Interface reactions in microelectronic solder joints and associated intermetallic compounds: an investigation of their mechanical properties using nanoindentation

Author(s):  
H.-J. Albrecht ◽  
A. Juritza ◽  
K. Muller ◽  
W.H. Muller ◽  
J. Sterthaus ◽  
...  
2011 ◽  
Vol 687 ◽  
pp. 80-84
Author(s):  
Chang Hua Du ◽  
Hai Jian Zhao ◽  
Li Meng Yin ◽  
Fang Chen

As solder joints become increasingly miniaturized to meet the severe demands of future electronic packaging, the thickness of intermetallic compounds (IMC) in solder joint continuously decreases, while, the IMC proportion to the whole solder joint increases. So IMC plays a more and more important role in the reliability of microelectronic structure and microsystems. In this paper, the formation and growth behavior, along with the composition of IMC at the interface of Sn-based solders/Cu substrate in soldering were reviewed comprehensively. The effect of isothermal aging, thermal-shearing cycling and electromigration on the interfacial IMC growth and evolution were also presented. Furthermore, the formation mechanism of Kirkendall voids during thermal aging was introduced. In addition, the effect of the interfacial IMC on mechanical properties of solder joints was in-depth summarized. Adopting an appropriate flux to control the thickness of the IMC to improve the reliability of solder joints and electronic products was proposed in the end of this paper.


2010 ◽  
Vol 654-656 ◽  
pp. 2450-2454 ◽  
Author(s):  
De Kui Mu ◽  
Hideaki Tsukamoto ◽  
Han Huang ◽  
Kazuhiro Nogita

High-temperature lead-free solders are important materials for electrical and electronic devices due to increasing legislative requirements that aim at reducing the use of traditional lead-based solders. For the successful use of lead-free solders, a comprehensive understanding of the formation and mechanical properties of Intermetallic Compounds (IMCs) that form in the vicinity of the solder-substrate interface is essential. In this work, the effect of nickel addition on the formation and mechanical properties of Cu6Sn5 IMCs in Sn-Cu high-temperature lead-free solder joints was investigated using Scanning Electron Microscopy (SEM) and nanoindentation. It was found that the nickel addition increased the elastic modulus and hardness of the (Cu, Ni)6Sn5. The relationship between the nickel content and the mechanical properties of the IMCs was also established.


2010 ◽  
Vol 87 (11) ◽  
pp. 2416-2422 ◽  
Author(s):  
B.S.S. Chandra Rao ◽  
J. Weng ◽  
L. Shen ◽  
T.K. Lee ◽  
K.Y. Zeng

Materials ◽  
2021 ◽  
Vol 14 (13) ◽  
pp. 3560
Author(s):  
Tomasz Skrzekut ◽  
Grzegorz Boczkal ◽  
Adam Zwoliński ◽  
Piotr Noga ◽  
Lucyna Jaworska ◽  
...  

Zr-2.5Cu and Zr-10Cu powder mixtures were consolidated in the extrusion process and using the spark plasma sintering technique. In these studies, material tests were carried out in the fields of phase composition, microstructure, hardness and tensile strength for Zr-Cu materials at room temperature (RT) and 400 °C. Fractography analysis of materials at room temperature and 400 °C was carried out. The research took into account the anisotropy of the materials obtained in the extrusion process. For the nonequilibrium SPS process, ZrCu2 and Cu10Zr7 intermetallic compounds formed in the material at sintering temperature. Extruded materials were composed mainly of α-Zr and ZrCu2. The presence of intermetallic compounds affected the reduction in the strength properties of the tested materials. The highest strength value of 205 MPa was obtained for the extruded Zr-2.5Cu, for which the samples were cut in the direction of extrusion. For materials with 10 wt.% copper, more participation of the intermetallic phase was formed, which lowered the mechanical properties of the obtained materials. In addition to brittle intermetallic phases, the materials were characterized by residual porosity, which also reduced the strength properties.


Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 335
Author(s):  
Gyuwon Jeong ◽  
Dong-Yurl Yu ◽  
Seongju Baek ◽  
Junghwan Bang ◽  
Tae-Ik Lee ◽  
...  

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu–Sn IMCs, such as Cu6Sn5 and Cu3Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag3Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn–58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.


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