Learning the Hydrophobic, Hydrophilic, and Aromatic Character of Amino Acids from Thermal Relaxation and Interfacial Thermal Conductance

Author(s):  
Heydar Hamzi ◽  
Ali Rajabpour ◽  
Édgar Roldán ◽  
Ali Hassanali
2016 ◽  
Vol 49 (46) ◽  
pp. 465301 ◽  
Author(s):  
Ying-Yan Zhang ◽  
Qing-Xiang Pei ◽  
Yiu-Wing Mai ◽  
Siu-Kai Lai

Carbon ◽  
2019 ◽  
Vol 144 ◽  
pp. 109-115 ◽  
Author(s):  
Zhiyong Wei ◽  
Fan Yang ◽  
Kedong Bi ◽  
Juekuan Yang ◽  
Yunfei Chen

Author(s):  
Hasan Babaei ◽  
Pawel Keblinski ◽  
J. M. Khodadadi

By utilizing molecular dynamics (MD) simulations, we study the interfacial thermal conductance at the interface of graphene and paraffin. In doing so, we conduct non-equilibrium heat source and sink simulations on systems of parallel and perpendicular configurations in which the heat flow is parallel and perpendicular to the surface of graphene, respectively. For the perpendicular configuration, graphene with different number of layers are considered. The results show that the interfacial thermal conductance decreases with the number of layers and converges to a value which is equal to the obtained conductance by using the parallel configuration. We also study the conductance for the solid phase paraffin. The results indicate that solid paraffin-graphene interfaces have higher conductance values with respect to the corresponding liquid phase systems.


2020 ◽  
Vol 2 (12) ◽  
pp. 5821-5832
Author(s):  
Hamidreza Zobeiri ◽  
Nicholas Hunter ◽  
Ridong Wang ◽  
Xinman Liu ◽  
Hong Tan ◽  
...  

Interfacial thermal conductance between a nm-thick suspended WS2 film and water is measured using a novel nET-Raman technique. By significantly reducing the effect of water thermal resistance, the interface resistance effect become more preeminent.


1996 ◽  
Vol 118 (1) ◽  
pp. 157-163 ◽  
Author(s):  
G.-X. Wang ◽  
E. F. Matthys

Experiments have been conducted to quantify the interfacial thermal conductance between molten copper and a cold metallic substrate, and in particular to investigate the heat transfer variation as the initial liquid/solid contact becomes a solid/solid contact after nucleation. A high heat transfer coefficient during the earlier liquid cooling phase and a lower heat transfer coefficient during the subsequent solid splat cooling phase were estimated through matching of model calculations and measured temperature history of the sample. The dynamic variations in the interfacial heat transfer resulting from the solidification process were quantified for splat cooling and were found to be affected by the melt superheat, the substrate material, and the substrate surface finish.


Sign in / Sign up

Export Citation Format

Share Document