Effect of EDTA and CH2O on copper recovery from simulated electroless copper plating spent rinse water by unseeded fluidized-bed granulation process

2020 ◽  
Vol 253 ◽  
pp. 117460 ◽  
Author(s):  
Mark Daniel G. de Luna ◽  
Jenelyn A. Capito ◽  
Anabella C. Vilando ◽  
Ming-Chun Lu
Keyword(s):  
Fluidized Bed ◽  
Copper Recovery ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Granulation Process ◽  
Electroless Copper ◽  
Rinse Water

Electroless Copper Plating of Titanium Condenser Tubes for Biofouling Control

2016 ◽  
Vol 6 (1) ◽  
pp. 65-73
Author(s):  
Balakrishnan Anandkumar ◽  
Rani P. George ◽  
Alagarsamy Karthik ◽  
Dasnamoorthy Ramachandran ◽  
Uthandi Kamachi Mudali
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Biofouling Control

Novel fabrication of low-cost Ti–Cu alloy by electroless copper plating and vacuum sintering

Vacuum ◽  
2021 ◽  
pp. 110330
Author(s):  
Chunming Wang ◽  
Luming Zeng ◽  
Wucheng Ding ◽  
Tongxiang Liang
Keyword(s):  
Low Cost ◽  
Copper Plating ◽  
Vacuum Sintering ◽  
Electroless Copper Plating ◽  
Cu Alloy ◽  
Electroless Copper

New and clean strategy for the determination of Cu2+ in electroless copper plating baths

2007 ◽  
Vol 68 (1) ◽  
pp. 150-155 ◽  
Author(s):  
Rutao Liu ◽  
Wansong Zong ◽  
Canzhu Gao ◽  
Zhenxing Chi ◽  
Lijun Zhang
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electroless Copper Plating Process by Applying Alternating One-Side Air Stirring Method for High-Aspect-Ratio Through-Holes

2017 ◽  
Vol 164 (12) ◽  
pp. D771-D777 ◽  
Author(s):  
H. Kanemoto ◽  
T. Kawamura ◽  
H. Suzuki ◽  
T. Miyazaki ◽  
H. Mozumi ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper
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