Multi-scale thermal stability of niobate-based lead-free piezoceramics with large piezoelectricity

2015 ◽  
Vol 3 (34) ◽  
pp. 8780-8787 ◽  
Author(s):  
Jin-Song Zhou ◽  
Ke Wang ◽  
Fang-Zhou Yao ◽  
Ting Zheng ◽  
Jiagang Wu ◽  
...  

Multi-scale thermal stability of (K,Na)NbO3-based perovskites with a high d33 of 430 pC N−1 is investigated, revealing the origin of its large piezoelectricity.

2017 ◽  
Vol 68 ◽  
pp. 152-158 ◽  
Author(s):  
L. Dimesso ◽  
C. Fasel ◽  
K. Lakus-Wollny ◽  
T. Mayer ◽  
W. Jaegermann

2016 ◽  
Author(s):  
Fabrizio Pucci ◽  
Marianne Rooman

AbstractDespite the intense efforts of the last decades to understand the thermal stability of proteins, the mechanisms responsible for its modulation still remain debated. In this investigation, we tackle this issue by showing how a multi-scale perspective can yield new insights. With the help of temperature-dependent statistical potentials, we analyzed some amino acid interactions at the molecular level, which are suggested to be relevant for the enhancement of thermal resistance. We then investigated the thermal stability at the protein level by quantifying its modification upon amino acid substitutions. Finally, a large scale analysis of protein stability - at the structurome level - contributed to the clarification of the relation between stability and natural evolution, thereby showing that the mutational profile of thermostable and mesostable proteins differ. Some final considerations on how the multi-scale approach could help unraveling the protein stability mechanisms are briefly discussed.


2019 ◽  
Vol 45 (8) ◽  
pp. 10304-10309 ◽  
Author(s):  
Mengye Yin ◽  
Chao Zhou ◽  
Shuai Ren ◽  
Yanshuang Hao ◽  
Minxia Fang ◽  
...  

2011 ◽  
Vol 4 (10) ◽  
pp. 4023 ◽  
Author(s):  
Zonghai Chen ◽  
Yan Qin ◽  
Yang Ren ◽  
Wenquan Lu ◽  
Christopher Orendorff ◽  
...  

2017 ◽  
Vol 29 (1) ◽  
pp. 49-53 ◽  
Author(s):  
Martin Durisin ◽  
Alena Pietrikova ◽  
Juraj Durisin ◽  
Karel Saksl

Purpose The paper aims to investigate the structure and thermal stability of newly developed lead-free Sn-based alloys which can be used as novel materials in the soldering of electronic components. Design/methodology/approach Rapid solidification was used to prepare the alloys. Findings The results showed that the microstructure of these solders exhibited uniform distribution and small-sized intermetallic compounds. Also, smaller crystalline size can be expected compared to commercially available counterparts. The analyses revealed a uniform and homogenous distribution of the small intermetallic particles of Cu6Sn5 and Ag4Sn in the microstructure of solders. The practical implications mean an improvement in mechanical properties and thermal stability of such solder joints, which is a precondition of low mechanical, thermo-mechanical stresses in their structure. Originality/value The originality lies in the production of these alloys by the melt spinning technique which was not previously used in the electronics industry.


RSC Advances ◽  
2019 ◽  
Vol 9 (60) ◽  
pp. 34888-34895
Author(s):  
Vineetha P ◽  
Roshan Jose ◽  
K. Venkata Saravanan

This work investigates and reports the effect of ZnO addition on the ferroelectric properties of (K0.5Na0.5)(Nb0.7Ta0.3)O3 (KNNT) ceramics prepared by a solid state reaction method.


2015 ◽  
Vol 6 (1) ◽  
Author(s):  
Victoria Latza ◽  
Paul A. Guerette ◽  
Dawei Ding ◽  
Shahrouz Amini ◽  
Akshita Kumar ◽  
...  

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