Free-exciton photoluminescence from cubic CdS films on GaAs substrates

2003 ◽  
Vol 102-103 ◽  
pp. 604-607 ◽  
Author(s):  
T. Nagai ◽  
Y. Kanemitsu ◽  
Y. Yamada ◽  
T. Taguchi
2003 ◽  
Vol 82 (3) ◽  
pp. 388-390 ◽  
Author(s):  
Yoshihiko Kanemitsu ◽  
Takehiko Nagai ◽  
Yoichi Yamada ◽  
Tsunemasa Taguchi

2016 ◽  
Vol 183 ◽  
pp. 334-338 ◽  
Author(s):  
L. Huang ◽  
Z.L. Wei ◽  
L.G. Ma ◽  
F.M. Zhang ◽  
X.S. Wu
Keyword(s):  

1993 ◽  
Vol 325 ◽  
Author(s):  
M. Shah ◽  
M.O. Manasreh ◽  
R. Kaspi ◽  
M. Y. Yen ◽  
B. A. Philips ◽  
...  

AbstractThe optical absorption of the band edge of GaSb layers grown on semi-insulating GaAs substrates by the molecular beam epitaxy (MBE) technique is studied as a function of temperature. A free exciton absorption peak at 0.807 eV was observed at 10 K. The free exciton line is observed in either thick samples (5μm thick) or samples with ∼0.1 μm thick AlSb buffer layers. The latter samples suggest that the AlSb buffer layer is very effective in preventing some of the dislocations from propagating into the MBE GaSb layers. The fitting of the band gap of the GaSb layers as a function of temperature gives a Debye temperature different than that of the bulk GaSb calculated from the elastic constants.


2002 ◽  
Vol 80 (2) ◽  
pp. 267-269 ◽  
Author(s):  
Yoshihiko Kanemitsu ◽  
Takehiko Nagai ◽  
Takashi Kushida ◽  
Seiji Nakamura ◽  
Yoichi Yamada ◽  
...  
Keyword(s):  

2004 ◽  
Vol 22 (2) ◽  
pp. 324-327 ◽  
Author(s):  
Young-Moon Yu ◽  
Ki-Seon Lee ◽  
Byungsung O ◽  
Pyeong Yeol Yu ◽  
Chang-Soo Kim ◽  
...  
Keyword(s):  

Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.


Author(s):  
T.C. Sheu ◽  
S. Myhajlenko ◽  
D. Davito ◽  
J.L. Edwards ◽  
R. Roedel ◽  
...  

Liquid encapsulated Czochralski (LEC) semi-insulating (SI) GaAs has applications in integrated optics and integrated circuits. Yield and device performance is dependent on the homogeniety of the wafers. Therefore, it is important to characterise the uniformity of the GaAs substrates. In this respect, cathodoluminescence (CL) has been used to detect the presence of crystal defects and growth striations. However, when SI GaAs is examined in a scanning electron microscope (SEM), there will be a tendency for the surface to charge up. The surface charging affects the backscattered and secondary electron (SE) yield. Local variations in the surface charge will give rise to contrast (effectively voltage contrast) in the SE image. This may be associated with non-uniformities in the spatial distribution of resistivity. Wakefield et al have made use of “charging microscopy” to reveal resistivity variations across a SI GaAs wafer. In this work we report on CL imaging, the conditions used to obtain “charged” SE images and some aspects of the contrast behaviour.


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