Dye-sensitized sputtered titanium oxide films for photovoltaic applications: influence of the O2/Ar gas flow ratio during the deposition

2003 ◽  
Vol 76 (1) ◽  
pp. 37-56 ◽  
Author(s):  
M Gómez
2007 ◽  
Vol 336-338 ◽  
pp. 564-566 ◽  
Author(s):  
Chong Mu Lee ◽  
Keun Bin Yim ◽  
Choong Mo Kim

ZnO:Al thin films were deposited on sapphire(001) substrates by RF magnetron sputtering. Effects of the O2/Ar flow ratio in the sputtering process on the crystallinity, surface roughness, carrier concentration, carrier mobility, and optical properties of the films were investigated. AFM analysis results show that the surface roughness is lowest at the O2/Ar flow ratio of 0.5 and tends to increase owing to the increase of the grain size as the O2/Ar flow ratio increases further than 0.5. According to the Hall measurement results the resistivity increases as the O2/Ar flow ratio increases. The transmittance of the film tends to increase as the O2/Ar gas flow ratio increases up to 0.5 but it nearly does not change with continued increases in the O2/Ar flow ratio. Considering the effects of the the O2/Ar flow ratio on the surface roughness, electrical resistivity and transmittance properties of the ZnO:Al film the optimum O2/Ar flow ratio is 0.5 in the RF magnetron sputter deposition of the ZnO:Al film.


2004 ◽  
Vol 72 (10) ◽  
pp. 676-679 ◽  
Author(s):  
Naoto ANZAI ◽  
Sachio YOSHIHARA ◽  
Takashi SHIRAKASHI ◽  
Kazunari KUROKAWA ◽  
Kiyoshi ISHII

2018 ◽  
Vol 33 (2) ◽  
pp. 349-355
Author(s):  
Jingjun Wu ◽  
Xin Ye ◽  
Jin Huang ◽  
Laixi Sun ◽  
Yong Zeng ◽  
...  

2013 ◽  
Vol 566 ◽  
pp. 149-152
Author(s):  
Tatsunori Kakuda ◽  
Tomoaki Futakuchi

We evaluated the surface area, pore size distribution, and electrical characteristics of titanium oxide films formed under different sintering and cleaning conditions. In addition, we examined the microstructure of the titanium oxide films by forming cross-sectional surfaces. The necking structure of the titanium oxide films strongly influenced the conversion efficiency of the dye-sensitized solar cell. And, the conversion efficiency was improved by the increasing firing temperature and treating with TiCl4 and ozone water.


1993 ◽  
Vol 310 ◽  
Author(s):  
J.J. Van Glabbeek ◽  
G.A.C.M. Spierings ◽  
M.J.E. Ulenaers ◽  
G.J.M. Dormans ◽  
P.K. Larsen

AbstractDry etching of a Pt/PbZrxTi1−xO3/Pt (Pt/PZT/Pt) ferroelectric capacitor stack with CF4/Ar plasmas with a reactive ion etching process for the fabrication of micrometer-sized integrated ferroelectric capacitors is described. The etch rate for both Pt and PZT is determined as a function of the process settings: Power, pressure and CF4-Ar gas flow ratio. A chemical enhancement of the etch rate is found for PZT. It is shown that it is possible to etch the Pt/PZT/Pt ferroelectric capacitor stack in a CF4/Ar plasma in a single lithographic process using patterning by photoresist masking. Redeposition processes occurring during etching are described.


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