The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints

Aluminum-rich intermetallic compounds of the Al3X-type with transmission metals (X = Ti. Zr, Nb, V) of Groups IVb and Vb are of interest in the development of novel high-temperature and lightweight structural materials. This article describes the important physical and mechanical properties of trialuminides with DO22 structure and their L12 variations. Topical coverage includes: crystal structure and selected physical properties, plastic deformation, oxidation behavior, and applications.

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Interface reactions in microelectronic solder joints and associated intermetallic compounds: an investigation of their mechanical properties using nanoindentation

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) ◽

10.1109/eptc.2003.1271613 ◽

2004 ◽

Cited By ~ 23

Author(s):

H.-J. Albrecht ◽

A. Juritza ◽

K. Muller ◽

W.H. Muller ◽

J. Sterthaus ◽

...

Keyword(s):

Mechanical Properties ◽

Intermetallic Compounds ◽

Solder Joints ◽

Interface Reactions

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Formation and Evolution of Intermetallic Compounds in Solder Joint for Electronic Interconnect

Materials Science Forum ◽

10.4028/www.scientific.net/msf.687.80 ◽

2011 ◽

Vol 687 ◽

pp. 80-84

Author(s):

Chang Hua Du ◽

Hai Jian Zhao ◽

Li Meng Yin ◽

Fang Chen

Keyword(s):

Mechanical Properties ◽

Solder Joint ◽

Intermetallic Compounds ◽

Isothermal Aging ◽

Solder Joints ◽

Growth Behavior ◽

Electronic Products ◽

Formation And Evolution ◽

Kirkendall Voids ◽

Reliability Of Solder Joints

As solder joints become increasingly miniaturized to meet the severe demands of future electronic packaging, the thickness of intermetallic compounds (IMC) in solder joint continuously decreases, while, the IMC proportion to the whole solder joint increases. So IMC plays a more and more important role in the reliability of microelectronic structure and microsystems. In this paper, the formation and growth behavior, along with the composition of IMC at the interface of Sn-based solders/Cu substrate in soldering were reviewed comprehensively. The effect of isothermal aging, thermal-shearing cycling and electromigration on the interfacial IMC growth and evolution were also presented. Furthermore, the formation mechanism of Kirkendall voids during thermal aging was introduced. In addition, the effect of the interfacial IMC on mechanical properties of solder joints was in-depth summarized. Adopting an appropriate flux to control the thickness of the IMC to improve the reliability of solder joints and electronic products was proposed in the end of this paper.

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Role of Wood Flour on Physical and Mechanical Properties in Polymer Matrix Composites-A Critical Review

Revue des composites et des matériaux avancés ◽

10.18280/rcma.310203 ◽

2021 ◽

Vol 31 (2) ◽

pp. 81-92

Author(s):

Lalit Ranakoti ◽

Pawan Kumar Rakesh ◽

Brijesh Gangil

Keyword(s):

Mechanical Properties ◽

Polymer Composite ◽

Material Science ◽

Polymer Matrix Composites ◽

Wood Flour ◽

Natural Fibers ◽

Physical And Mechanical Properties ◽

Critical Parameters ◽

Matrix Composites

Green and sustainable material is the utmost prerequisite for the advancement of a healthy society and fulfilling the necessary for the improvement in material science. Naturally obtaining wood flour has the competence to be reinforced as a filler substance in the polymer composite. The present article deals with the usage of wood flour as a filler in the polymer composite. The article comprises properties, characteristics, occurrence, the structure of wood, and the techniques implemented in the manufacturing of wood flour polymer composites. In addition, critical parameters and causes that can bring changes in the properties like tensile, flexural, impact and hardness of polymers are also discussed with the addition of wood flour alone and with nanoparticles. The advantages of using wood flour as a filler in the thermoset and thermoplastic polymers discussed, and its hybridization with various natural fibers was also discussed in the present study.

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Possibilities of using aluminate cements in high-rise construction

E3S Web of Conferences ◽

10.1051/e3sconf/20183302056 ◽

2018 ◽

Vol 33 ◽

pp. 02056

Author(s):

Maria Kaddo

Keyword(s):

Mechanical Properties ◽

Corrosion Resistance ◽

Service Life ◽

Portland Cement ◽

Physical And Mechanical Properties ◽

High Alumina ◽

Corrosion Resistant ◽

High Rise ◽

Aluminate Cement

The article describes preferable ways of usage of alternative binders for high-rise construction based on aluminate cements. Possible areas of rational use of aluminate cements with the purpose of increasing the service life of materials and the adequacy of the durability of materials with the required durability of the building are analyzed. The results of the structure, shrinkage and physical and mechanical properties of concrete obtained from dry mixes on the base of aluminate cements for self-leveling floors are presented. To study the shrinkage mechanism of curing binders and to evaluate the role of evaporation of water in the development of shrinkage was undertaken experiment with simple unfilled systems: gypsum binder, portland cement and «corrosion resistant high alumina cement + gypsum». Principle possibility of binder with compensated shrinkage based on aluminate cement, gypsum and modern superplasticizers was defined, as well as cracking resistance and corrosion resistance provide durability of the composition.

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