and without the use of thermal conductivity enhancers. Simple expressions for the melt depth, melting time and temperature distribution are presented in terms of the dimensions of the heat sink and the thermophysical properties of the phase change material, to aid in the design of passive thermal control systems. The simplified analytical expressions are verified against more complex numerical simulations, and are shown to be excellent tools for design calculations. The suppression of junction temperatures achieved by the use of phase change materials when compared to the performance with copper heat sinks is illustrated. Merits of employing phase change materials for pulsed power electronics cooling applications are discussed.


2016 ◽  
Vol 6 (9) ◽  
pp. 226 ◽  
Author(s):  
Ahmad Hasan ◽  
Hassan Hejase ◽  
Shaimaa Abdelbaqi ◽  
Ali Assi ◽  
Mohammed Hamdan

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