Open innovation at the interorganizational network level – Stretching practices to face technological discontinuities in the semiconductor industry

2020 ◽  
Vol 155 ◽  
pp. 119398 ◽  
Author(s):  
Jörg Sydow ◽  
Gordon Müller-Seitz
2019 ◽  
Vol 17 (2) ◽  
pp. 133-156
Author(s):  
Xênia L'amour Campos Oliveira ◽  
Maria Elena Leon Olave ◽  
Edward David Moreno ◽  
Glessia Silva

Purpose This study aims to understand how Brazilian design houses (DHs) use open innovation in joint development projects for integrated circuits. Design/methodology/approach As a research strategy, qualitative research using multiple case studies was made. As sources of evidence, semi-structured interviews were conducted with three DHs of Programa integrated circuit [circuito integrado(CI)]-Brasil and with four specialists in the field, as well as analysis of documents. The data were analyzed through content analysis. Findings The results showed the DHs use sources of external knowledge in their innovation process, to assist the development of new products, to access new knowledge and skills, to attract financial resources and to be competitive in the market of high technology. Originality/value The study has important implications on the semiconductor industry in Brazil, as the industry is considered strategic for the competitiveness of final goods sector. The importance of encouraging the development of partnerships in the sector, the possibility of using informal agreements to mediate the collaboration between DHs and external agents, and the improvement and long-term continuity of public policies to support the industry are among the implications. In addition to suggestions for new business approaches to assist the strengthening of this segment.


2014 ◽  
Vol 13 (3) ◽  
pp. 30-58 ◽  
Author(s):  
Xiaolan Fu ◽  
Jizhen Li ◽  
Hongru Xiong ◽  
Henry Chesbrough

This paper examines the determinants of open innovation as a response to the constraints and risks of innovation that firms face in emerging economies. A recent national firm-level survey of 1,400 firms in the manufacturing sector is used as the basis of the analysis. We find that institutional, financial and knowledge/skills-related risks and constraints are all significantly associated with these firms' depth and breadth of openness in innovation. The responses, however, vary across firms of different ownership types. Foreign-invested firms appear to be most responsive and take action to widen and deepen their openness in innovation. Privately owned firms have made significant responses to market- and institution- and finance- and risk-related impediments but not to knowledge- and skills-related impediments. State-owned firms appear to be least responsive in use of open innovation. Firm size and industry specific effects also appear to have significant moderating effect on firms' responses to the various constraints. These findings are supported by an in-depth study of the Chinese semiconductor industry.


Author(s):  
S.F. Corcoran

Over the past decade secondary ion mass spectrometry (SIMS) has played an increasingly important role in the characterization of electronic materials and devices. The ability of SIMS to provide part per million detection sensitivity for most elements while maintaining excellent depth resolution has made this technique indispensable in the semiconductor industry. Today SIMS is used extensively in the characterization of dopant profiles, thin film analysis, and trace analysis in bulk materials. The SIMS technique also lends itself to 2-D and 3-D imaging via either the use of stigmatic ion optics or small diameter primary beams.By far the most common application of SIMS is the determination of the depth distribution of dopants (B, As, P) intentionally introduced into semiconductor materials via ion implantation or epitaxial growth. Such measurements are critical since the dopant concentration and depth distribution can seriously affect the performance of a semiconductor device. In a typical depth profile analysis, keV ion sputtering is used to remove successive layers the sample.


Author(s):  
R. Packwood ◽  
M.W. Phaneuf ◽  
V. Weatherall ◽  
I. Bassignana

The development of specialized analytical instruments such as the SIMS, XPS, ISS etc., all with truly incredible abilities in certain areas, has given rise to the notion that electron probe microanalysis (EPMA) is an old fashioned and rather inadequate technique, and one that is of little or no use in such high technology fields as the semiconductor industry. Whilst it is true that the microprobe does not possess parts-per-billion sensitivity (ppb) or monolayer depth resolution it is also true that many times these extremes of performance are not essential and that a few tens of parts-per-million (ppm) and a few tens of nanometers depth resolution is all that is required. In fact, the microprobe may well be the second choice method for a wide range of analytical problems and even the method of choice for a few.The literature is replete with remarks that suggest the writer is confusing an SEM-EDXS combination with an instrument such as the Cameca SX-50. Even where this confusion does not exist, the literature discusses microprobe detection limits that are seldom stated to be as low as 100 ppm, whereas there are numerous element combinations for which 10-20 ppm is routinely attainable.


IEE Review ◽  
1991 ◽  
Vol 37 (10) ◽  
pp. 355
Author(s):  
D.A. Gorham

Author(s):  
Myrna FLORES ◽  
Matic GOLOB ◽  
Doroteja MAKLIN ◽  
Christopher TUCCI

In recent years, the way organizations innovate and develop new solutions has changed considerably. Moving from ‘behind the closed doors’ style of innovating to open innovation where collaboration with outsiders is encouraged, organizations are in the pursuit of more effective ways to accelerate their innovation outcomes. As a result, organizations are establishing creative and entrepreneurial ecosystems, which not only empower employees but also involve many others to co-create new solutions. In this paper, we present a methodology for organizing hackathons, i.e. competition-based events where small teams work over a short period of time to ideate, design, prototype and test their ideas following a user-centric approach to solve a specific challenge. This paper also provides insights into two different hackathons organized in the United Kingdom, and Mexico, as well as a series of 5 hackathons organized in Argentina, Mexico, Switzerland, United Kingdom and in Senegal.


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