A loadless 6T SRAM cell for sub- & near- threshold operation implemented in 28 nm FD-SOI CMOS technology

Integration ◽  
2018 ◽  
Vol 63 ◽  
pp. 56-63
Author(s):  
Even Låte ◽  
Trond Ytterdal ◽  
Snorre Aunet
Author(s):  
R.V. Joshi ◽  
S. Mukhopadhyay ◽  
D.W. Plass ◽  
Y.H. Chan ◽  
Ching-Te Chuang ◽  
...  

Author(s):  
John Bulzacchelli ◽  
Troy Beukema ◽  
Daniel Storaska ◽  
Ping-Hsuan Hsieh ◽  
Sergey Rylov ◽  
...  

2014 ◽  
Vol 23 (3) ◽  
pp. 636-650 ◽  
Author(s):  
Radhika Marathe ◽  
Bichoy Bahr ◽  
Wentao Wang ◽  
Zohaib Mahmood ◽  
Luca Daniel ◽  
...  
Keyword(s):  

2013 ◽  
Vol 373-375 ◽  
pp. 1607-1611
Author(s):  
Hong Gang Zhou ◽  
Shou Biao Tan ◽  
Qiang Song ◽  
Chun Yu Peng

With the scaling of process technologies into the nanometer regime, multiple-bit soft error problem becomes more serious. In order to improve the reliability and yield of SRAM, bit-interleaving architecture which integrated with error correction codes (ECC) is commonly used. However, this leads to the half select problem, which involves two aspects: the half select disturb and the additional power caused by half-selected cells. In this paper, we propose a new 10T cell to allow the bit-interleaving array while completely eliminating the half select problem, thus allowing low-power and low-voltage operation. In addition, the RSNM and WM of our proposed 10T cell are improved by 21% and nearly one times, respectively, as compared to the conventional 6T SRAM cell in SMIC 65nm CMOS technology. We also conduct a comparison with the conventional 6T cell about the leakage simulation results, which show 14% of leakage saving in the proposed 10T cell.


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