scholarly journals Computational Study of Heat Transfer inside Different PCMs Enhanced by Al2O3 Nanoparticles in a Copper Heat Sink at High Heat Loads

Nanomaterials ◽  
2020 ◽  
Vol 10 (2) ◽  
pp. 284 ◽  
Author(s):  
Nadezhda S. Bondareva ◽  
Nikita S. Gibanov ◽  
Mikhail A. Sheremet
Keyword(s):  
Phase Change ◽  
Phase Change Materials ◽  
Computational Study ◽  
Conjugate Problem ◽  
High Heat ◽  
Solid Particles ◽  
Heat Sinks ◽  
Al2o3 Nanoparticles ◽  
Electronic Elements ◽  
The Impact

The cooling of electronic elements is one of the most important problems in the development of architecture in electronic technology. One promising developing cooling method is heat sinks based on the phase change materials (PCMs) enhanced by nano-sized solid particles. In this paper, the influence of the PCM’s physical properties and the concentration of nanoparticles on heat and mass transfer inside a closed radiator with fins, in the presence of a source of constant volumetric heat generation, is analyzed. The conjugate problem of nano-enhanced phase change materials (NePCMs) melting is considered, taking into account natural convection in the melt under the impact of the external convective cooling. A two-dimensional problem is formulated in the non-primitive variables, such as stream function and vorticity. A single-phase nano-liquid model is employed to describe the transport within NePCMs.

Experimental Investigation of Thermal Performance of Nano-Enhanced Phase Change Materials for Thermal Management of Electronic Components

2019 ◽  
Author(s):  
Rohit Kothari ◽  
Dattaraj V. Vaidya ◽  
Vinay Shelke ◽  
Santosh K. Sahu ◽  
Shailesh I. Kundalwal
Keyword(s):  
Experimental Investigation ◽  
Phase Change ◽  
Thermal Management ◽  
Phase Change Materials ◽  
Heat Sinks ◽  
Melting Time ◽  
Management Technique ◽  
Base Temperature ◽  
Al2o3 Nanoparticles ◽  
Time Duration

Abstract Present experimental investigation focuses on implementing passive cooling thermal management technique using heat sinks filled with paraffin wax as phase change material (PCM). Al2O3 nanoparticles are dispersed as thermal conductivity enhancer (TCE) in different weight fractions (φ) for improved performance in the PCM. Unfinned and two finned heat sinks are used in this investigation. Experimental analysis is performed on different configurations of heat sinks and nano-enhanced phase change materials (NePCMs) consisting various weight fraction of Al2O3 nanoparticles (φ = 0%, 0.5%, 4%, and 6%) for a constant heat flux of 2.0 kW/m2. Results show that latent heat and specific heat capacity decreases with increase in the Al2O3 nanoparticle loading. Addition of Al2O3 nanoparticles in the PCM results in the reduced melting time of PCM. While, pure PCM based heat sinks keeps heat sink base temperature lower for longer time duration.

scholarly journals Thermo-physical characteristics of building integrated phase change materials (PCM) and their applicability to energy efficient homes

2021 ◽  
Author(s):  
Omar Siddiqui
Keyword(s):  
Compressive Strength ◽  
Phase Change ◽  
Phase Change Materials ◽  
Energy Savings ◽  
Physical Characteristics ◽  
Comfort Level ◽  
Thermal Mass ◽  
Lower Phase ◽  
Physical Test ◽  
The Impact

The applicability of utilizing a variety of thermal mass including phase change materials with commonly used building materials is investigated through the use of simulations and physical testing. The thermal performance and occupant comfort potential of a novel solid-solid phase change material, known as Dal HSM, is compared and contrasted to commonly available forms of thermal mass. Detailed experimentation is conducted to successfully integrate Dal HSM with gypsum and concrete. The measurement of physical characteristics such as compressive strength and modulus of rupture is conducted to ensure that the PCM-composite compound retains the structural integrity to be utilized in a typical building. The use of thermal mass in the Toronto Net Zero house was found to contribute to energy savings of 10-15% when different types of thermal mass were used. The comfort level of the indoor occupants was also found to increase. The performance of Dal HSM was found to be comparable to a commercially available PCM known as Micronal in the heating mode. The cooling mode revealed that Dal HSM provided slightly lower energy savings when compared to Micronal due to a lower phase transition temperature and latent heat. The performance of physical test revealed a decrease in the compressive strength as the concentration of Dal HSM was increased in the PCM-gypsum specimens. Tests were also performed to analyze the impact of increasing the PCM concentration on the flexural strength of PCM-gypsum composite.

scholarly journals Experimental Evaluation of Nano-Enhanced Phase Change Materials in a Finned Storage Unit

2020 ◽  
Vol 10 (3) ◽  
pp. 5814-5818
Author(s):  
M. A. Aichouni ◽  
N. F. Alshammari ◽  
N. Ben Khedher ◽  
M. Aichouni
Keyword(s):  
Energy Storage ◽  
Phase Change ◽  
Thermal Performance ◽  
Phase Change Materials ◽  
Performance Enhancement ◽  
Renewable Energy Sources ◽  
Heating System ◽  
Al2o3 Nanoparticles ◽  
Storage Unit ◽  
Experimental Apparatus

The intermittent nature of renewable energy sources such as solar and wind necessitates integration with energy-storage units to enable realistic applications. In this study, thermal performance enhancement of the finned Cylindrical Thermal Energy Storage (C-TES) with nano-enhanced Phase Change Material (PCM) integrated with the water heating system under Storage, Charging and Discharging (SCD) conditions were investigated experimentally. The effects of the addition of copper oxide (CuO) and aluminum oxide (Al2O3) nanoparticles in PCM on thermal conductivity, specific heat, and on charging and discharging performance rates were theoretically and experimentally investigated and studied in detail. The experimental apparatus utilized paraffin wax as PCM, which was filled in Finned C-TES to conduct the experiments. The experimental results showed a positive improvement compared with the non-nano additive PCM. The significance and originality of this project lies within the evaluation and identification of preferable metal-oxides with higher potential for improving thermal performance.

Empirical Optimization of High Density Plate-Fin Heat Sink for Constant Pumping Power in Low Profile Cooling Application

2005 ◽  
Author(s):  
Kazuaki Yazawa ◽  
Tatsuro Yoshida ◽  
Shinji Nakagawa ◽  
Masaru Ishizuka
Keyword(s):  
Fluid Dynamic ◽  
Dynamic Performance ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Pumping Power ◽  
Low Profile ◽  
Data Points ◽  
Narrow Space ◽  
The Impact

Since the VLSI processors are increasing power in accordance with exponential law, cooling solutions for such as personal computers have been evolving for over a decade. Recent heat sinks are designed with high dense fins and low profile to adapt to a high heat flux source within a slim enclosure. To achieve such compact cooling solution, thin fin and small gap is desirable. In addition, the pumping power is also limited by the allowable narrow space for fans. Thus it is important to minimize the thermal resistance for given pumping power that we define the optimum. Due to the lack of literatures on topic of low profile and high dense fins experiments, an apparatus was specially built to measure the thermal and fluid dynamic performance at the same time. Since such a high dense fin arrangement requires extra space on the sides by manufacturing reasons, the impact of bypass flow needs to be considered. The experiments are carefully carried out and the results are precisely compared with numerical analysis. The numerical model aiming to find the optimum for given pumping power is discussed with extrapolating the data points. This report is concluded with the best configuration of plate fins of low profile heat sinks for a given fan performance.

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study

1997 ◽  
Vol 119 (1) ◽  
pp. 40-50 ◽  
Author(s):  
D. Pal ◽  
Y. K. Joshi
Keyword(s):  
Phase Change ◽  
Phase Change Materials ◽  
Cooling System ◽  
Computational Study ◽  
Power Level ◽  
Thermal Control ◽  
The Other ◽  
Three Dimensions ◽  
Temperature Isotherm ◽  
Laminate Thickness

A computational model is developed to predict the performance of phase change materials(PCMs) for passive thermal control of electronic modules during transient power variations or following an active cooling system failure. Two different ways of incorporating PCM in the module are considered. One is to place a laminate of PCM outside the multichip module, and the other is to place the PCM laminate between the substrate and the cold plate. Two different types of PCMs are considered. One is n-Eicosene, which is an organic paraffin, and the other one is a eutectic alloy of Bi/Pb/Sn/In. Computations are performed in three dimensions using a finite volume method. A single domain fixed grid enthalpy porosity method is used to model the effects of phase change. Effects of natural convection on the performance of PCM are also examined. Results are presented in the form of time-wise variations of maximum module temperature, isotherm contours, velocity vectors, and melt front locations. Effects of PCM laminate thickness and power levels are studied to assess the amount of PCM required for a particular power level. The results show that the PCMs are an effective option for passive cooling of high density electronic modules for transient periods.

Extending Die-Attachment Fatigue Life of Power Electronics Using Phase Change Materials

2016 ◽  
Author(s):  
Levi J. Elston
Keyword(s):  
Phase Change ◽  
Power Electronics ◽  
Phase Change Materials ◽  
Operating Conditions ◽  
Device Structure ◽  
Die Attachment ◽  
Advanced Packaging ◽  
Life Improvement ◽  
Solid Liquid ◽  
The Impact

The ever-increasing power throughput and ever-decreasing size of modern electronics, specifically power electronics, requires more advanced packaging techniques and materials to maintain thermal limits and sustain mechanical life. Specific applications with known operating conditions for these components can realize added benefits through a tailored thermal-mechanical-electrical optimized assembly, potentially utilizing niche material classes. Without losing any expected functionality, solid-liquid phase change materials could be incorporated into the device structure to reduce peak temperature and/or suppress high-cycle fatigue problems commonly found at die-attachment interfaces. The purpose of this study was to investigate, through model-based design and analysis, the impact of using organic phase-change materials (PCMs) at two strategic locations in the standard device stack. The results suggest noteworthy life improvement (40%) is possible when optimizing for a given melt point material. Additionally, further improvements were predicted through future material enhancements, namely thermal conductivity and latent heat.

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