Failure Mode Prediction of Organic Coating-Metallic Substrate Systems

Author(s):  
L. Nicodemo ◽  
T. Monetta ◽  
F. Bellucci
Author(s):  
J. R. Michael ◽  
A. D. Romig ◽  
D. R. Frear

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.


Author(s):  
J. E. O’Neal ◽  
K. K. Sankaran ◽  
S. M. L. Sastry

Rapid solidification of a molten, multicomponent alloy against a metallic substrate promotes greater microstructural homogeneity and greater solid solubility of alloying elements than can be achieved by slower-cooling casting methods. The supersaturated solid solutions produced by rapid solidification can be subsequently annealed to precipitate, by controlled phase decomposition, uniform 10-100 nm precipitates or dispersoids. TEM studies were made of the precipitation of metastable Al3Li(δ’) and equilibrium AL3H phases and the deformation characteristics of a rapidly solidified Al-3Li-0.2Ti alloy.


2020 ◽  
Vol 117 (6) ◽  
pp. 610
Author(s):  
Nadia Hammouda ◽  
Kamel Belmokre

Organic coatings are widely employed in the corrosion protection of most metal surfaces, particularly steel. They provide a barrier against corrosive species present in the environment, due to their high resistance to oxygen, water and ions transport. This study focuses on the evaluation of corrosion protection performance of epoxy paint on the carbon steel surface in chloride environment (3% NaCl) by Electrochemical Impedance Spectroscopy (EIS). The electrochemical behavior of painted surface was estimated by EIS parameters that contained paint film resistance, paint film capacitance and double layer capacitance. On the basis of calculation using EIS spectrums it was observed that pore resistance (Rpore) decreased with the appearance of doubled layer capacitance (Cdl) due to the electrolyte penetration through the film. This was further confirmed by the decrease of diffusion resistance (Rd) which was also the indicator of the deterioration of paint film protectiveness. Microscopic analyses have shown that oxidation dominates the corroded surfaces.


2020 ◽  
Vol 1 (1) ◽  
pp. 162-173
Author(s):  
Dinesh Kumar Kushwaha ◽  
◽  
Dilbagh Panchal ◽  
Anish Sachdeva ◽  
◽  
...  

Failure Mode Effect Analysis (FMEA) is popular and versatile approach applicable to risk assessment and safety improvement of a repairable engineering system. This method encompasses various fields such as manufacturing, healthcare, paper mill, thermal power industry, software industry, services, security etc. in terms of its application. In general, FMEA is based on Risk Priority Number (RPN) score which is found by product of probability of Occurrence (O), Severity of failure (S) and Failure Detection (D). As human judgement is approximate in nature, the accuracy of data obtained from FMEA members depend on degree of subjectivity. The subjective knowledge of members not only contains uncertainty but hesitation too which in turn, affect the results. Fuzzy FMEA considers uncertainty and vagueness of the data/ information obtained from experts. In order to take into account, the hesitation of experts and vague concept, in the present work we propose integrated framework based on Intuitionistic Fuzzy- Failure Mode Effect Analysis (IF-FMEA) and IF-Technique for Order Preference by Similarity to Ideal Solution (IF-TOPSIS) techniques to rank the listed failure causes. Failure cause Fibrizer (FR) was found to be the most critical failure cause with RPN score 0.500. IF-TOPSIS has been implemented within IF-FMEA to compare and verify ranking results obtained by both the IF based approaches. The proposed method was presented with its application for examining the risk assessment of cutting system in sugar mill industry situated in western Uttar Pradesh province of India. The result would be useful for the plant maintenance manager to fix the best maintenance schedule for improving availability of cutting system.


Author(s):  
Ryan Xiao ◽  
William Wang ◽  
Ang Li ◽  
Shengqiu Xu ◽  
Binghai Liu

Abstract With the development of semiconductor technology and the increment quantity of metal layers in past few years, backside EFA (Electrical Failure Analysis) technology has become the dominant method. In this paper, abnormally high Signal Noise Ratio (SNR) signal captured by Electro-Optical Probing (EOP)/Laser Voltage Probing (LVP) from backside is shown and the cause of these phenomena are studied. Based on the real case collection, two kinds of failure mode are summarized, and simulated experiments are performed. The results indicate that when a current path from power to ground is formed, the high SNR signal can be captured at the transistor which was on this current path. It is helpful of this consequence for FA to identify the failure mode by high SNR signal.


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